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			<title>GlobalSpec - Engineering News - Programmable Logic DesignLine - News</title>
			<link>http://www.globalspec.com/engnews/</link>
			<description>GlobalSpec - Engineering News - Programmable Logic DesignLine - News</description>
			<copyright>Copyright 2006</copyright>
			<pubDate>Tue, 18 Jun 2013 23:36:10 EST</pubDate>
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			<title><![CDATA[China takes fastest supercomputer crown]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416551%2FChina%2Dtakes%2Dfastest%2Dsupercomputer%2Dcrown]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:10 EST</pubDate>
			<description><![CDATA[China&apos;s National University of Defense Technology won the fastest supercomputer in the world contest sponsored by the Top500 List. View the full article HERE.]]></description>
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			<title><![CDATA[FDSOI helps ST, Rambus reach IP settlement]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416576%2FFDSOI%2Dhelps%2DST%2D%2DRambus%2Dreach%2DIP%2Dsettlement]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:09 EST</pubDate>
			<description><![CDATA[Agreement covers FDSOI design, security, memory and interface technologies and settles all outstanding claims. View the full article HERE.]]></description>
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			<title><![CDATA[Bluetooth Arduino project seeks funds]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416617%2FBluetooth%2DArduino%2Dproject%2Dseeks%2Dfunds]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:08 EST</pubDate>
			<description><![CDATA[Engineers from Michigan are trying to raise $80,000 for Bluetooth-enabled Arduino boards that will allow smartphones to be used to control project hardware.View the full article HERE.]]></description>
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			<title><![CDATA[BlackBerry''s turnaround hinges on Q10]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416651%2FBlackBerry%2Ds%2Dturnaround%2Dhinges%2Don%2DQ10]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:07 EST</pubDate>
			<description><![CDATA[Strong early sales of the keyboard-packing Q10 give BlackBerry&apos;&apos;s resurrection a chance.View the full article HERE.]]></description>
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			<title><![CDATA[Nvidia to license graphics IP to other chip vendors]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416655%2FNvidia%2Dchanges%2Dcourse]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:07 EST</pubDate>
			<description><![CDATA[Offerings include the current Kepler GPU product family as well as the modem technology Nvidia acquired from Icera a few years back. View the full article HERE.]]></description>
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			<title><![CDATA[IoT will be next silver screen, says media exec]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416661%2FIoT%2Dwill%2Dbe%2Dnext%2Dsilver%2Dscreen%2D%2Dsays%2Dmedia%2Dexec]]></link>
			<pubDate>Tue, 18 Jun 2013 23:36:06 EST</pubDate>
			<description><![CDATA[The Internet of Things could become the next big entertainment platform, said a media exec at a conference with Silicon Valley techies at Stanford.View the full article HERE.]]></description>
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			<title><![CDATA[Atmel pays Infineon over MCU patent dispute]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416397%2FAtmel%2Dpays%2DInfineon%2Dover%2DMCU%2Dpatent%2Ddispute]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:45 EST</pubDate>
			<description><![CDATA[After two years of legal wrangling U.S. based microcontroller company pays up over allegedly infringing 11 patents.View the full article HERE.]]></description>
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			<title><![CDATA[Mellanox adds Danish firm to buying spree]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416405%2FMellanox%2Dadds%2DDanish%2Doptical%2DIC%2Dfirm%2Dto%2Dbuying%2Dspree]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:44 EST</pubDate>
			<description><![CDATA[High-speed interconnect provider adds to offering with plan to acquire Denmark&apos;&apos;s IPtronics for its optical transceivers.View the full article HERE.]]></description>
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			<title><![CDATA[AMS marks down 2013 revenue on order delays]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416411%2FAMS%2Dmarks%2Ddown%2D2013%2Drevenue%2Don%2Dorder%2Ddelays]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:44 EST</pubDate>
			<description><![CDATA[Austrian analog IC and sensor vendor has lowered its growth estimate for 2013 because certain customers are pushing orders out. The company has also lost its CEO who has stood down.View the full article HERE.]]></description>
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			<title><![CDATA[Energy-harvesting shock absorbers coming to a car near you]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416431%2FEnergy%2Dharvesting%2Dshock%2Dabsorbers%2Dcoming%2Dto%2Da%2Dcar%2Dnear%2Dyou]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:43 EST</pubDate>
			<description><![CDATA[With solar and wind harvesting technologies thriving, researchers are seeking other energy sources for which they can create harvesting devices. View the full article HERE.]]></description>
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			<title><![CDATA[Intel eDRAM attacks graphics in pre-3-D IC days]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416439%2FIntel%2DeDRAM%2Dattacks%2Dgraphics%2Din%2Dpre%2D3%2DD%2DIC%2Ddays]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:43 EST</pubDate>
			<description><![CDATA[Intel shared insights into its eDRAM technology, expected to challenge discrete graphics sockets in high end notebooks this year.View the full article HERE.]]></description>
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			<title><![CDATA[What do IBM layoffs mean for New York''s chip initiative?]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416440%2FWhat%2Ddo%2DIBM%2Dlayoffs%2Dmean%2Dfor%2DNew%2DYork%2Ds%2Dchip%2Dinitiative%2D]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:42 EST</pubDate>
			<description><![CDATA[Big Blue is being tight lipped as usual about how many employees are getting the ax, but at least some of the jobs being cut are in semiconductor R&amp;D. View the full article HERE.]]></description>
