Low Viscosity, Two Component Epoxy -- EP30-2SP
from Master Bond, Inc.

Master Bond Polymer System EP30-2SP is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/25 mix ratio by weight. This resin system is 100% reactive and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Optical; Semiconductors, IC's; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Silver Filled Epoxy Resin -- 40-3900
from Epoxies Etc...

40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature... [See More]

  • Industry: Electronics; Photonics; Optical
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled