Specialty / Other Conductive Compounds Datasheets

Dow Corning 3-6605 Encapsulant Gray 13.6kg Kit -- 3-6605 COND ELAST 13.6KG
from Ellsworth Adhesives

Two part room-temperature or fast thermal cure silicone elastomer, variety of thermal conductivities; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress. Documentation: Dow Corning MSDS/TDS [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.8500
  • Type: Thermally Conductive
  • Tensile (Break): 850
Non-silicone, Polysynthetic-based Thermal Grease -- SARCON ® SG 07NS
from Fujipoly® America Corp.

Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflowable composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]

  • Chemical System: Polysynthetic
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Electronics; Semiconductors, IC's
LOCTITE ABLESTIK QMI536HT(BORON) (Known as Hysol QMI536HT) -- 8799542116353
from Henkel Corporation - Electronics

(Known as Hysol QMI536HT ). LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. [See More]

  • Chemical System: Boron Nitride Filled
  • Industry: Electronics
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.9000
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Type: Thermally Conductive
Low Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Chemical System: 100% Solids; Epoxy
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
CoroBond™ Conductive Vinyl Ester Primer
from Sherwin-Williams Protective & Marine Coatings

CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]

  • Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Single Component
3M™ Thermally Conductive Grease -- TCG-2031
from 3M Electronics Design & Manufacturing

Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. [See More]

  • Chemical System: Non-Silicone Resin
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Non-Curing
Elastomeric potting & encapsulating compound -- 20-2125
from Epoxies Etc...

20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]

  • Chemical System: Polyol, Isocyanate
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Chemical System: Modified Acrylic; Acrylic
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Form / Shape: Die Bonding Adhesives; Liquid
Insa-Lute Hi-Temp Cement -- No. 7
from Sauereisen, Inc.

Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]

  • Chemical System: Sodium Silicate Adhesive Cement; Ceramic
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid; Encapsulant or Conformal Coating

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