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			<title><![CDATA[Smartphone demand makes Spreadtrum guidance soar]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416470%2FSmartphone%2Ddemand%2Dmakes%2DSpreadtrum%2Dguidance%2Dsoar]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:42 EST</pubDate>
			<description><![CDATA[Demand for smartphone chips from Chinese fabless chip vendor causes it to provide a major uplift to Q2 sales guidance.View the full article HERE.]]></description>
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			<title><![CDATA[Small cells gaining traction in cellular nets]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416532%2F%2DSmall%2Dcells%2Dgaining%2Dtraction%2Din%2Dcellular%2Dnets]]></link>
			<pubDate>Mon, 17 Jun 2013 23:24:42 EST</pubDate>
			<description><![CDATA[AT&amp;T, Vodaphone and other carriers are rolling out their first small cell deployments thanks in part to advances in backhaul and baseband SoCs.View the full article HERE.]]></description>
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			<title><![CDATA[Apple weighs larger iPhones]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416346%2FApple%2Dweighs%2Dlarger%2DiPhones]]></link>
			<pubDate>Fri, 14 Jun 2013 01:39:32 EST</pubDate>
			<description><![CDATA[Apple iPhone 5S on track for fall 2013 debut, while Apple tests iPhones with 4.7- and 5.7-inch screens for next year, reports say.View the full article HERE.]]></description>
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			<title><![CDATA[Nokia, Qualcomm invest in array camera startup]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416351%2FNokia%2DQualcomm%2Dinvest%2Din%2Darray%2Dcamera%2Dstartup]]></link>
			<pubDate>Fri, 14 Jun 2013 01:39:32 EST</pubDate>
			<description><![CDATA[Pelican Imaging has secured $20 million in funding from Qualcomm Ventures, Nokia Growth Partners and current investors.View the full article HERE.]]></description>
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			<title><![CDATA[Solid state memory gains on HDDs]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416353%2FSolid%2Dstate%2Dmemory%2Dgains%2Don%2DHDDs]]></link>
			<pubDate>Fri, 14 Jun 2013 01:39:31 EST</pubDate>
			<description><![CDATA[Flash memory is increasingly posing a challenge to the hard disk drive in PCs and enterprise servers in the datacenter.View the full article HERE.]]></description>
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			<title><![CDATA[Software exam gets low grade in first test]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416387%2FSoftware%2Dexam%2Dgets%2Dlow%2Dgrade%2Din%2Dfirst%2Dtest]]></link>
			<pubDate>Fri, 14 Jun 2013 01:39:31 EST</pubDate>
			<description><![CDATA[Only 12 people took the first exam given in the U.S. to license software engineers for work on safety-critical systems, and only six passed it.View the full article HERE.]]></description>
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			<title><![CDATA[Silicon Labs makes IoT play with Energy Micro buy]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415906%2FSilicon%2DLabs%2Dmakes%2DIoT%2Dplay%2Dwith%2DEnergy%2DMicro%2Dbuy]]></link>
			<pubDate>Thu, 13 Jun 2013 01:28:12 EST</pubDate>
			<description><![CDATA[Mixed signal and wireless company has persuaded serial entrepreneur Geir Forre to flip his microcontroller startup for up to $170 million as they set off together in pursuit of the Internet of Things market.View the full article HERE.]]></description>
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			<title><![CDATA[Broadcom hits tera-ops with comms processor]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416190%2FBroadcom%2Dhits%2Dtera%2Dops%2Dwith%2Dcomms%2Dprocessor]]></link>
			<pubDate>Thu, 13 Jun 2013 01:28:10 EST</pubDate>
			<description><![CDATA[Broadcom&apos;&apos;s former NetLogic group leapfrogged rival Cavium by sampling the first comms processor to handle a trillion operations per second.View the full article HERE.]]></description>
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			<title><![CDATA[Texas Instruments plans to boost China manufacturing]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416252%2FTexas%2DInstruments%2Dplans%2Dto%2Dboost%2DChinese%2Dmanufacturing]]></link>
			<pubDate>Thu, 13 Jun 2013 01:28:09 EST</pubDate>
			<description><![CDATA[U.S. chipmaker plans to expand manufacturing at its Chengdu wafer fab with the support of Chinese authorities View the full article HERE.]]></description>
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			<title><![CDATA[DARPA kicking off Virtual Robotics Challenge]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416276%2FDARPA%2Dkicking%2Doff%2DVirtual%2DRobotics%2DChallenge]]></link>
			<pubDate>Thu, 13 Jun 2013 01:28:08 EST</pubDate>
			<description><![CDATA[The Defense Advance Research Projects Agency is staging a competition among 18 teams trying building more advanced search and rescue robots. View the full article HERE.]]></description>
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			<title><![CDATA[Data center demand drives silicon photonics to market]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4416278%2FData%2Dcenter%2Ddemand%2Ddrives%2Dsilicon%2Dphotonics%2Dto%2Dmarket]]></link>
			<pubDate>Thu, 13 Jun 2013 01:28:08 EST</pubDate>
			<description><![CDATA[After a decade of research, conversion of electrical signals to light for high speed transmission is edging into productionView the full article HERE.]]></description>
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			<title><![CDATA[NASA''s ''PhoneSat'' program points to satellites of the future]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415930%2FNASA%2Ds%2D%2DPhoneSat%2D%2Dprogram%2Dpoints%2Dto%2Dsatellites%2Dof%2Dthe%2Dfuture]]></link>
			<pubDate>Wed, 12 Jun 2013 01:42:13 EST</pubDate>
			<description><![CDATA[After putting into orbit satellites based on an off-the-shelf smartphone, NASA looks at future for lower-cost spacecraft. View the full article HERE.]]></description>
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			<title><![CDATA[MEMS startup wins strategic investment]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416105%2FMEMS%2Dstartup%2Dwins%2Dstrategic%2Dinvestment]]></link>
			<pubDate>Wed, 12 Jun 2013 01:42:12 EST</pubDate>
			<description><![CDATA[While many bemoan a lack of investment capital for fabless chip companies, firms involved in the microelectromechanical systems sector continue to get funded.View the full article HERE.]]></description>
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			<title><![CDATA[AMD tips 5 GHz gamer CPU, filling Haswell hole]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416141%2FAMD%2Dtips%2D5%2DGHz%2Dgamer%2DCPU%2D%2Dfilling%2DHaswell%2Dhole]]></link>
			<pubDate>Wed, 12 Jun 2013 01:42:11 EST</pubDate>
			<description><![CDATA[Intel failed to field an overclocked x86 for gamers with its Haswell launch last week, a gap AMD says it will fill with a 5 GHz part this summer.View the full article HERE.]]></description>
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			<title><![CDATA[TSMC''s sales stay strong in May]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4416142%2FTSMC%2Ds%2Dsales%2Dstay%2Dstrong%2Din%2DMay]]></link>
			<pubDate>Wed, 12 Jun 2013 01:42:10 EST</pubDate>
			<description><![CDATA[May chip sales at leading foundry chip maker came off the booming levels seen in April but were still up 17.2 percent over 2012.View the full article HERE.]]></description>
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			<title><![CDATA[Altera tips plans for 20, 14nm FPGAs in 2014]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415929%2FAltera%2Dtips%2Dplans%2Dfor%2D20%2D%2D14nm%2DFPGAs%2Din%2D2014]]></link>
			<pubDate>Tue, 11 Jun 2013 01:46:09 EST</pubDate>
			<description><![CDATA[Stratix 10 FPGAs made in Intel&apos;s 14nm process will sample early next year, packing up to four million logic elements and running at a GHz.View the full article HERE.]]></description>
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			<title><![CDATA[Sensor network designs win IoT contest]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415926%2FSensor%2Dnetwork%2Ddesigns%2Dwin%2DIoT%2Dcontest]]></link>
			<pubDate>Sat, 08 Jun 2013 01:25:17 EST</pubDate>
			<description><![CDATA[A wireless door lock sensor, a universal LED driver for streetlights and an energy-harvesting current sensor won an Internet of Things contest.View the full article HERE.]]></description>
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			<title><![CDATA[NASA''s ''PhoneSat'' program points to satellites of the future]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fengineering%2Dinvestigations%2Dblog%2F4415930%2FNASA%2Ds%2D%2DPhoneSat%2D%2Dprogram%2Dpoints%2Dto%2Dsatellites%2Dof%2Dthe%2Dfuture]]></link>
			<pubDate>Sat, 08 Jun 2013 01:25:16 EST</pubDate>
			<description><![CDATA[After putting into orbit satellites based on an off-the-shelf smartphone, NASA looks at future for lower-cost spacecraft. View the full article HERE.]]></description>
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			<title><![CDATA[Apple WWDC 2013: 8 things to expect]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415933%2FApple%2DWWDC%2D2013%2D%2D8%2Dthings%2Dto%2Dexpect%2D]]></link>
			<pubDate>Sat, 08 Jun 2013 01:25:16 EST</pubDate>
			<description><![CDATA[Will Apple unveil a new music service or iOS 7? Just don&apos;&apos;t expect a new iPhone or iPad to debut. View the full article HERE.]]></description>
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			<title><![CDATA[Microchip to acquire embedded memory IP supplier]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fmemory%2Ddesign%2F4415733%2FMicrochip%2Dto%2Dacquire%2Dembedded%2Dmemory%2DIP%2Dsupplier]]></link>
			<pubDate>Thu, 06 Jun 2013 01:42:27 EST</pubDate>
			<description><![CDATA[Acquisition of Novocell by Microchip subsidiary Silicon Storage Technology expands Microchip&apos;&apos;s flash memory IP offering.View the full article HERE.]]></description>
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			<title><![CDATA[Chip sales: WSTS reduces 2013 market growth estimate]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415806%2FChip%2Dsales%2DWSTS%2Dreduces%2D2013%2Dmarket%2Dgrowth%2Destimate%2D]]></link>
			<pubDate>Thu, 06 Jun 2013 01:42:25 EST</pubDate>
			<description><![CDATA[Alongside reporting weak global chip sales for April the SIA has reported that WSTS has reduced its estimates for chip market growth for 2013 and 2014.View the full article HERE.]]></description>
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			<title><![CDATA[Intel's Haswell puts more analog inside]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415471%2FIntel%2Ds%2DHaswell%2Dputs%2Dmore%2Danalog%2Dinside]]></link>
			<pubDate>Wed, 05 Jun 2013 01:21:16 EST</pubDate>
			<description><![CDATA[Inside Haswell, Intel&apos;s next CPU, are twenty of more custom inductors, designed and made by Intel to support its new on-chip voltage regulator.View the full article HERE.]]></description>
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			<title><![CDATA[Maxim's CEO on analog, Intel, Samsung and more]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415480%2FMaxim%2Ds%2DCEO%2Don%2Danalog%2D%2DIntel%2D%2DSamsung%2Dand%2Dmore]]></link>
			<pubDate>Wed, 05 Jun 2013 01:21:15 EST</pubDate>
			<description><![CDATA[Maxim chief executive Tunc Doluca talks about his new 90nm analog process, his integration strategy, Intel, Samsung and China.View the full article HERE.]]></description>
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			<title><![CDATA[SMIC forms joint venture for 28-nm chip production]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415514%2FSMIC%2Dforms%2Djoint%2Dventure%2Dfor%2D28%2Dnm%2Dchip%2Dproduction]]></link>
			<pubDate>Tue, 04 Jun 2013 01:42:14 EST</pubDate>
			<description><![CDATA[Some $3.6 billion funding has been earmarked for SMIC joint-venture to focus on 45-nm and finer geometry manufacturing.View the full article HERE.]]></description>
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			<title><![CDATA[Lenovo eyes the mobile market]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415540%2FLenovo%2Deyes%2Dthe%2Dmobile%2Dmarket]]></link>
			<pubDate>Tue, 04 Jun 2013 01:42:14 EST</pubDate>
			<description><![CDATA[After securing its place in the PC market, Lenovo Group is now hoping to establish similar clout in the mobile market.View the full article HERE.]]></description>
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			<title><![CDATA[Romanian teenager snags Intel science award]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fdesign%2Dcontests%2D%2D%2Dcompetitions%2F4415400%2FRomanian%2Dteenager%2Dsnags%2DIntel%2Dscience%2Daward]]></link>
			<pubDate>Sat, 01 Jun 2013 01:24:18 EST</pubDate>
			<description><![CDATA[Ionut Budisteanu took home $75,000 for using artificial intelligence to create a model for a low-cost, self-driving car.View the full article HERE.]]></description>
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			<title><![CDATA[NXP gears up for GaN production]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fsmart%2Denergy%2Ddesign%2F4415429%2FNXP%2Dgears%2Dup%2Dfor%2DGaN%2Dproduction]]></link>
			<pubDate>Sat, 01 Jun 2013 01:24:18 EST</pubDate>
			<description><![CDATA[The U.K. government is to provide 20 percent of the budget to support the creation of 100 power semiconductor jobs at NXP&apos;&apos;s Hazel Grove wafer fab in England.View the full article HERE.]]></description>
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			<title><![CDATA[Intel wins CPU slot in Samsung tablet]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415437%2FIntel%2Dwins%2DCPU%2Dslot%2Din%2DSamsung%2Dtablet]]></link>
			<pubDate>Sat, 01 Jun 2013 01:24:17 EST</pubDate>
			<description><![CDATA[Atom processor gain design win in Samsung Galaxy tablet computer, according to reports.View the full article HERE.]]></description>
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			<title><![CDATA[IBM breakthrough could alleviate mobile data bottleneck]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415462%2FIBM%2Dbreakthrough%2Dcould%2Dalleviate%2Dmobile%2Ddata%2Dbottleneck]]></link>
			<pubDate>Sat, 01 Jun 2013 01:24:16 EST</pubDate>
			<description><![CDATA[Integrated phased-array transceiver contains all millimeter- wave components necessary for high data-rate communications.View the full article HERE.]]></description>
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			<title><![CDATA[Samsung Galaxy S4 Mini dials back specs]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415395%2FSamsung%2DGalaxy%2DS4%2DMini%2Ddials%2Dback%2Dspecs]]></link>
			<pubDate>Fri, 31 May 2013 01:39:07 EST</pubDate>
			<description><![CDATA[Billed as a smaller version of its powerful flagship smartphone, Samsung&apos;&apos;s Galaxy S4 Mini is nothing short of a land grab.View the full article HERE.]]></description>
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			<title><![CDATA[Romanian teenager snags Intel science award]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415400%2FRomanian%2Dteenager%2Dsnags%2DIntel%2Dscience%2Daward]]></link>
			<pubDate>Fri, 31 May 2013 01:39:06 EST</pubDate>
			<description><![CDATA[Ionut Budisteanu took home $75,000 for using artificial intelligence to create a model for a low-cost, self-driving car.View the full article HERE.]]></description>
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			<title><![CDATA[Intel, ARM on even footing in Net of Things, says IDC]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415408%2FIntel%2D%2DARM%2Don%2Deven%2Dfooting%2Din%2DNet%2Dof%2DThings%2D%2Dsays%2DIDC]]></link>
			<pubDate>Fri, 31 May 2013 01:39:06 EST</pubDate>
			<description><![CDATA[More than 25 billion intelligent systems valued at $4 trillion could ship in 2020, said an IDC analyst helping create a new trade group for the sector.View the full article HERE.]]></description>
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			<title><![CDATA[SRC sponsors chip research in Abu Dhabi]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415258%2FSRC%2Dsponsors%2Dresearch%2Din%2DAbu%2DDhabi]]></link>
			<pubDate>Thu, 30 May 2013 01:30:28 EST</pubDate>
			<description><![CDATA[The Semiconductor Research Corporation is jointly funding semiconductor development efforts with the Globalfoundries parent company. View the full article HERE.]]></description>
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			<title><![CDATA[Tablets expected to outship notebooks in 2013]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415260%2FTablets%2Dexpected%2Dto%2Doutship%2Dnotebooks%2Din%2D2013]]></link>
			<pubDate>Thu, 30 May 2013 01:30:27 EST</pubDate>
			<description><![CDATA[IDC cuts PC market forecast as consumers turn increasingly to tablets, smartphones. View the full article HERE.]]></description>
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			<title><![CDATA[Wolfson to move integrated MEMS mics to 8in wafers]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415211%2FWolfson%2Dto%2Dmove%2Dintegrated%2DMEMS%2Dmics%2Dto%2D8in%2Dwafers]]></link>
			<pubDate>Thu, 30 May 2013 01:30:26 EST</pubDate>
			<description><![CDATA[Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMs microphones and moving production to 8in (200mm) wafers in the first to make the move.View the full article HERE.]]></description>
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			<title><![CDATA[Intel is buyer of ST-Ericsson GPS unit]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fcommunications%2Ddesign%2F4415264%2FIntel%2Dis%2Dbuyer%2Dof%2DST%2DEricsson%2DGPS%2Dunit]]></link>
			<pubDate>Thu, 30 May 2013 01:30:26 EST</pubDate>
			<description><![CDATA[No sale price given but Intel purchase will save STMicroelectronics $90 million in close-down costs. 130 staff set to join Intel.View the full article HERE.]]></description>
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			<title><![CDATA[Europe adds to chip pilot line support list]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415274%2FEurope%2Dadds%2Dto%2Dchip%2Dpilot%2Dline%2Dsupport%2Dlist]]></link>
			<pubDate>Thu, 30 May 2013 01:30:25 EST</pubDate>
			<description><![CDATA[The European Commission has added LEDs, power, MEMS and 450-mm to the list of chip manufacturing pilot lines it will support.View the full article HERE.]]></description>
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			<title><![CDATA[Infineon launches 3-D sensor for gesture recognition]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Findustrial%2Dcontrol%2F4415317%2FInfineon%2Dlaunches%2D3%2DD%2Dsensor%2Dfor%2Dgesture%2Drecognition]]></link>
			<pubDate>Thu, 30 May 2013 01:30:25 EST</pubDate>
			<description><![CDATA[German chipmaker, working with fabless specialist in time-of-flight image sensors, has introduced 3-D image sensor chips designed to implement touchless gesture recognition.View the full article HERE.]]></description>
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			<title><![CDATA[The ripple effect: Semiconductor employment across America]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415202%2FThe%2Dripple%2Deffect%2D%2DSemiconductor%2Demployment%2Dacross%2DAmerica%2D]]></link>
			<pubDate>Wed, 29 May 2013 01:26:19 EST</pubDate>
			<description><![CDATA[Along with many other benefits, the semiconductor industry is a huge job creator for the U.S.View the full article HERE.]]></description>
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			<title><![CDATA[Slideshow: Ethernet yesterday, today and tomorrow]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415214%2FSlideshow%2D%2DEthernet%2Dyesterday%2D%2Dtoday%2Dand%2Dtomorrow]]></link>
			<pubDate>Wed, 29 May 2013 01:26:18 EST</pubDate>
			<description><![CDATA[The 40th anniversary of Ethernet unearthed old war stories, a couple poems, a robotic-assisted videoconferencing demo and talk of a big, insecure future.View the full article HERE.]]></description>
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			<title><![CDATA[Apple tops list of supply chain leadership again]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4415228%2FApple%2Dtops%2Dlist%2Dof%2Dsupply%2Dchain%2Dleadership%2Dagain]]></link>
			<pubDate>Wed, 29 May 2013 01:26:17 EST</pubDate>
			<description><![CDATA[Apple topped Gartner&apos;&apos;s ranking of the top 25 firms in supply chain leadership for a record sixth year in a row.View the full article HERE.]]></description>
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			<title><![CDATA[SOI wafer supplier sees cash halved]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415074%2FSOI%2Dwafer%2Dsupplier%2Dsees%2Dcash%2Dhalved]]></link>
			<pubDate>Sat, 25 May 2013 01:29:53 EST</pubDate>
			<description><![CDATA[Soitec has seen cash resources fall by 50 percent as it made net loss that was 80 percent of sales in financial year to end of March 2013.View the full article HERE.]]></description>
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			<title><![CDATA[Volkswagen to lead MCU energy benchmark group]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fautomotive%2Ddesign%2F4415079%2FVolkswagen%2Dto%2Dlead%2DMCU%2Denergy%2Dbenchmark%2Dgroup]]></link>
			<pubDate>Sat, 25 May 2013 01:29:53 EST</pubDate>
			<description><![CDATA[Working group extended to establish energy efficiency benchmark for automotive microcontrollers. Volkswagen is to chair group with 11 chip companies contributing so far.View the full article HERE.]]></description>
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			<title><![CDATA[Research gap threatens innovation, experts warn]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415088%2FResearch%2Dgap%2Dthreatens%2Dinnovation%2D%2Dexperts%2Dwarn]]></link>
			<pubDate>Sat, 25 May 2013 01:29:52 EST</pubDate>
			<description><![CDATA[The decline of big corporate R&amp;D groups such as Bell Labs has created a hole in the innovation pipeline said Bill Spencer (pictured) at an event celebrating the 40th anniversary of Ethernet.View the full article HERE.]]></description>
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			<title><![CDATA[Intel outlines 3-D NAND transition]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fmemory%2Ddesign%2F4415100%2FIntel%2Doutlines%2D3%2DD%2DNAND%2Dtransition]]></link>
			<pubDate>Sat, 25 May 2013 01:29:52 EST</pubDate>
			<description><![CDATA[Intel and IM Flash Technologies executive says 2-D NAND flash memory can scale to 10-nm and that 3-D NAND needs to be manufactured with at least 32 layers to be economic.View the full article HERE.]]></description>
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			<title><![CDATA[Europe backs FDSOI fabs]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414873%2FEurope%2Dbacks%2DFDSOI%2Dwafer%2Dfabs]]></link>
			<pubDate>Fri, 24 May 2013 01:27:58 EST</pubDate>
			<description><![CDATA[A $465 million collaborative R&amp;D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.View the full article HERE.]]></description>
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			<title><![CDATA[Intel Haswell packs integrated voltage regulator]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415059%2FIntel%2DHaswell%2Dpacks%2Dintegrated%2Dvoltage%2Dregulator]]></link>
			<pubDate>Fri, 24 May 2013 01:27:55 EST</pubDate>
			<description><![CDATA[Integration eliminates as many as seven external third party chips-one of many power improvements driven by competition with ARM.View the full article HERE.]]></description>
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			<title><![CDATA[Intel pushes for more research beyond 10-nm]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414897%2FMore%2Dvaried%2Dresearch%2Dneeded%2Dsays%2DIntel]]></link>
			<pubDate>Thu, 23 May 2013 01:36:10 EST</pubDate>
			<description><![CDATA[Intel&apos;&apos;s director of component research says more varied research is needed to catch the next opportunity beyond conventional silicon.View the full article HERE.]]></description>
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			<title><![CDATA[25% of notebooks to feature touchscreens by 2016]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414983%2F25%2D%2Dof%2Dnotebooks%2Dto%2Dfeature%2Dtouchscreens%2Dby%2D2016]]></link>
			<pubDate>Thu, 23 May 2013 01:36:10 EST</pubDate>
			<description><![CDATA[Thanks to falling prices and a push from Intel, 2013 is expected to be the start of a booming growth spurt for touch-screen equipped notebooks. View the full article HERE.]]></description>
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			<title><![CDATA[Broadcom: Time to prepare for the end of Moore's Law]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4415006%2FBroadcom%2D%2DTime%2Dto%2Dprepare%2Dfor%2Dthe%2Dend%2Dof%2DMoore%2Ds%2DLaw]]></link>
			<pubDate>Thu, 23 May 2013 01:36:09 EST</pubDate>
			<description><![CDATA[CTO Henry Samueli says Broadcom is starting to prepare customers for the end of CMOS scaling in the next 15 years, and it is working out plans for 3-D chip stacks.View the full article HERE.]]></description>
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			<title><![CDATA[ST''s strategy is a tale of two segments]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414579%2FST%2Dstrategy%2Dis%2Da%2Dtale%2Dof%2Dtwo%2Dsegments]]></link>
			<pubDate>Wed, 22 May 2013 01:27:12 EST</pubDate>
			<description><![CDATA[ST tells analysts it is going to report financial results for both its digital and analog business segments for &quot;transparency&quot; but remains committed to exploiting manufacturing technologies it has Crolles, including its FDSOI process.View the full article HERE.]]></description>
