Emerson and Cuming STYCAST 2850 Encapsulant Black 1 gal -- 2850FT FR BLACK 18LB
from Ellsworth Adhesives

Henkel Production Transfer STYCAST 2850 FT-FR is a two component, thermally conductive, fire retardant, epoxy encapsulant; it has a low coefficient of thermal expansion and excellent electrical insulative properties. Cures with Catalyst 9 , not included. 18 lb Gallon. Sold as case (4/case). [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Features: Flame Retardant; Dissimilar Substrates
  • Chemical System: 100% Solids; Epoxy
  • Type: Electrically Conductive (optional feature)
  • Composition: Unfilled
Silicone Encapsulant -- SEMICOSIL® 205
from Wacker Chemical Corp.

SEMICOSIL ® 205 is an addition curing RTV-2 silicone rubber. Special characteristics. Low viscosity. Soft rubber. Excellent primerless adhesion. Flame retardant, UL 94V-0. Application. SEMICOSIL ® 205 is a silicone potting encapsulant designed for use in the electronics industry. [See More]

  • Features: Flame Retardant
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Features: Flame Retardant; Non-corrosive; Flexible
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Castor/MDI; Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Epoxy Encapsulant -- PNE-40610AB
from Protavic America, Inc.

No primers, excellent adhesion, pot life at room temperature about 6 hours [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Features: Flame Retardant; Dissimilar Substrates
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled