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UHD Series
from Amphenol Aerospace Corporation

Amphenol's wide range of board level interconnects also includes high density UHD (Ultra High Density) Series module and backplane connectors. These utilize fork and blade contacts in a staggered grid pattern for attachment to printed circuit boards. The taggered pattern is 80 contacts per inch,... [See More]

  • Features: Press-fit / Solderless Technology
  • Gender: Male (optional feature); Female (optional feature)
  • Connector Type: Header
  • Number of Contacts: 292 to 680
Board Level Interconnects -- HiLinX2.54 Series
from Amphenol PCD

Amphenol has engineered a complete range of high & medium density, staggered grid, modular connectors with both 1.905x1.905[.075x.075] & 2.54x2.54 [.100x.100] pitches. The HiLinX range provides a unique choice of solutions by allowing a mix of various contact types: signal, power, fiber... [See More]

  • Features: Environment Resistant; Press-fit / Solderless Technology (optional feature)
  • Geometry: Straight (optional feature); RightAngle (optional feature)
  • Gender: Male; Female
  • Contact Rows: Dual; Triple Row
1628941 [1740259-1 from TE Connectivity]
from Farnell Europe

This connector is designed to connect two boards together [See More]

  • Features: Press-fit / Solderless Technology
  • Gender: Male; Female
  • Connector Type: Blade and Receptacle
  • Current Rating: 5.0
Backplane Connectors, 1.80 mm (0.071 in.), ZipLine® Backplane, Style=Signal Header, Backplane -- 10076197-101LF
from FCI

6-Pair 12 IMLA Vertical Backplane 2 Wall Header [See More]

  • Features: Press-fit / Solderless Technology
  • Geometry: Vertical
  • Connector Type: Header
  • Number of Contacts: 216