Thermoplastic / Hot Melt Conductive Compounds Datasheets
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30R is a fiber reinforced, high viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Electrically Conductive
- Form / Shape: Die Bonding Adhesives; Liquid