Embedded Capacitance Material -- FaradFlex®
from Oak-Mitsui, Inc.

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Features: Embedded Passives; IPC; UL 94V. UL746; UL Listed; Dielectric / Insulating
  • Materials: Copper Foil; Metal Foil; Plastic / Polymer
  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 3.15E-4 to 9.84E-4
TacLam® & TacPreg® -- TLG-29
from Taconic

Enables manufacture of 20+ layer PWBs at FR-4 temperatures & pressures. Alternative to thermoplastic films in military multilayer printed circuit boards [See More]

  • Features: Fast Signal Propagation Speed; UL Listed; Dielectric / Insulating
  • Materials: Cloth / Fabric; Fluoropolymer (Teflon); Fiberglass / Glass
  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 0.0100 to ?