Specialty / Other Conductive Compounds Datasheets

Henkel Loctite GC 10 Solder Paste -- Gray 500 g Jar
from Ellsworth Adhesives

Henkel Loctite GC 10 Solder Paste offers excellent solderability on challenging surface finishes. It features halogen-free flux, low voiding, and fine pitch capability. It provides long term stability over a wide range of temperature conditions. 500 g Jar. [See More]

  • Type: Electrically Conductive
  • Form / Shape: Paste
  • Cure / Technology: Single Component
  • Industry: Electronics
Extremely Compressible Gap Filler -- SARCON® PG80A
from Fujipoly® America Corp.

Highly Conformable and Non-Flammable, Higher Thermal interface materials. SARCON ® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammableinterface materials. The surface consistency is excellent for filling small air gaps and uneven... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.0787
ACHESON ELECTRODAG 5915 -- 8799582519297
from Henkel Corporation - Electronics

ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. [See More]

  • Type: Electrically Conductive
  • Viscosity: 120000
  • Industry: Electronics
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Ribbon
  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Type: Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Sputtering Targets -- Silver Epoxy Bonding Cement
from Materion Corporation

Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength. [See More]

  • Type: Electrically Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Resin; Die Bonding Adhesives; Powder

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