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Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Gel
  • Chemical System: Acrylic
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal -- TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
RTVS 42 CURTIS II Silicone-Epoxy Copolymer Potting/Casting Compound
from ITW Polymer Technologies - Insulcast Division

RRTVS 42 CURTIS II is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. RTVS 42 CURTIS II contains silane adhesion promoters that enable it to bond well to most metals and plastics. Its unique... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Silicone; Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Electrically Conductive Adhesive -- 5420
from Henkel Corporation - Electronics

For bonding temperature sensitive components [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Silicone
  • Type: Electrically Conductive
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel; Grease, Paste
  • Chemical System: Modified Acrylic; Acrylic
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled