Product Announcements: Solder

Do you struggle with your solder paste to get consistently good, strong joints due to thinner stencils, smaller components, and smaller boards? Try Indium Corporation's Solder Fortification Preforms. We provide the right alloy with the right volume of solder in tape & reel that will integrate easily into your process. (read more)

Indium Corporation's Indium8.9HF-1 is a probe-testable, no-clean, halogen-free, Pb-free solder paste that eliminates graping and head-in-pillow defects. Its unique activator package and outstanding oxidation barrier allows it to coalesce and wet as good as, or better than, its halogen-containing counterparts. It also has unsurpassed print transfer efficiency and response-to-pause printing. (read more)

S-Bond® active solders are a versatile bonding agent that makes the production of sputter targets easier, less costly while offering higher bond performance for most sputter target and backing plate materials. (read more)

S-Bond Technologies' Active Solder alloys are modifications of conventional solder alloys that wet and bond without the use of flux. All are lead and cadmium free. They are uniquely suited for bonding a wide range of materials, such as Al-Al, titanium-sapphire, glass & ceramic to metal, etc. Reliable hermetic bonding at temperatures lower than brazing. (read more)

Addressing the latest topics in electronics, medical, aerospace, defense and other markets that rely on soldering and bonding for their products. (read more)

The choice of the right solder alloy can affect the manufacturing process, the cost, and the field performance of your product. Initially it was thought that the move to Pb free solders was just a matter of changing reflow profiles but major issues such as tin whiskers, brittle intermetallic layers and other concerns soon pushed solder selection into the forefront. (read more)

Indium Corporation manufactures custom solder to match your specifications. (read more)

Metallic Resources' high purity MetaWire Cored Wire Solder is available in RA, RMA, Water Soluble, and No Clean formulations. Standard packaging is on one pound spools, packed 12 spools per case, in .015", .020", .032", and .062" thickness. (read more)

Available in No Clean, Water Soluble, and RMA fluxes, Metallic Resources MetaPaste is manufactured from a proprietary flux chemistry which reduces voiding to between 2-12%. Superior tack time and stencil life create solder pastes that consistently outperform others. (read more)

Metallic Resources' lead free bar solders are manufactured from electrolytically processed tin and other elements to create solder so pure it far exceeds most specifications. All common industry accepted alloys are offered as well as other customer preferred variations on the tin/silver and tin/silver/copper combinations. (read more)