Indium Corporation

WHITE PAPER: Ensuring Pristine Microbumps in Dimensional Devices. Moore’s Law, the driving force of the semiconductor industry for the last 60 years, is beginning to slow. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices Read more...

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Indium Corporation

Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Read more...

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Indium Corporation

Indium Corporation - NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs SE... Read more...

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Indium Corporation

Indium Corporation announces a New Solder Paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semic... Read more...

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Indium Corporation

Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Indium Corporation developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi. Read more...

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Indium Corporation

Indium Corporation - These alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. They resist fatigue and exhibit one of the highest tensile strengths in the soldering world. Visit Indium Corporation at IMAPS in San Diego Sept 9-12th at booth 329 to learn how AuSn advantages... Read more...

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LADD Distribution

The word "common" is used to describe the DEUTSCH contact system because the contacts are used interchangeably in many DEUTSCH industrial connectors. The common contact system improves performance, reliability, and maintainability by reducing changes in the assembly of the wire harness. Read more...

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Alpha

Argomax® 8020 film from Alpha is specifically developed for die attachment using low pressure sintering process designed for high volume manufacturing. It is formulated using highly engineered silver particles, manufactured by Alpha Read more...

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Indium Corporation

TECHNICAL INSIGHT:

One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source. A NanoBond® requires solder, whether it comes from a plating on the joining surfaces, additional solder preforms, or on the NanoFoil® itself. Read more...

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DuPont™ Nomex® Energy Solutions

Designed specifically for liquid-immersed transformers, the DuPont™ Nomex® 900 Series provides an ideal insulation solution, helping to enable increased short and long term reliability, or reduced size and weight with greater power density. Read more...

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