ELANTAS PDG, Inc.

Epoxylite®, Pedigree®, RanVar™, Sterling®, and CORONA-Protect® insulating resins are perfect for keeping your traction motors in top-performance condition day after day. Read more...

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Nanotech Industrial Solutions

NIS has extensive experience in blending different AW/AF Additive and Fully Formulated product lubricant formulations for various Extreme Pressure applications. NIS’s NanoLub® IF-WS₂ products are based on a patented platform technology of proprietary super strong tungsten disulfide (WS₂) multilayered nano fullerene-like particles. Read more...

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Indium Corporation

Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...

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Indium Corporation

Eric Bastow's presentation "A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-attachment", focuses on gold-tin alloys and their ability to meet the stringent requirements of current environmental legislation, as well as the challenges of assembling modern electronics devices. Read more...

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Indium Corporation

Indium Corporation's CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-efficiency CIGS (CuIn Gadi-selenide) solar cells. CIG targets offer tight control of the final solar cell composition. This is due to our unique process that results in a fully alloyed and completely homogenous CIG alloy Read more...

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Indium Corporation

WHITE PAPER: Ensuring Pristine Microbumps in Dimensional Devices. Moore’s Law, the driving force of the semiconductor industry for the last 60 years, is beginning to slow. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices Read more...

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Indium Corporation

Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...

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Indium Corporation

Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...

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Indium Corporation

Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...

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Indium Corporation

Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...

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