from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Features: Flame Retardant; Non-corrosive; Flexible
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Ellsworth Adhesives
Henkel Production Transfer STYCAST 2850 FT-FR is a two component, thermally conductive, fire retardant, epoxy encapsulant; it has a low coefficient of thermal expansion and excellent electrical insulative properties. Cures with Catalyst 9 , not included. 18 lb Gallon. Sold as case (4/case). [See More]
- Features: Flame Retardant
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Thermoset; Two Component
- Type: Thermally Conductive
- Form / Shape: Liquid
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Features: Flame Retardant; UL Rating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: Flame Retardant; Dissimilar Substrates
- Chemical System: 100% Solids; Epoxy
- Type: Electrically Conductive (optional feature)
- Composition: Unfilled
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Features: Flame Retardant; UL Rating; Dissimilar Substrates
- Chemical System: Acrylic
- Type: Thermally Conductive
- Form / Shape: Die Bonding Adhesives
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Features: Flame Retardant; Dissimilar Substrates
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Wacker Chemical Corp.
SEMICOSIL ® 205 is an addition curing RTV-2 silicone rubber. Special characteristics. Low viscosity. Soft rubber. Excellent primerless adhesion. Flame retardant, UL 94V-0. Application. SEMICOSIL ® 205 is a silicone potting encapsulant designed for use in the electronics industry. [See More]
- Features: Flame Retardant
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Features: Flame Retardant; UL Rating
- Chemical System: Castor/MDI; Polyurethane
- Type: Thermally Conductive
- Composition: Filled
from Protavic America, Inc.
No primers, excellent adhesion, pot life at room temperature about 6 hours [See More]
- Features: Flame Retardant
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
