Product Announcements: Wafer and Thin Film Instrumentation

StellarNet, Inc. announces a new line of Thin Film measurement systems starting as low as $10k. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)

Performing multiple tasks in a variety of ways is fundamental to today's semiconductor manufacturing environment.

Based on the above concept, Olympus has developed a Dual-Engine solution - an Inspection-Engine and an Analysis-Engine - to provide flexibility to respond to future needs as they evolve. This will allow the automation of inspection/analysis in the semiconductor field to... (read more)