Product Announcements: Thermal Compounds and Thermal Interface Materials

NON-Reflow TIMs? Reflow TIMs? Liquid metal, Compressible TIM and Burn-in Thermal Interface Materials..... Solder Preforms and Fluxes. Whatever your project turn to Indium's team to assist in selecting the best solution.... Access our Thermal Blog for insight (read more)

SOLAR Materials Science Blog - When Connections Count^SM (read more)

Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. (read more)

Minteq Pyrogenics Group PYROID® Pyrolytic Graphite (PG) is a specialized, "five-nine" purity, chemical vapor deposition (CVD), carbon products grown atom-by-atom with unique thermal, electrical and chemical properties. (read more)

MINTEQ Pyrogenics Group - Recent test results indicate laser diodes are able to increase their output by more than 50% with Pyroid^® HT heat spreader. (read more)

Master Bond's FL901AO is a thermal adhesive film, formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. It cures quickly at moderate temperatures to a high bond strength, no-mess solution to electronic assembly and other industrial operations. (read more)

No-cure, 1-part thermal paste (grease) DP series:

*Easy to apply: 1-part, no-cure.
*Running and vaporization problems to nearly disappear due to cross-linked particle structure.
*High thermal conductivity up to 6.5 W/mK.
*REP-100 to retain electromagnetic noise absorption property. (read more)

Thermal pads are superior in efficiency and last longer than thermal paste - a commonly used material for computer processors and other heat-sensitive components. (read more)

EMPV and EMPV2 series serves thermal and EMI dual fucntion with silicon free feature. This silicon-free material eliminates concerns over contact failure due to siloxane gas. Also this conforms to a great variety of secondary processing such as enhancement in performance by compounding magnetic foils. (read more)

Our IMFP - flexible thermal filler pad comes uncured in 2 parts. This provides high thermal conductivity and mechanical cushioning by conforming to uneven surfaces. This can be removed when service is required. (read more)