Circuit Board Tape -- DW 904-1
from DeWAL Industries, Inc.

DW 904-1 uses 1 mil polyester film coated with silicone adhesive. The silicone adhesive will release cleanly. This tape product is transparent for applications where optical clarity is important. APPLICATION INFORMATION. These tapes are used in masking metal parts during bonding or mild acid... [See More]

  • Features: Dielectric / Insulating
  • Thickness: 1.00E-3
  • Materials: Plastic / Polymer; Polyester
  • Width: 0.2500 to 17
Embedded Capacitance Material -- FaradFlex®
from Oak-Mitsui, Inc.

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Features: Embedded Passives; IPC; UL 94V. UL746; UL Listed; Dielectric / Insulating
  • Materials: Copper Foil; Metal Foil; Plastic / Polymer
  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 3.15E-4 to 9.84E-4
Copper PEN Laminates -- Penclad™ G1910
from Sheldahl - A Multek Brand

Sheldahl Penclad G1910 products use our proprietary flame-retardant, high temperature, clear, modified epoxy adhesive to bond PEN film and copper foil, creating a single or double sided composite. G1910 laminates are engineered for use in thin flex c [See More]

  • Features: IPC; Chemical Resistant; Dielectric / Insulating
  • Materials: Copper Foil; Metal Foil; Plastic / Polymer; Polyolefin (PE, HDPE, PP)
  • Type: Film / Flexible; Rigid
  • Thickness: 0.0026 to 0.0046
TacLam® & TacPreg® -- TLG-29
from Taconic

Enables manufacture of 20+ layer PWBs at FR-4 temperatures & pressures. Alternative to thermoplastic films in military multilayer printed circuit boards [See More]

  • Features: Fast Signal Propagation Speed; UL Listed; Dielectric / Insulating
  • Materials: Cloth / Fabric; Fluoropolymer (Teflon); Fiberglass / Glass
  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 0.0100 to ?