Why Do Bonding Problems Happen — and What Can We Do to Prevent Them? Read more...More Product Announcements from Metal Cutting Corporation
Application: Lithium Ion Battery Applications
As an alternative to solid foils, these open area expanded materials will require less binder to adhere the active material to the electrode surface. The reduction in binder will result in better ion and electron flow for better rate capability and quicker recharge cycles. Read more...More Product Announcements from Dexmet Corporation
WHITE PAPER: Ensuring Pristine Microbumps in Dimensional Devices. Moore’s Law, the driving force of the semiconductor industry for the last 60 years, is beginning to slow. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices Read more...More Product Announcements from Indium Corporation
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...More Product Announcements from Indium Corporation
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source. A NanoBond® requires solder, whether it comes from a plating on the joining surfaces, additional solder preforms, or on the NanoFoil® itself. Read more...More Product Announcements from Indium Corporation
Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...More Product Announcements from Indium Corporation
FaradFlex® is used as a material for improving power delivery, reducing resonances and noise, major challenges that information and communication equipment must overcome. This enables higher processing speeds and higher capacity, in multi-layer printed circuit boards for high-speed transmission routers, servers, and supercomputers. Read more...More Product Announcements from Oak-Mitsui, Inc.
Understanding the properties of different electrode materials — including the infiltration, density, and other characteristics of alloys such as CuW — is critical to welding success. Read more...More Product Announcements from Metal Cutting Corporation
Free up PCB real estate and reduce overall impedance of the power distribution system with FARADFLEX®, Oak- Mitsui's revolutionary ultra thin Polymer film substrate capacitor plane for PCB fabrication. Oak-Mitsui's licenced Buried Capacitance™ technology eliminates the need for some discrete capacitors. Read more...More Product Announcements from Oak-Mitsui, Inc.