Product Announcements: Sensor Chips

The USI thermal conductivity gas sensor incorporates advanced design innovations in MEMS (Micro-Electrical-Mechanical-Systems), and was developed and manufactured in Silicon Valley (read more)

The MEMS integrated sensor chip can be readily combined with a signal conditioning circuitry chip for amplification, offset compensation, linearity improvement, and temperature compensation. All parameters for amplification, offset compensation, linearity improvement, and temperature compensation are stored in an internal EEPROM. No additional components required.... (read more)

Capacitive touch sensing IC developed to be highly tolerant of its working environment. (read more)