Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...More Product Announcements from Indium Corporation
Advanced Technology Supply, Inc. can supply tape products and rubber products that meet Mil Spec requirements. Read more...More Product Announcements from Advanced Technology Supply, Inc.
Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...More Product Announcements from Indium Corporation
Indium Corporation's CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-efficiency CIGS (CuIn Gadi-selenide) solar cells. CIG targets offer tight control of the final solar cell composition. This is due to our unique process that results in a fully alloyed and completely homogenous CIG alloy Read more...More Product Announcements from Indium Corporation
Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages... Read more...More Product Announcements from Indium Corporation
Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...More Product Announcements from Indium Corporation
INTs can be used to strengthen composite materials and to simultaneously improve their elastic and thermal properties. INTs increase the wear resistance of host matrices. They also reinforce polymer microfilaments and nanofibers. Read more...More Product Announcements from Nanotech Industrial Solutions
DeWAL Industries will again be exhibiting at the IWCS Conference in 2016. It will be held in Providence, RI October 2nd through 5th, 2016 at the Providence Convention Center. Read more...More Product Announcements from DeWAL Industries, Inc.
Fujipoly's Sarcon® 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer as well as a low-tac surface treatment. These features prevent die-cut holes from collapsing and help maintain original spec tolerances during final assembly. Read more...More Product Announcements from Fujipoly America Corp.
Introducing Momentive’s elite Adhesive line. Manufacturers of sophisticated electronics rely on Momentive to fill critical processing needs and supply vital properties to components from the circuit board to the display... Read more...More Product Announcements from R. S. Hughes Company, Inc.