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Advantages of using LCP based pre-molded leadframe packages for RF & MEMS applications
Description: This presentation will look at some of the stages of the development of MEMS packa ges, already engineered to suit robust, high-volume applications. It will detail some of the necessary test processes


Adapting Press-Fit Technology - White Paper
Description: Press-Fit Technology has been widely used in the telecom and industrial markets for over 50 years. The Press-Fit Technology available for those markets works well in most non-mobile, controlled


Determining PTH Integrity with Cross-Section Analysis
Description: Maintaining PTH integrity is one of the most important factors to assure success with press-fit interconnects. Cross-section analysis is used to prove the basic integrity of press-fit pins for use


Next Generation AdvancedTCA
PDF from: Schroff
Description: Rapidly changing technological developments result in rapidly changing customer requirements. Companies must quickly recognize and respond to these trends to meet customers' needs. A further advantage


Transform Your Business for Growth and Profitability in the Cloud
PDF from: Schroff
Description: PICMG and VITA compliant solutions - minimize development costs and time-to-market


Press-Fit Current Carrying Capacity - Part 2
Description: The bottom line is that press-fit zone interconnects are now capable of providing significantly higher current carrying capacities than previously assumed and can deliver reliable operating current


MEMS: A Brief Overview
Web article from: Mouser Electronics, Inc.
Description: Microelectromechanical systems (MEMS), also known as microsystems technology in Europe, or micromachines in Japan, are a class of devices characterized both by their small size and the manner in which


ASSEMBLED vs OVERMOLDED CORDSETS
PDF from: TURCK Inc.
Description: Connectivity serves as a cornerstone for industrial automation environments, delivering continuous production, data acquisition and communication throughout the enterprise. With the need to monitor,


SMT Card-Edge Solutions: Part 1: Application Requirements
Description: Combining the advantages of highly-automated SMT processing and proven solderfree press-fit technologies now offers a cost-effective solution to the growing needs for efficient, design-friendly and


SMT Card-Edge Solutions: Part 2: Specifications & Design Considerations
Description: Combining the special advantages of both highly-automated SMT processing and proven solder-free press-fit technologies enables creation of cost-effective, production-ready solutions for streamlining


Valtronic Technologies: Manufacturing Miniaturized Sensors and Devices
Web article from: Valtronic
Description: Using miniaturized electronics for advanced Medical Applications


PCB Design for Manufacturability
PDF from: Altron, Inc.
Description: This document is intended to be used as a guide in the engineering and layout of printed wiring boards and assemblies. Guidelines are presented to aid in the design of manufacturable and reliable


Contract Manufacturing Design for Testability
PDF from: Altron, Inc.
Description: There are 3 major characteristics of SMT boards that have an impact on test strategy. * Production process may include additional steps which naturally will lead to more faults. * SMT boards will


Outsourcing Production and Managing Inventory for a Police, Fire
PDF from: Safco LLC
Description: A large manufacturer of police, fire and safety lighting products wanted to implement an aggressive inventory management program tied to system generated forecasts and weekly release schedules. In


Key Considerations for Implementing SBL Applications
Description: With conventional soldering processes, the two metal components to be joined are first brought into position and mechanically held in place. Then flux and solder are applied to the conjoined parts,