Flame Retardant (e.g. UL 94 Rated) Conductive Compounds Datasheets

Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Features: Anti-static, ESD (optional feature); EMI/RFI Shielding (optional feature); Phase Change (optional feature); Flame Retardant (optional feature); Non-corrosive; Flexible (optional feature); UL Rating (optional feature); Solvent Based (optional feature); Water Based  (optional feature); Dissimilar Substrates
  • Chemical System: Polyphenylene Sulfide (optional feature); Polyurethane (optional feature); Polypropylene (optional feature); Silicone (optional feature); Ceramic (optional feature); Epoxy (optional feature); Alkyd (optional feature); Polyethylene (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature); Phenolic (optional feature); Polyamide (optional feature); Vinyl (optional feature); Elastomeric (optional feature); Acrylic (optional feature)
  • Type: Electrically Conductive (optional feature); Thermally Conductive (optional feature)
  • Composition: Unfilled; Filled (optional feature)
Silicone Encapsulant -- SEMICOSIL® 205
from Wacker Chemical Corp.

SEMICOSIL ® 205 is an addition curing RTV-2 silicone rubber. Special characteristics. Low viscosity. Soft rubber. Excellent primerless adhesion. Flame retardant, UL 94V-0. Application. SEMICOSIL ® 205 is a silicone potting encapsulant designed for use in the electronics industry. [See More]

  • Features: Flame Retardant
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Fast Gelling Polyurethane Compound -- 50-2370
from Epoxies Etc...

50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]

  • Features: Flame Retardant
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy Encapsulant -- PNE-40610AB
from Protavic America, Inc.

No primers, excellent adhesion, pot life at room temperature about 6 hours [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Features: Flame Retardant; Dissimilar Substrates
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled