Go to GlobalSpec.com Home
 

Free Registration 
GlobalSpec Home
Find:      Advanced >>
Alert   Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics)


Product Announcements: Thermoset Adhesives
11 Browse Product Announcements

Search Product Announcements:     Advanced Search


Product Announcements 1 - 2 of 2
Valtech Corporation - Valtech's Epoxy Adhesives Used for Ingot Slicing
Valtech's Epoxy Adhesives Used for Ingot Slicing

Valtech Corporation manufactures two component epoxy adhesives used in the semiconductor and photovoltaic industry for ingot slicing applications. (read more)

More product announcements from Valtech Corporation
Master Bond, Inc. - Snap Cure-Conductive Adhesive Performs Up To 400°F
Snap Cure-Conductive Adhesive Performs Up To 400°F

Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)

More product announcements from Master Bond, Inc.
 
 
View Thermoset Adhesives datasheets.