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3G Communications Chips
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B&K Precision 
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TriQuint Semiconductor, Inc.
Colby Instruments, Inc.
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Products/Services for 3G Communications Chips
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3G, UMTS, and EDGE Chips - (14 companies)Third generation (3G) cellular communication chips include UMTS and EDGE chips. Universal mobile telecommunication system (UMTS) chips provide high-speed data access. Enhanced data rates for GSM evolution (EDGE) chips make GSM implementation easier... Learn More -
Network and Communication Chips - (389 companies)...specifications for network and communication chips include data rate, operating current, power dissipation and temperature junction. Many different IC package types are available. Examples include ball-grid array (BGA), chip-scale package (CSP), quad... Search by Specification | Learn More -
RF and Wireless Chips - (116 companies)RF and Wireless Chips Information. RF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications. There are seven device... Search by Specification | Learn More -
GPRS Chips - (18 companies)GPRS chips use general packet radio service (GPRS), a standard for wireless communication with a throughput rate of 115 kilobits per second. GPRS chips use general packet radio service (GPRS), a standard for wireless communications with a throughput... Search by Specification | Learn More -
Radio Transmitter ICs - (11 companies)...but are functionally similar to traditional radio transmitters. With radio transmitter ICs, the generated signals are sent to the media through a tiny antenna. Typically, this antenna is internal to the device, and is known as a chip antenna or embedded... Search by Specification | Learn More -
RF Transceivers - (250 companies)...direct-sequence spread spectrum. Others use frequency-hopping spread spectrum. Specifications. Important specifications for RF transceivers include data rate, sensitivity, output power, communication interface, operating frequency, measurement... Search by Specification | Learn More
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RF Receivers - (300 companies)Specifications. RF receivers vary in terms of performance specifications such as sensitivity, digital sampling rate, measurement resolution, operating frequency, and communication interface. Sensitivity is the minimum input signal required to produce a specified... Search by Specification | Learn More
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IC Interfaces - (413 companies)...and ZigBee or IEEE 802.15.4. Bluetooth chips also provide wireless connectivity in solution-on-chip (SoC) platforms that power short-range radio communication applications. Wireless IC interfaces are also described as using 3G or 4G technologies. 3G... Search by Specification | Learn More
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RF Transmitters - (257 companies)RF transmitters are electronic devices consisting of an oscillator, modulator, and other circuits that produce an RF signal. Search by Specification | Learn More
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Antennas - (991 companies)...applications, satellite communications and other high bandwidth microwave applications, the most common type of antenna is the dish. Other commonly available antenna styles include omnidirectional, directional, arrays, microstrip, panel, and whips... Search by Specification | Learn More
Product News for 3G Communications Chips
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Moxa Inc.
Integrated 3G RTU ControllerThe ioLogik W5348-HSDPA-C is a C/C++ programmable 3G RTU controller featuring a Linux/GNU platform adapted to remote data acquisition and condition monitoring. The main advantage of this open C platform is its user-friendly SDKs, which help economize installation and configuration time by reducing programming overhead for key areas such as I/O control and condition monitoring, interoperability with your SCADA/DB, and improving smart communication controls, including cellular connection and SMS... (read more)Browse Data Acquisition Datasheets for Moxa Inc. -
NuWaves Ltd.
HILNA 3GNuWaves' High Intercept Low Noise Amplifiers (HILNAs) are completely characterized over temperature, supply voltage, and frequency to meet the demanding requirements of state of the art systems. HILNAs are well suited for use in low noise applications, RF wideband front-ends, RF Preamplifiers, RF repeaters, and in military radios. (read more)Browse RF Amplifiers Datasheets for NuWaves Ltd. -
Cognex Corp.
New Checker 3G SeriesWouldn't it be great if you could use the same sensor for all your product verification tasks? This is now possible with the new third generation Checker® 3G vision sensors from Cognex. With Checker 3G, you choose whether the sensor is configured as a Presence sensor or Measurement sensor. Presence sensors verify that features are present. Measurement sensors verify that features are the correct height, width and/or diameter. In either mode it can perform multiple "checks" on each product you... (read more)Browse Vision Sensors Datasheets for Cognex Corp. -
Samtec Inc.
True75™ BNC System Optimized for 75 ohm 3G SDITrue75 ™ BNC Jacks (BNC7 Series) are available in vertical, right angle and edge mount orientations. A True75 ™ RG6 coax cable plug (RF6 Series) in straight and right angle orientations is also available. In addition to True75 ™ BNC connectors, Samtec's offers a variety of other systems optimized for 3G SDI, including Mini BNC, DIN 1.0/2.3, MCX, SMB Jacks and Plugs, Edge Rate ™ and Q Series® high speed interconnects, high density arrays, high speed I/O, edge card sockets... (read more)Browse RF and Microwave Connectors Datasheets for Samtec Inc. -
Atmel Corporation
GPS ChipsThe Atmel® car infotainment portfolio includes the widely-used Atmel ANTARIS ™ GPS chipset. The Atmel GPS chipset with its high-accuracy and AECQ-100 qualification is perfectly suited for various applications. Leading global car manufacturers, fleet management operators and telematics specialists rely on the Atmel GPS devices and value their robustness and reliability. The ANTARIS GPS 4 chipset embeds an RF receiver and a baseband IC. The 16-channel architecture offers excellent tracking... (read more)Browse GPS Chips Datasheets for Atmel Corporation -
Syfer Technology Limited
X2Y EMI Chips for Medical ApplicationsThe Syfer X2Y Integrated Passive Component is a 3 terminal EMI chip device. The revolutionary design provides simultaneous line-to-line and line-to-ground filtering, using a single ceramic chip. In this way, differential and common mode filtering are provided in one device. Capable of replacing 2 or more conventional devices, it is ideal for balanced lines, twisted pairs and dc motors, in automotive, audio, sensor and other applications. These filters can prove invaluable in meeting stringent... (read more)Browse EMI Filters and RFI Filters Datasheets for Syfer Technology Limited -
Magnetic Communication Corp.
