Tested to IPC RF and Microwave Laminates Datasheets
from Oak-Mitsui, Inc.
When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]
- Features: Dielectric / Insulating; UL 94V. UL746; Embedded Passives; IPC; UL Listed
- Thickness: 3.15E-4 to 9.84E-4
- Materials: Metal Foil; Plastic / Polymer; Copper Foil
- Temperature Resistance: 125 to 160