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			<title><![CDATA[Qualcomm, Samsung pass AMD in microprocessor sales]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414756%2FQualcomm%2D%2DSamsung%2Dpass%2DAMD%2Din%2Dmicroprocessor%2Dsales]]></link>
			<pubDate>Wed, 22 May 2013 01:27:10 EST</pubDate>
			<description><![CDATA[Thanks to PC sales slowdown coupled with increase in smartphone and tablet sales, AMD slipped to fourth in MPU sales for first time since 1990s. View the full article HERE.]]></description>
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			<title><![CDATA[Globalfoundries joins Qualcomm in MRAM research]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fmemory%2Ddesign%2F4414763%2FGlobalfoundries%2Djoins%2DQualcomm%2Din%2DMRAM%2Dresearch]]></link>
			<pubDate>Wed, 22 May 2013 01:27:09 EST</pubDate>
			<description><![CDATA[Globalfoundries has signed up to an IMEC R&amp;D program on STT-MRAM which is seen as a promising high-density, non-volatile alternative to SRAM and DRAM and for embedded use.View the full article HERE.]]></description>
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			<title><![CDATA[Intel''s new CEO shakes things up]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414875%2FIntel%2Ds%2Dnew%2DCEO%2Dshakes%2Dthings%2Dup]]></link>
			<pubDate>Wed, 22 May 2013 01:27:08 EST</pubDate>
			<description><![CDATA[Brian Krzanich outlines re-org in internal memo two days after taking the helm of the world&apos;&apos;s biggest chip maker. View the full article HERE.]]></description>
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			<title><![CDATA[Broadcom's CTO on Ethernet's six key directions]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414881%2FBroadcom%2Ds%2DCTO%2Don%2DEthernet%2Ds%2Dsix%2Dkey%2Ddirections]]></link>
			<pubDate>Wed, 22 May 2013 01:27:07 EST</pubDate>
			<description><![CDATA[As the industry celebrates the 40th anniversary of Ethernet, Broadcom CTO Henry Samueli talks about six directions in which it is heading.View the full article HERE.]]></description>
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			<title><![CDATA[Imperas launches multicore software development tools]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Feda%2Ddesign%2F4414654%2FImperas%2Dlaunches%2Dmulticore%2Dsoftware%2Ddevelopment%2Dtools]]></link>
			<pubDate>Tue, 21 May 2013 01:34:07 EST</pubDate>
			<description><![CDATA[Hardware model and and software debug tool functions integrated in simulation code stream provides performance, capability and ease-of-use benefits, claims vendor.View the full article HERE.]]></description>
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			<title><![CDATA[ST to deny rivals FDSOI access]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414703%2FST%2Dto%2Ddeny%2Drivals%2DFDSOI%2Daccess]]></link>
			<pubDate>Tue, 21 May 2013 01:34:06 EST</pubDate>
			<description><![CDATA[In an interview Jean-Marc Chery, ST&apos;&apos;s CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.View the full article HERE.]]></description>
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			<title><![CDATA[Could Intel enable $200 Ultrabook?]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fsemi%2Dconscious%2F4414706%2FCould%2DIntel%2Denable%2Dthe%2D%2D200%2Dultrathin%2DPC%2D]]></link>
			<pubDate>Tue, 21 May 2013 01:34:06 EST</pubDate>
			<description><![CDATA[Market research firm IHS believes the chip giant could reinvigorate the PC industry--if it&apos;&apos;s willing to sacrifice its own margins. View the full article HERE.]]></description>
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			<title><![CDATA[Android drives cameras to GPUs, plans IR support]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414713%2FAndroid%2Ddrives%2Dcameras%2Dto%2DGPUs%2D%2Dplans%2DIR%2Dsupport]]></link>
			<pubDate>Tue, 21 May 2013 01:34:05 EST</pubDate>
			<description><![CDATA[Google will update Android camera API to support computational photography on graphics cores and build support for infrared into Android.View the full article HERE.]]></description>
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			<title><![CDATA[Taiwanese researchers take aim at environmental issues]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414754%2FTaiwanese%2Dresearchers%2Dtake%2Daim%2Dat%2Denvironmental%2Dissues]]></link>
			<pubDate>Tue, 21 May 2013 01:34:05 EST</pubDate>
			<description><![CDATA[Taiwan has long been recognized for its contributions to microelectronics, but its research labs are now working on pressing social issues.View the full article HERE.]]></description>
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			<title><![CDATA[Slideshow: Maker Faire returns to Silicon Valley]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414750%2FSlideshow%2D%2DMaker%2DFaire%2Dreturns%2Dto%2DSilicon%2DValley]]></link>
			<pubDate>Tue, 21 May 2013 01:34:04 EST</pubDate>
			<description><![CDATA[Our man in Silicon Valley spent his Saturday af6ternnon taking in Maker Faire and here&apos;&apos;s a glimpse of some of the makers, robots, LEDs and whatnot he saw there.View the full article HERE.]]></description>
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			<title><![CDATA[Arduino board plugs DIYers into the cloud for $69]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414646%2FArduino%2Dboard%2Dplugs%2DDIYers%2Dinto%2Dthe%2Dcloud%2Dfor%2D%2D69]]></link>
			<pubDate>Sun, 19 May 2013 01:29:53 EST</pubDate>
			<description><![CDATA[Massimo Banzi launched a $69 Arduino board that plugs do-it-yourselfers into the cloud using a Wi-Fi chip from Qualcomm Atheros running a custom variant of Linux.View the full article HERE.]]></description>
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			<title><![CDATA[Samsung wants to launch 5G in 2020]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fsemi%2Dconscious%2F4414368%2FSamsung%2Dwants%2Dto%2Dlaunch%2D5G%2Din%2D2020]]></link>
			<pubDate>Sat, 18 May 2013 01:40:49 EST</pubDate>
			<description><![CDATA[South Korean giant claims first adaptive array transceiver technology operating in the millimeter-wave bands.View the full article HERE.]]></description>
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			<title><![CDATA[FDSOI gains three design wins]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Feda%2Ddesign%2F4414588%2FFDSOI%2Dgains%2Dthree%2Ddesign%2Dwins]]></link>
			<pubDate>Sat, 18 May 2013 01:40:46 EST</pubDate>
