Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20 mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized. Watch this free webinar to learn from Summit's VP of Technology, Gerry Partida, when and where it is possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.
Are you tired of inaccurate ion concentration measurement techniques that leave you with unsatisfactory results? Learn about applications, procedures, good practice and challenges associated with ion concentration measurement using Ion Selective Electrodes.
Learning the basics of machine vision can help simplify inspection applications and make results more reliable and repeatable on your production line. Machine vision solutions can help you automate inspections, increase throughput and improve product quality. If you are looking for a better understanding of machine vision technology and how it works, then this webinar is for you!
Join us for session 3 in this 4-part series! Automation has expanded exponentially, resulting in a tremendous increase of VFDs and motors in manufacturing. However, VFDs also bring a hidden threat: electrical harmonic distortion, quietly damaging electric motor bearings, deteriorating motor insulation, and even causing malfunction of other electronic equipment including VFDs. This session will provide an overview of problems faced by these facilities and the solutions that keep them running.
Today's electronics businesses grapple with rising innovation complexity amidst rapid technological advancements, necessitating intricate designs and seamless hardware-software integration. Integrated design and simulation tools with systems engineering capabilities streamline the development of complex electromechanical systems, fostering innovation, accelerating development cycles, and enhancing market competitiveness. As a result, investing in more integrated tools drives efficiency, innovation, compliance, and market competitiveness across the product development lifecycle. Manufacturers can ultimately expedite time-to-market to address evolving customer preferences, competitive pressures, and sustainability requirements.
Join the experts from Flexible Circuit Technologies (FCT) to review flexible circuit fundamentals, explore cost drivers, and mechanical/electrical design considerations.
By the end of this hour-long webinar, attendees will be empowered with the knowledge and tools necessary to navigate the complexities of designing high channel count RF systems to ensure SWaP optimization. Whether you're a seasoned RF engineer looking to enhance your understanding of SWaP optimization or a decision-maker seeking insights into improving the performance and cost-effectiveness of your RF systems, don't miss this opportunity to stay ahead of the curve in the dynamic world of modern high channel count RF system design.
Micro-D connectors are utilized widely throughout the defense industry since first developed 50 years ago. The mechanical design has withstood the test of time and has unique characteristics that should be considered by next generation designers.
This webinar explores Microchip’s Complete RF Signal Chain Solution, which is revolutionizing SatCom, 5G, aerospace and defense with performance advances in GaN MMIC power amplifiers for advanced radar technology, linear power Satcom uplinks, 5G and wideband power amplifier applications. It discusses GaN on SiC MMIC power attributes that are critical to improving and offering more compelling next-generation products for 5G, aerospace and defense, and SatCom applications. Different types of beamforming architectures along with tradeoffs will be covered. For space applications, RF solutions from COTS to rad hard, plastic to hermetically sealed packages will be discussed.
The North American aluminum market has relied heavily on chrome-containing pretreatments to provide long lasting finishes to aluminum architectural components. With advancements in non-chrome pretreatments, the time has come to transition away from chrome pretreatments, now!
Join this webinar to learn how to address emerging charging standards SAE J3400/NACS (North American Charging Standard) and MCS (Megawatt Charging System), as well as trends in EV system architecture design. Explore how to safely and cost effectively maximize power density with system level solutions. Learn about the latest integrated electrical safety devices and electronics essential for successful implementation of high voltage systems.
Join us for session 1 in this 4-part series! In our upcoming webinar, discover the essentials of IEEE 519-2022 and how it relates to harmonic distortion in power systems. MTE's presenter, Sarah Woods, will provide greater clarity on this topic to help you:
Smiths Interconnect has a long history of working with space program engineers to ensure reliability and help bring their state-of-the-art ideas to life. Our NASA S-311-P-822 compliant high performance ruggedized cPCI connectors have a long legacy in space flight applications. Learn more about our customer's success stories within the Mars 2020 Perseverance Rover mission and how our connector is specifically designed to meet the environmental requirements of space.
Differential scanning calorimetry (DSC) is the most frequently used thermal analysis technique alongside TGA, TMA and DMA. DSC is used to measure enthalpy changes due to changes in the physical and chemical properties of a material as a function of temperature or time. The method allows you to identify and characterize materials.
Semiconductor manufacturing uses smaller and smaller particles. Traditional monitoring is too slow. NanoAir uses a new real-time technology that can detect tiny particles (down to 10 nm) to improve production processes and to validate the cleanliness of gases used in chip making.
Device and materials characterization can be challenging, especially when dealing with low-level source and measurement values. This webinar will introduce practical steps for ensuring high-quality device measurements, particularly when characterizing low-resistance/superconductive samples, high-resistance materials, and samples with large differences in states.
For many companies seeking to upgrade products with smart AI features, up until now, the barriers have been too high. So how do you utilize AI's potential in an increasingly competitive business environment? Steven Tateosian, senior vice president of microcontrollers at ICW Business Unit at Infineon Technologies, and Alexander Samuelsson, CTO/co-founder at Imagimob AB, will show how their joint solutions can simplify the deployment of AI and improve your development and designs.
This webinar is intended for engineers who work on high-speed digital design and test. In particular, we will be discussing PCIe 5.0 / 6.0 and IEEE802.3ck cable test and focusing on signal integrity, performance parameters and automation. Practical examples and demonstrations illustrate PCIe 5.0 / 6.0 and IEEE802.3ck cable test made easy, fast, and reliable.
Join us for session 2 in this 4-part series! The way we shop has undergone a dramatic transformation with E-commerce transactions comprising over 15% of all retail transactions in the US. Variable frequency drives (VFDs) lie at the heart of the warehousing and logistic center operations but can cause issues leading to significant downtime and lost revenue. This session will provide insight into how VFDs can bring operations to a halt.
In this talk we will discuss the history of thermal barrier coating (TBC) chemistries, where different chemistries excel, and how doping has been used to design phase stable, low conductivity, strain compliant, and erosion resistant materials. This background will provide the basis for a discussion on the development of Linde’s new low k, high toughness TBC chemistry that hopes to replace 7YSZ and gadolinium zirconate in some of the harshest operating turbines.
As the electronics industry faces rapid ecosystem evolution, time-to-market windows and business profit opportunities shrink. The effects of the internet of things (IoT), new technologies and shifting market landscapes compound these issues, forcing manufacturers to rethink their business and equip themselves with tools to accelerate electronic device development. Customers expect customized products quickly while requiring flawless quality. By digitalizing, companies can improve efficiency, profitability, product quality and on-time deliveries. This drives quality management needs across the entire product lifecycle, from design to development. Join us for our webinar as we explore the challenges faced by the electronics industry in the face of rapid ecosystem evolution. Leveraging Siemens integrated electronics lifecycle management solutions with native quality management system (QMS) tools, manufacturers can deliver complex, high-quality products and streamline their value chain.
