"Accuracy in a Small Package"
The Mini-H Series (Model MH1650) is a cost-effective solution for smaller applications, while not sacrificing any structural features of a larger and more advanced H Series Thermal Press. A robust "H-Frame" design can maintain planarity between the thermal tooling and the part holding fixturing, even in forces up to 1000 pounds! Just like all of our T... Read more...More Product Announcements from Thermal Press International, Inc.
"Low-Cost Convenience for Prototyping"
The Manual Thermal Press or "Hand Press" series (Model MTP & MTP-C) are versatile test laboratory-style machines for non-production or prototyping applications. It is a cost effective solution for many prototyping applications and/or for extremely low production volumes. Like all of our other lines of Thermal Press systems, it is fully in... Read more...More Product Announcements from Thermal Press International, Inc.
Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, & tin-silver solder bumps & copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, in San Francisco Read more...More Product Announcements from Indium Corporation
Indium Corporation - The portable electronics industry has ongoing challenges to improve drop-shock performance without sacrificing thermal cycling performance, reduce need for expensive board-level underfills (and associated material, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs. Read more...More Product Announcements from Indium Corporation
The ideal solution for all necessary marking, reading and verification. Today, we have more laser choices than ever before. The laser proliferation has become so intense that selecting the proper laser for a specific application requires extensive knowledge and experience. Read more...More Product Announcements from Isotech, Inc.
Alpha, the world leader in the production of electronic soldering materials, has developed an innovative low temperature alloy, ALPHA® SBX02, which can simplify PCB assembly process by enabling wave soldering to be eliminated. Read more...More Product Announcements from Alpha
How To Do Heat Sealing of Heat Seal Connectors (HSC) for PCBs, LCDs, Hot Bar Solder Bonding, Thin Film Plastics, Machine Applications, and Procedures. Read more...More Product Announcements from Thermal Press International, Inc.
Indium Corporation - manufactures custom filler alloys and consumables to match your specifications. Alloy systems liquid at room temperature have a high degree of thermal conductivity far superior to ordinary non-metallic liquids. This results in the use of these materials for specific heat conducting applications. Read more...More Product Announcements from Indium Corporation
Indium Corporation - Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace. Read more...More Product Announcements from Indium Corporation
Indium Corp. Introduces a full line of soldering products that satisfy IPC’s J-STD004B stricter requirements for measuring halogens and electromigration risk. Indium Corporation’s full line of PCB assembly products specifically designed to meet new international standards, which help to improve both first pass yields and long-term reliability. Read more...More Product Announcements from Indium Corporation