RF Chip Inductor-RF Chip Inductor 0402 ~ 1210 size and inductance values range from 1nH to 47000nH with 2% tolerance. (read more)Browse Chip Inductors Datasheets for Magnetic Communication Corp. -
Magnetic Communication Corp.
RF Chip Inductor~RF Chip Inductor 0402 ~ 1210 size and inductance values range from 1nH to 47000nH with 2% tolerance. (read more)Browse Chip Inductors Datasheets for Magnetic Communication Corp. -
Magnetic Communication Corp.
RF Chip Inductor.RF Chip Inductor 0402 ~ 1210 size and inductance values range from 1nH to 47000nH with 2% tolerance. (read more)Browse Chip Inductors Datasheets for Magnetic Communication Corp. -
Magnetic Communication Corp.
RF Chip InductorRF Chip Inductor 0402 ~ 1210 size and inductance values range from 1nH to 47000nH with 2% tolerance. (read more)Browse Chip Inductors Datasheets for Magnetic Communication Corp.
Conduct Research
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Is that your video game ringing?
powered by a special chip from Emblaze Systems Ltd. in Israel. The screen on the Samsung device is said to have 16 million-color display capability and 1 million-pixel resolution, and will allow viewing video at 15 frames/sec. It is currently operational in Korea over a 3G wireless network...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
entertainment is a simulator that adds the physical sensation of motion to the virtual reality (VR) experience. Tektronix pursues test solutions for China's 3G China will finish testing a third-generation (3G) communications standard in the first half of this year and expects to launch 3G service...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
, June 20. Interoperability issues dog Bluetooth's rise Bluetooth wireless technology was rolled out in the form of chips, modules and systems at the Bluetooth Congress this past week. CDMA emerges as Asia's choice for 3G services Asian telecommunications companies are poised to launch services...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
? After only backing its own third-generation (3G) digital-cellular standard for some time, the San Diego-based...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Adicom stakes claim to key 3G patents Adicom Wireless has filed an intellectual property rights statement with the International Telecommunications Union (ITU) in a move that plants the company squarely in the way of anyone on a migration path to third-generation (3G) networks. Layoffs, revenue...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
(3G) mobile communications equipment as part of a proposed patent-licensing scheme. ASML urges industry effort on 157-nm lithography ASM Lithography NV (ASML) has called for an industry-wide effort to extend the use of optical lithography to the manufacture of integrated circuits using light...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
at Telecom 99, Marconi Communications Inc. and NEC Corp. showed optical advances that augured possibilities for mixing active optical backbone elements with effective packet/cell edge switching in the electrical domain. Packets go wireless in 3G cellular debut New handsets and chip sets...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
the company's entire business. Instead, the investigation strictly involves Applied's technology licensing business, according to a spokesman from Applied, based in Santa Clara, Calif. Commentary & analysis of week's chip news Philips aims telecom ASICs, co-processors at 3G phones NOORDWIJK...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
3G intellectual property licensing strategy comes under fire Proponents of third-generation (3G) cellular telephony are setting up an independent company to oversee intellectual-property claims for 3G technology. But the move is already drawing fire from some observers, who say the effort lacks...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
rival, according to an Associated Press report. Vimicro, Bird to develop 3G terminals Fabless Chinese semiconductor company Vimicro Corp. has signed a technology collaboration agreement with Chinese mobile phone maker Ningbo Bird Co., to develop multimedia terminals that comply with existing 3G...
Engineering Web Search: 3G Communications Chips
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Communications - Infineon Technologies Communications Home Energy Efficiency Infineonâ??s power-saving communications chips can reduce power costs in central offices. See Infineon Technologies Corporation Information |
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FreeBSD 7.3-RELEASE Hardware Notes The ahc(4) driver supports the following SCSI host adapter chips and SCSI controller cards: |
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Multiplexing - Wikipedia, the free encyclopedia Multiplexing originated in telegraphy, and is now widely applied in communications. |
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Qualcomm - Wikipedia, the free encyclopedia 5 Legal issues 5.1 Qualcomm's role in 3G 6 Products |
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Ad Hoc Wireless Networking Links (see also Home Networking) 1394 Trade Association (Firewire) [added 3/23/04 3G Americas (GSM family of wireless technologies) [updated 1/28/04 ACM |
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Wireless Ad Hoc Networks Bibliography K.-W. Chin, et al., "Implementation Experience with MANET Routing Protocols," ACM SIGCOMM Computer Communications Review, Nov. 2002, pp. 49-59. |
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Broadcom.com - Broadcom Unveils Next Generation of Popular... BRCM), the leading provider of silicon solutions enabling broadband communications, today announced the Broadcom® AirForce? BCM4712 system-on-a-chip, See Broadcom Corporation Information |
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Broadcom.com - Press Releases 02/15/12 - New Combo Chips from Broadcom Accelerate Transition to Dual-Band Wi-Fi for Mainstream Smartphones and Tablets See Broadcom Corporation Information |
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Free Embedded Systems Tutorials - FPGA RTOS AdvancedTCA and... |
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Radio-Electronics.com: resources and analysis for electronics... GlobalPlatform releases security upgrade for smart card chips |
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