Tested to IPC Printed Circuit Substrate Materials (PCB / PWB) Datasheets
from Oak-Mitsui, Inc.
When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]
- Features: Embedded Passives; IPC; UL 94V. UL746; UL Listed; Dielectric / Insulating
- Materials: Copper Foil; Metal Foil; Plastic / Polymer
- Type: Rigid (optional feature); RF / Microwave
- Thickness: 3.15E-4 to 9.84E-4