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Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: Thermally Conductive
  • Industry: Electronics
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Heat Transfer Compound -- T-802-G
from Thermon Manufacturing Co.

T-802 is a two-part low to medium temperature resin-based heat transfer compound for use in moist and corrosive environments. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating the air voids that would... [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Corrosive / Moist Environments
RTV-2 Silicone Rubber -- ELASTOSIL® RT 675
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. Special features. two-part, 1 : 1 mixing ratio. very high hardness Shore A. excellent heat stability. high thermal conductivity. Application. encapsulation of electrical components [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
  • Form / Shape: Liquid
3M™ Thermally Conductive Adhesive -- TC-2707
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Epoxy Conductive Adhesive + Hardener -- CW2400 [CW2400 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CW2400 is a two-part conductive epoxy for precision repair and high-strength conductive bonding. [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Type: Electrically Conductive; Thermally Conductive
  • Industry: Electronics
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Electrically Conductive Adhesive -- 3882
from Henkel Corporation - Electronics

For bonding temperature sensitive components [See More]

  • Cure / Technology: Thermoset; Two Component  ; Single Component
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Modified Acrylic; Acrylic
  • Type: Thermally Conductive
  • Composition: Unfilled
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled