Join us for free webinars presented by industry experts. You can participate in any of our upcoming interactive webinars, or view one of our archived on-demand webinars.
Tuesday, Jan 23, 2018, 10:00 AM EST (7:00 AM PST)
Presented by: Toshiba Electronics Europe GmbH
Bluetooth Special Interest Group (SIG) published the Bluetooth Low Energy Mesh 1.0 standard in July 2017. This specification adds a new mesh topology option to existing Bluetooth LE solutions. Attendees will get an introduction to Bluetooth LE mesh, its applications and Toshiba’s solutions.
Thursday, Jan 25, 2018, 10:00 AM EST (7:00 AM PST)
Presented by: EBV Elektronik
Attendees of this webinar will learn how to use ST’s new VIP-Zero family of highside drivers for switching high load currents in 12V Automotive systems, and how the VIP-Zero devices are helping designers to achieve a load current monitoring with the highest possible precision.
Tuesday, Jan 30, 2018, 2:00 PM EST (11:00 AM PST)
Presented by: Henkel Corporation - Industrial
The webinar provides an overview of key dispensing principles, system configurations and considerations for selecting equipment as well as a walk through of the most common equipment technologies that are used to dispense and cure adhesive products.
Wednesday, Jan 31, 2018, 11:00 AM EST (8:00 AM PST)
Presented by: Berg W.M., Inc.
Premature gear failure can be a problem in any application, resulting in unplanned downtime. Attendees of this webinar will have a better understanding of which gear design inputs lead to optimal gear design choices early in the development process, which along with testing can extend the operating life of every gear drive.
Wednesday, Feb 7, 2018, 10:00 AM EST (7:00 AM PST)
Presented by: METTLER TOLEDO Thermal Analysis
Specific heat capacity is a key property for improving technical processes such as injection molding, crystallization as well as for the safety analysis of chemical processes. This webinar covers the definition of specific heat capacity, its importance and methods for measurement.
Wednesday, Feb 7, 2018, 2:00 PM EST (11:00 AM PST)
Presented by: Henkel Corporation - Electronics
Protecting printed circuit boards (PCBs) from moisture, contamination, corrosion and shock is critical to ensuring long-term reliability. While there are multiple techniques used to achieve PCB protection, a novel one-material solution involving low pressure molding offers a streamlined, three-step approach that simplifies processing, reduces procurement complexity and dramatically lowers cost.
Thursday, Feb 8, 2018, 2:00 PM EST (11:00 AM PST)
Presented by: Belden
Modern industrial networks are transitioning towards communication architectures where strong compartmentalization in communication is replaced by permeability from the cloud to the sensor. TSN is a key technology to realize this fundamental change. This webinar discusses the new cybersecurity challenges on the table, and how to address them to make IIoT networks a reality.
Wednesday, Feb 21, 2018, 11:00 AM EST (8:00 AM PST)
Presented by: Stratasys Direct Manufacturing
HP Multi Jet Fusion has opened new possibilities in additive manufacturing, garnering attention for speed and material recyclability. But how does it stack up in a manufacturing environment? In this webinar, Stratasys Direct Manufacturing shares the results of a four month study about the technology, including Multi Jet Fusion's repeatability and cost-effectiveness.
Tuesday, Feb 27, 2018, 11:00 AM EST (8:00 AM PST)
The Complete Design for Additive Manufacturing and 3D Printing Toolchain – Simulation, Lattice Generation, Optimization, Analysis, and more!
Presented by: solidThinking, Inc.
To successfully take advantage of 3D printing benefits, a new design and simulation process must be used. It is not beneficial to simply ‘print’ a current design. New tools and advanced computational power have enabled users to optimize solid geometries for stiffness and weight, and also allowed them to simulate loading conditions and lightweight designs.