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Reduce Assembly Costs in Compact Electronic Devices
May 14, 2013

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2:00 PM - 3:00 PM EDT (11:00 AM - 12:00 PM PDT)
Reduce Assembly Costs in Compact Electronic Devices

To reduce assembly costs of handheld and portable electronic devices, fasteners are required to fit into extremely compact areas and/or into very thin base materials including stainless steel. Conventional assembly methods such as screws, welds, and rivets can be costly and less than ideal in many instances. microPEM fasteners were developed to replace many of these assembly methods. Utilizing self-clinching, surface mount, and other installation methods, these fasteners reduce overall assembly time and costs while offering equal or improved performance at the attachment point. Attendees of this presentation will learn how microPEM fasteners can facilitate automated insertion or simplify product disassembly. The presentation includes cost comparisons, technical animations, and cross-sectional views of these new technologies. End user product applications will also be discussed as will next-generation "development" products.

Key Take-Aways:
  • Learn how microPEM fasteners reduce or eliminate loose or unnecessary screws
  • Understand that microPEM fasteners can be utilized in different materials including magnesium and plastic
  • Discover why, if disassembly is required, microPEM screws can provide lower profile head solutions
Speaker:
Jay McKenna, Global Business Manager - microPEM® Fasteners, PennEngineering

Jay McKenna is Global Business Manager - microPEM® Fasteners at PennEngineering®. He is responsible for directing the development and worldwide launch of additions to the company's growing family of microPEM® fasteners designed for a wide range of end-use applications, including consumer electronics. McKenna, who has 25 years of experience in the fastening industry, earned his Bachelor of Mechanical Engineering degree at Villanova University.