Techspray Silicone Free Heat Sink Compound 4 oz Aerosol -- 1978-DP
from Ellsworth Adhesives

Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk). [See More]

  • Cure / Technology: Does Not Harden
  • Composition: Filled
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Cure / Technology: Solder
  • Form / Shape: Ribbon
  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Cure / Technology: Non-Drying
  • Form / Shape: Gel
  • Type: Electrically Conductive
  • Industry: Electronics; Electric Power
3M™ Thermally Conductive Grease -- TCG-2031
from 3M Electronics Design & Manufacturing

Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. [See More]

  • Cure / Technology: Single Component; Non-Curing
  • Chemical System: Non-Silicone Resin
  • Type: Thermally Conductive
  • Composition: Filled