			<description><![CDATA[ST claims three design wins for its fully-depleted silicon on insulator manufacturing process; a move that could draw out support from EDA software and IP providers.View the full article HERE.]]></description>
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			<title><![CDATA[Slideshow: Google I/O puts 7 platforms on parade]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414608%2FSlideshow%2D%2DGoogle%2DIO%2Dputs%2D7%2Dplatforms%2Don%2Dparade]]></link>
			<pubDate>Sat, 18 May 2013 01:40:45 EST</pubDate>
			<description><![CDATA[At its annual developer&apos;&apos;s conference, Google showed advances across seven major platforms--Android, Chrome, Glass, Google+, Maps, Search and Google TV.View the full article HERE.]]></description>
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			<title><![CDATA[Renesas signs with IMEC for short-range radio research]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Findustrial%2Dcontrol%2F4414622%2FRenesas%2Dsigns%2Dwith%2DIMEC%2Dfor%2Dshort%2Drange%2Dradio%2Dresearch]]></link>
			<pubDate>Sat, 18 May 2013 01:40:44 EST</pubDate>
			<description><![CDATA[Renesas is researching ultra-low power short-range radio with IMEC, targeting sensor networks for automotive and industrial purposes.View the full article HERE.]]></description>
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			<title><![CDATA[Amazon buys Samsung display subsidiary Liquavista]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fembedded%2Dinternet%2Ddesign%2F4414609%2FAmazon%2Dbuys%2DSamsung%2Ddisplay%2Dsubsidiary%2DLiquavista%2D]]></link>
			<pubDate>Sat, 18 May 2013 01:40:44 EST</pubDate>
			<description><![CDATA[Samsung sells electrowetting display pioneer to Amazon for an undisclosed sum.View the full article HERE.]]></description>
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			<title><![CDATA[Taiwan reversing brain drain]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414629%2FTaiwan%2Dreversing%2Dbrain%2Ddrain]]></link>
			<pubDate>Sat, 18 May 2013 01:40:43 EST</pubDate>
			<description><![CDATA[Government funded research labs are enticing Taiwan&apos;&apos;s brightest expats to return in hopes of revitalizing the country as an innovator.View the full article HERE.]]></description>
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			<title><![CDATA[Slideshow: Astronaut sings Bowie in space]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414359%2FAstronaut%2Dsings%2DBowie%2Din%2Dspace%2D]]></link>
			<pubDate>Fri, 17 May 2013 01:21:03 EST</pubDate>
			<description><![CDATA[Canadian astronaut Chris Hadfield&apos;&apos;s revised version of David Bowie&apos;s Space Oddity, the first music video made in space, has rocketed him across the web. View the full article HERE.]]></description>
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			<title><![CDATA[Q1 mobile phone sales buoyed by Asia-Pac]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414379%2FQ1%2Dmobile%2Dphone%2Dsales%2Dbuoyed%2Dby%2DAsia%2DPac]]></link>
			<pubDate>Fri, 17 May 2013 01:21:02 EST</pubDate>
			<description><![CDATA[Handset sales were down year-over-year in all regions expect Asia-Pacific, according to Gartner. View the full article HERE.]]></description>
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			<title><![CDATA[Embedded flash startup in production at three foundries]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fmemory%2Ddesign%2F4414429%2FEmbedded%2Dflash%2Dstartup%2Din%2Dproduction%2Dat%2Dthree%2Dfoundries]]></link>
			<pubDate>Fri, 17 May 2013 01:21:02 EST</pubDate>
			<description><![CDATA[Stealthy startup offers non-volatile memory IP for use in unmodified logic processes and claims to be already in volume production at three foundries.View the full article HERE.]]></description>
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			<title><![CDATA[Wearable computers have a long way to go]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414494%2FWearable%2Dcomputers%2Dhave%2Da%2Dlong%2Dway%2Dto%2Dgo]]></link>
			<pubDate>Fri, 17 May 2013 01:21:01 EST</pubDate>
			<description><![CDATA[Wearable computers will likely be the next major wave in not only consumer electronics but also full-fledged computing solutions.View the full article HERE.]]></description>
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			<title><![CDATA[E Ink preps flexible e-paper display]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414458%2FE%2DInk%2Dpreps%2Dflexible%2De%2Dpaper%2Ddisplay]]></link>
			<pubDate>Fri, 17 May 2013 01:21:00 EST</pubDate>
			<description><![CDATA[E Ink is preparing to launch a 13.3-inch sized flexible e-paper display. Mass production due in 2H13. View the full article HERE.]]></description>
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			<title><![CDATA[Can Samsung overtake Apple in 2013?]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dblogs%2Fother%2F4414526%2FCan%2DSamsung%2Dovertake%2DApple%2Din%2D2013%2D]]></link>
			<pubDate>Fri, 17 May 2013 01:21:00 EST</pubDate>
			<description><![CDATA[Should we admit that there is in fact &quot;a before and after&quot; Apple&apos;&apos;s iconic CEO Steve Jobs?View the full article HERE.]]></description>
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			<item>
			<title><![CDATA[Google I/O: Larry Page talks, search box listens]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414511%2FLarry%2DPage%2Dtalks%2D%2Dsearch%2Dbox%2Dlistens%2Dat%2DGoogle%2DI%2DO]]></link>
			<pubDate>Fri, 17 May 2013 01:20:59 EST</pubDate>
			<description><![CDATA[No shiny new gadgets debuted, but Google did show search responding to voice recognition and CEO Larry Page gave a surprise Q&amp;A.View the full article HERE.]]></description>
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			<title><![CDATA[Memory IP startup pursues FinFET, FDSOI processes]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Feda%2Ddesign%2F4414477%2FMemory%2DIP%2Dstartup%2Dpursues%2DFinFET%2DFDSOI%2Dprocesses]]></link>
			<pubDate>Fri, 17 May 2013 01:20:58 EST</pubDate>
			<description><![CDATA[Startup is developing physical IP for geometries at 20-nm and below with an initial focus on SRAM structures for implementation in FinFET and FDSOI processes.View the full article HERE.]]></description>
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			<title><![CDATA[Ten percent of notebooks using touch screens]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414572%2FTen%2Dpercent%2Dof%2Dnotebooks%2Dusing%2Dtouch%2Dscreens]]></link>
