from Ellsworth Adhesives
Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Gel
- Chemical System: Acrylic
- Type: Thermally Conductive
- Composition: Unfilled
from ITW Polymer Technologies - Insulcast Division
RRTVS 42 CURTIS II is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. RTVS 42 CURTIS II contains silane adhesion promoters that enable it to bond well to most metals and plastics. Its unique... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
- Chemical System: Silicone; Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Quist Electronics
Ultra-conforming, designed for fragile and low-stress applications [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid; Powder
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Electronics
For bonding temperature sensitive components [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Gel; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled