Marshield is very sad to say farewell to our Big Momma. She is a big beautiful Mobile Lead Lined Shielding Barrier with unruly dimensions of 7 1/2 feet tall and 6 feet wide ! Read more...More Product Announcements from Mars Metal Company
Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...More Product Announcements from Indium Corporation
Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...More Product Announcements from Indium Corporation
ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications. Read more...More Product Announcements from ELANTAS PDG, Inc.
Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated. Read more...More Product Announcements from Digi-Key Electronics
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source. A NanoBond® requires solder, whether it comes from a plating on the joining surfaces, additional solder preforms, or on the NanoFoil® itself. Read more...More Product Announcements from Indium Corporation
Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...More Product Announcements from Indium Corporation
Indium - 9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life (>8 hours), and can be used on devices down to 0.4 mm pitch. Read more...More Product Announcements from Indium Corporation
Servometer Five Step Manufacturing Process.
Watch how it Works! Read more...More Product Announcements from Servometer©, a Division of MW Industries