ELAN-Guard® -- EM 59-37MR
from ELANTAS PDG, Inc.

Water-borne epoxy emulsion - dip-and-bake impregnating resin [See More]

  • Composition: Single Component; Unfilled; Water Based 
  • Form / Shape: Liquid
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic
  • Chemical System: Epoxy
INSULCAST 781 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 781 is a clear, one-component, flexible, heat cure epoxy system designed for coil impregnation, and potting applications requiring low viscosity and minimal thermal stress. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Substrate Compatibility: Plastic
  • Chemical System: Epoxy
Epoxy For Bonding Treated Fluropolymers -- EP19M
from Master Bond, Inc.

Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy; 100% Solids
  • Substrate Compatibility: Fluoropolymer/Difficult to Bond Surfaces
  • Cure / Technology: Thermoset
Silicone Impregnation Resin -- SILRES® H62 C
from Wacker Chemical Corp.

ES ® H62 C is a solvent-free, liquid silicone resin which is cured by heat. Special features. is a methylphenylvinylhydrogen polysiloxane not modified with organic components;. is of very low volatility (suitable for vacuum pressure impregnation);. is cured by heat through catalysed... [See More]

  • Composition: Single Component
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
One component moisture cure urethane -- 10-2000
from Epoxies Etc...

10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding. and laminating. It may also be used to impregnate glass cloth and create a pipe repair. system. FEATURES: • Solvent Free. • No Mixing Required. • Resists Moisture, Solvents and Heat. • High... [See More]

  • Composition: Single Component
  • Form / Shape: Grease, Paste
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Chemical System: Polyurethane
Hernon Porosity Sealant™ -- 1000
from Hernon Manufacturing, Inc.

HERNON Porosity Sealant (HPS) is the solution to leak proofing of parts. HPS offers improved machinability and surface quality for painting and plating. The hardened resins exhibit superior chemical resistance and elevated temperature stability. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Substrate Compatibility: Metal; Plastic; Porous Surfaces
  • Chemical System: Acrylic; Dimethacrylate Blend
Electro-Conductive Epoxy Varnish -- BCE-30370 (formerly C 370)
from Protavic America, Inc.

Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the "gold" standard for flexible termination. Solvent adjusted. Please contact us for product... [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Grease, Paste
  • Substrate Compatibility: Metal
  • Chemical System: Epoxy