The Programmable SE-4PD, SE-2PTD and SE-4PTD Machines provide dual programming capabilities. A “Pipe” program for making Saddle Cuts, Offset Cuts, Laterals and Miters. A second (selectable) program is used for cutting customized shapes in pipes. Read more...More Product Announcements from BUG-O Systems, Inc.
No other metal is as versatile as indium metal. In its various forms it is used for:
- Sealing in cryogenic applications - stays malleable and ductile below -150°C
- Soldering or fusing applications - alloys melt at temperatures ranging from 6.5°C to 310°C
- High-end device cooling - reduces operating temperatures by up to 10°C
Indium Corporation - manufactures custom filler alloys and consumables to match your specifications. Alloy systems liquid at room temperature have a high degree of thermal conductivity far superior to ordinary non-metallic liquids. This results in the use of these materials for specific heat conducting applications. Read more...More Product Announcements from Indium Corporation
One of the key hurdles in new product development is being able to test a variety of options at a reasonable cost. Indium Corporation's Solder Research Kits provide you with the means to experiment with various solders. Kits available include: Solder Paste Solder Wire Solder Ribbon with fluxes that range from 102°C-350°C. Read more...More Product Announcements from Indium Corporation
Indium Corporation - Solder preform placement is tremendously faster using InTEGRATED® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume... Read more...More Product Announcements from Indium Corporation
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semi... Read more...More Product Announcements from Indium Corporation
Indium Corporation - Since the NanoBond®process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation temperature and remove oxides.) So, because this is a fluxless soldering application, surface choice and preparation become very important. Read this article in the series on Nanofoil® thin... Read more...More Product Announcements from Indium Corporation
Indium Corporation - The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials. Read more...More Product Announcements from Indium Corporation
Versatile GO-FER III Kits make straight-line welding and cutting more efficient and economical. Produce machine quality welds and cuts in any plane or position with a portable drive on magnetic track. Read more...More Product Announcements from BUG-O Systems, Inc.
The K-BUG 4000 digital, compact fillet welder creates continuous or intermittent “stitch” welds at a constant travel speed producing high quality, uniform welds in a fraction of the time required for manual welding. Digital programming of travel pattern and weld control eliminates excessive weld deposition and helps reduce defects. Read more...More Product Announcements from BUG-O Systems, Inc.