Features:Other RF and Microwave Laminates Datasheets

Embedded Capacitance Material -- FaradFlex®
from Oak-Mitsui, Inc.

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Features: Dielectric / Insulating; UL 94V. UL746; Embedded Passives; IPC; UL Listed
  • Thickness: 3.15E-4 to 9.84E-4
  • Materials: Metal Foil; Plastic / Polymer; Copper Foil
  • Temperature Resistance: 125 to 160
High Performance Laminate -- CER-10 (0.0620)
from Taconic

Taconic Advanced Dielectric Division manufactures PTFE/woven glass base materials for microwave, RF and high speed digital applications. [See More]

  • Features: Dielectric / Insulating; Optional Copper Cladding; UL Listed
  • Thickness: 0.0250 to 0.1250
  • Materials: Fluoropolymer (Teflon); Cloth / Fabric; Fiberglass / Glass
  • Width: 12 to 18