Infineon & UMC Extend Manufacturing Pact Into Auto ICs
EE Times - News, 7 hours ago
German chipmaker will partner with Taiwanese foundry to manufacture power semiconductors for automotive applications, extending a production alliance in logic chips lasting more than 15 years.
AMD Gives RF Mico Exec Ops Job
EE Times - News, 7 hours ago
AMD has hired James A. Clifford as its senior vice president of Global Operations, reporting to president and CEO Lisa Su. The former RF Micro exec will be responsible for overseeing all aspects of AMD''s end-to-end manufacturing and supply chain strategy.
IBM Says PCM Non-Volatility Not Essential
EE Times - News, 7 hours ago
11 Views of IEDM
EE Times - News, 7 hours ago
This week''s International Electron Devices Meeting inspired new hope for Moore''s law, with significant achievements reported by Intel, IBM, and TSMC in finFET process technology at 16 and 14 nm nodes.
Want a Voltera Desktop PCB Printer?
EE Times - News, 7 hours ago
Who amongst us wouldn?t want the ability to create PCBs on their desktop?
Vote for the Engineer of the Year
EE Times - News, 7 hours ago
Finalists announced, survey below. The award, sponsored by National Instruments, includes a $10,000 grant and will be given out at DesignCon 2015.
ESIstream vs. JESD204B for Ultra-High-Speed Chip-Chip Communications
EE Times - News, 7 hours ago
The open ESIstream protocol has less encoding overhead and higher data bandwidth than JESD204B; also it''s significantly easier to implement ESIstream digital core.
Top Robot Stories of 2014
EE Times - News, 7 hours ago
Robots have fascinated us for centuries, but now we are realizing those visions. Here are some of the top robot stories that amazed and delighted us this past year.
MIT Discovers Superconductor Law
EE Times - News, 7 hours ago
The Massachusetts Institute of Technology has discovered a law governing the relationship between critical temperature at which superconductivity begins, resistivity, and the thickness of the film for superconducting integrated circuits.
DesignCon Revs High-Speed Engine
EE Times - News, December 16, 2014
DesignCon promises a smorgasbord of sessions on high-speed interconnect engineering at the chip and board levels, including a look at issues on the bleeding edge of 56 Gbits/second and beyond.
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