ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Flexible; Non-corrosive; UL Rating
  • Chemical System: Alkyd
  • Form / Shape: Liquid
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Epoxy For Bonding Treated Fluropolymers -- EP19M
from Master Bond, Inc.

Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high... [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy; 100% Solids
  • Substrate Compatibility: Fluoropolymer/Difficult to Bond Surfaces
  • Cure / Technology: Thermoset
Hernon Porosity Sealant™ -- 1000
from Hernon Manufacturing, Inc.

HERNON Porosity Sealant (HPS) is the solution to leak proofing of parts. HPS offers improved machinability and surface quality for painting and plating. The hardened resins exhibit superior chemical resistance and elevated temperature stability. [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change
  • Form / Shape: Liquid
  • Substrate Compatibility: Metal; Plastic; Porous Surfaces
  • Chemical System: Acrylic; Dimethacrylate Blend
Electric Resistor Cement -- Nos.78 and P-78
from Sauereisen, Inc.

Sauereisen Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces. insulating varnish, enamel, mica, etc. The cement is also available in powder form known as Sauereisen... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid (optional feature); Powder (optional feature)
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Chemical System: Ceramic