Product Announcements: MEMS Foundry

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.

Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Q. What is the largest part you can handle?

A. The maximum footprint is 12 x 24" (609 x 304 mm). We typically fabricate parts that are no larger than a microtiter plate, but have made instrument manifolds that are approx. 12 x 12 inches.

Q. What macrofluidic connections do you support (i.e. Upchurch fittings, proprieta... (read more)

ALine, Inc. has developed a scalable, robust process for the incorporation of functionality such as membranes for fluidic control, and on-board pneumatically actuated valves and reservoirs.

Go to ALine's technical articles page to learn more about all our capabilties. (read more)

Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)

Rogue Valley Microdevices offers Wet Thermal Oxidation services up to 15µm. Our Wet Thermal Oxidation process is designed to provide the best quality film. We offer a film thickness range of 500 angstroms to 15 microns. Starting Silicon Wafers (50mm-200mm) can be provided or customers can send in their own wafers. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD Silicon Nitride films. Our LPCVD Nitride Process uses very specific gas ratios to produce a stable LPCVD Silicon Nitride film that can target a customers film stress requirements. Our engineering team is able to offer our customers the opportunity to customize Film Stress to fit their exact application. (read more)

Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD films. Our Stoichiometric LPCVD Nitride can be a very effective insulator, and works great as a KOH etch mask when deposited over thermal oxide. (read more)

Rogue Valley Microdevices is an industry leader for high quality LPCVD films. You can order LPCVD Nitride as thick as 5μm or as thin as 100Å! Low Stress LPCVD Nitride is one of our most popular films and is often used for building Membranes, Cantilever Beams and other mechanical structures. (read more)