			<pubDate>Fri, 17 May 2013 01:20:58 EST</pubDate>
			<description><![CDATA[Despite the sluggish uptake of Windows 8, nearly 4.6 million notebooks tapped into capacitive touch screen displays last quarter, a figure one market watcher sees rising.View the full article HERE.]]></description>
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			<title><![CDATA[Taiwan funds smartphone innovations]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Felectronics%2Dnews%2F4414581%2FTaiwanese%2Dengineers%2Dprep%2Dnew%2Dsmartphone%2D%2Dtablet%2Dinnovations]]></link>
			<pubDate>Fri, 17 May 2013 01:20:57 EST</pubDate>
			<description><![CDATA[National Taiwan University has developed several innovations for tablets and smartphones designed to win the hearts of mass-market users.View the full article HERE.]]></description>
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			<title><![CDATA[Altera to buy Enpirion for on-chip power conversion]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4414350%2FAltera%2Dto%2Dbuy%2DEnpirion%2Dfor%2Don%2Dchip%2Dpower%2Dconversion%2DFPGA%2Dvendor%2Dhas%2Dbought%2Dprivately%2Dheld%2D2001%2Dstartup%2Dto%2Dgain%2Daccess%2Dto%2Dhighly%2Dintegrated%2DPowerSoc%2Dtechnology%2D%2DLONDON%2D%2D%2DAltera]]></link>
			<pubDate>Wed, 15 May 2013 01:25:14 EST</pubDate>
			<description><![CDATA[FPGA vendor has bought privately-held 2001 startup to gain access to highly-integrated PowerSoc technology.View the full article HERE.]]></description>
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			<title><![CDATA[Channel compensation methods used in JESD204B converters]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4414106%2FChannel%2Dcompensation%2Dmethods%2Dused%2Din%2DJESD204B%2Dconverters]]></link>
			<pubDate>Fri, 10 May 2013 01:37:30 EST</pubDate>
			<description><![CDATA[Channel compensation strategies minimize the design effort and the time needed to successfully implement the new interface between ADCs, DACs, FPGAs, and ASICs at maximum speed.View the full article HERE.]]></description>
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			<title><![CDATA[Intel to make 22-nm chips for Microsemi]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4413236%2FIntel%2Dto%2Dmake%2D22%2Dnm%2Dchips%2Dfor%2DMicrosemi]]></link>
			<pubDate>Thu, 02 May 2013 01:39:29 EST</pubDate>
			<description><![CDATA[Fifth publicly disclosed foundry customer for world&apos;&apos;s biggest chip maker plans to offer products based on tri-gate process by early 2015. View the full article HERE.]]></description>
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			<title><![CDATA[FPGAs offer cost-effective, flexible solutions for remote radio heads]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4412350%2FFPGAs%2Doffer%2Dcost%2Deffective%2D%2Dflexible%2Dsolutions%2Dfor%2Dremote%2Dradio%2Dheads]]></link>
			<pubDate>Sat, 20 Apr 2013 01:21:15 EST</pubDate>
			<description><![CDATA[Adding remote radio heads, which rely on local or cloud-based baseband processing, is one approach that allows network expansion without adding additional base station servers.View the full article HERE.]]></description>
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			<title><![CDATA[Grasp the critical issues for a functioning JESD204B interface]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4412410%2FGrasp%2Dthe%2Dcritical%2Dissues%2Dfor%2Da%2Dfunctioning%2DJESD204B%2Dinterface]]></link>
			<pubDate>Sat, 20 Apr 2013 01:21:14 EST</pubDate>
			<description><![CDATA[The high-speed converter serial standard has some advanced characteristics; what can you do to get it up and running?View the full article HERE.]]></description>
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			<title><![CDATA[Altera turns to TSMC''s embedded flash process]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4412103%2FAltera%2Dturns%2Dto%2DTSMC%2Ds%2Dembedded%2Dflash%2Dprocess]]></link>
			<pubDate>Wed, 17 Apr 2013 01:29:54 EST</pubDate>
			<description><![CDATA[FPGA vendor is planning non-volatile programmable devices targeting high-volume applications made using a 55-nm embedded flash manufacturing process.View the full article HERE.]]></description>
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			<title><![CDATA[Altera, AMCC to combine 64-bit processors, FPGAs]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4412038%2FAltera%2DAMCC%2Dto%2Dcombine%2D64%2Dbit%2Dprocessors%2D%2DFPGAs]]></link>
			<pubDate>Tue, 16 Apr 2013 01:40:53 EST</pubDate>
			<description><![CDATA[FPGA and networking chip vendors agree to work together on chips and software for data centers. View the full article HERE.]]></description>
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			<title><![CDATA[Increased functional safety is a ''Must Have'' in networked embedded designs]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4411881%2FIncreased%2Dfunctional%2Dsafety%2Dis%2Da%2D%2DMust%2DHave%2D%2Din%2Dnetworked%2Dembedded%2Ddesigns]]></link>
			<pubDate>Fri, 12 Apr 2013 01:28:25 EST</pubDate>
			<description><![CDATA[Some systems require extraordinary safety and reliability to eliminate, as much as possible, failures that can result in dramatic financial losses or loss of life.View the full article HERE.]]></description>
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			<title><![CDATA[TSMC expected to begin 20-nm line early]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4411189%2FTSMC%2Dexpected%2Dto%2Dbegin%2D20%2Dnm%2Dline%2Dearly]]></link>
			<pubDate>Thu, 04 Apr 2013 01:27:01 EST</pubDate>
			<description><![CDATA[Foundry tipped to begin installing equipment for 20-nm production at its fab in Tainan, Taiwan, two months ahead of schedule. This could contribute to a lead over competitors if the process yield can be ramped.View the full article HERE.]]></description>
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			<title><![CDATA[FPGAs supercharge instrument flexibility]]></title>
			<link><![CDATA[http://www.globalspec.com/Goto/GotoWebPage?gotoType=engnews&rss=1&gotoUrl=http%3A%2F%2Fwww%2Eeetimes%2Ecom%2Fdesign%2Fprogrammable%2Dlogic%2F4411006%2FFPGAs%2Dsupercharge%2Dinstrument%2Dflexibility]]></link>
			<pubDate>Tue, 02 Apr 2013 01:40:02 EST</pubDate>
			<description><![CDATA[A growing number of instrument vendors are giving users the ability to customize internal FPGAs, delivering a significant increase in flexibility and speed. View the full article HERE.]]></description>
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