Fiber Reinforced, Two Component Epoxy Adhesive -- EP30R
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30R is a fiber reinforced, high viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid
Thermal Management Adhesive -- QMI 4030 LD
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Composition: Filled
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid