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Embedded Capacitance Material -- FaradFlex®
from Oak-Mitsui, Inc.

When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex ® is the solution!. Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package [See More]

  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 3.15E-4 to 9.84E-4
  • Materials: Copper Foil; Metal Foil; Plastic / Polymer
  • Temperature Resistance: 125 to 160
Copper PEN Laminates -- Penclad™ G1910
from Sheldahl - A Multek Brand

Sheldahl Penclad G1910 products use our proprietary flame-retardant, high temperature, clear, modified epoxy adhesive to bond PEN film and copper foil, creating a single or double sided composite. G1910 laminates are engineered for use in thin flex c [See More]

  • Type: Film / Flexible; Rigid
  • Thickness: 0.0026 to 0.0046
  • Materials: Copper Foil; Metal Foil; Plastic / Polymer; Polyolefin (PE, HDPE, PP)
  • Width: 24
TacLam® & TacPreg® -- TLG-29
from Taconic

Enables manufacture of 20+ layer PWBs at FR-4 temperatures & pressures. Alternative to thermoplastic films in military multilayer printed circuit boards [See More]

  • Type: Rigid (optional feature); RF / Microwave
  • Thickness: 0.0100 to ?
  • Materials: Cloth / Fabric; Fluoropolymer (Teflon); Fiberglass / Glass
  • Width: 12 to 24