from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Form / Shape: Die Bonding Adhesives; Gel
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Ellsworth Adhesives
Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Gel
- Chemical System: Acrylic
- Type: Thermally Conductive
- Composition: Unfilled
from ITW Polymer Technologies - Insulcast Division
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Form / Shape: Die Bonding Adhesives
- Chemical System: Acrylic
- Type: Thermally Conductive
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Electronics
For bonding temperature sensitive components [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Form / Shape: Die Bonding Adhesives
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Two Component
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Form / Shape: Die Bonding Adhesives; Liquid
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
