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Advancements in components for batteries, diodes and LED's, and innovations in consumer and commercial products.
Marking Systems, Inc.

The fabrication services provided by Marking Systems, Inc. include all aspects of product design and manufacturing for custom membrane switches. Read more...

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Twilight Technology Inc.

Twilight Technology has established automated manufacturing flows and processes to address the wide range of customer needs in the Military, Aerospace, industrial, and commercial market segments. Read more...

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Twilight Technology Inc.

As the problem of component obsolescence increases, die banking has become a low cost, effective solution to guarantee component supply for long product life programs. The die banking service supplies and stores die in controlled conditions until the wafers (raw die) are cut into individual die for final packaging and test. Read more...

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Solid State Devices, Inc.

SSDI has earned a reputation for excellence in supplying custom high power and high voltage semiconductors and modules to the military/aerospace industry for over 45 years. We specialize in high reliability application specific products with competitive pricing and on-time delivery. Read more...

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PA&E

This electronic packaging alternative offers engineers a lightweight option with high thermal conductivity. Read more...

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PA&E

From lightweight aluminum and titanium to robust Kovar, PA&E designs and manufactures hermetic electronic packaging to meet your environmental need. Read more...

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PA&E

The combination of titanium and Mo/Cu or AlSiC is ideal for achieving lightweight, low-coefficient of thermal expansion (CTE), and high-thermal-conductivity electronic packages. Read more...

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PA&E

Precision machined, solder-free microwave packages protect sensetive electronics in the harshest environments Read more...

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PA&E

We are your one-stop-shop for manufacturing custom hermetic laser packages complete with integrated DC connectors, windows/lenses and heat-sinks to keep things cool. All laser-weld construction eliminates solder fatigue as a point of failure and material options like Ti, Al or stainless steel provides design flexibility. Read more...

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PA&E

Solve thermal management & weight issues with unique technology for integrating Mo/Cu heat sinks into titanium electronic packaging. These heat sinks are strategically placed where heat is generated and do not compromise a package's hermetic integrity, so engineers can efficiently optimize designs for maximum heat dissipation and CTE without compromising weight. Read more...

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