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Supplier: TE Connectivity
Description: : Vertical Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 35 Contact Layout : Staggered Contact Mating Area Plating Material : Silver
- Applications: Residential / General-Purpose
- Current Rating: 35 amps
- Mounting Style: PCB Mounted
- Operating Temperature: -40 to 105 C
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Supplier: TE Connectivity
Description: : 6.3 MM [.248 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3.8 MICM [149.606 MICIN ] Dimensions
- Contact Plating: Other
- Contacts Pitch: 5 mm
- Current Rating: 16 amps
- Mounting: Other
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Supplier: TE Connectivity
Description: Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 45 Contact Layout : Inline Contact Mating Area Plating Material : Silver
- Applications: Residential / General-Purpose
- Current Rating: 45 amps
- Mounting Style: PCB Mounted
- Operating Temperature: -55 to 105 C
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Supplier: TE Connectivity
Description: Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 45 Contact Layout : Matrix Contact Mating Area Plating Material : Silver
- Applications: Residential / General-Purpose
- Current Rating: 45 amps
- Mounting Style: PCB Mounted
- Operating Temperature: -55 to 105 C
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Supplier: Coilcraft, Inc.
Description: soldering Wide range of standard EIA inductance values Available in two sizes: 4.45 × 3.94 × 3.15 mm and 6.86 × 4.45 × 3.15 mm RoHS-compliant 260°C compatible. Terminations: tin-silver over copper COTS Plus tin-silver-copper and tin-lead terminations
- Applications: RF Inductor / Choke
- Core Material: Air
- Inductance Range: 0.0056 microH
- Inductance Tolerance: 1 to 5 (+/- %)
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Supplier: RS Components, Ltd.
Description: Screwlocking DIN Secure screwlock mechanism preventing accidental disconnection. Cable acceptance 6.0mm maximum. Tin plated contacts with UL94V-2 rated housings Number of Contacts = 8 Gender = Female Mounting Type = Cable Mount Connector Size = Standard Termination Method =
- Connector Type: DIN Connector
- Current Rating: 5 amps
- Gender: Female / Jack
- Geometry: Straight
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Supplier: RS Components, Ltd.
Description: Screwlocking DIN Secure screwlock mechanism preventing accidental disconnection. Cable acceptance 6.0mm maximum. Tin plated contacts with UL94V-2 rated housings Number of Contacts = 8 Gender = Male Mounting Type = Cable Mount Connector Size = Standard Termination Method =
- Connector Type: DIN Connector
- Current Rating: 5 amps
- Gender: Male / Plug
- Geometry: Straight
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Supplier: RS Components, Ltd.
Description: Types 4 and 5 screwlocking single piece panel mounting screwlock plugs and sockets with ring nut fixing and silver plated contacts. Secure screwlock mechanism preventing accidental disconnection. Cable acceptance 6.0mm maximum. Tin plated contacts with UL94V-2 rated
- Connector Type: DIN Connector
- Current Rating: 4 amps
- Gender: Female / Jack
- Geometry: Straight
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Supplier: RS Components, Ltd.
Description: Types 4 and 5 screwlocking single piece panel mounting screwlock plugs and sockets with ring nut fixing and silver plated contacts. Secure screwlock mechanism preventing accidental disconnection. Cable acceptance 6.0mm maximum. Tin plated contacts with UL94V-2 rated
- Connector Type: DIN Connector
- Current Rating: 4 amps
- Gender: Male / Plug
- Geometry: Straight
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Supplier: Win Source Electronics
Description: : Bronze Voltage Rating: 125 V Current Rating: 1 A Number of Contacts: 20 Gender: Receptacle Length: 26.3 mm Housing Material: Nylon Number of Circuits: 20 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: Natural Contact Resistance: 20 mO
- Current Rating: 1 amps
- Voltage Rating: 125 volts
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Supplier: Win Source Electronics
Description: : Bronze Voltage Rating: 125 V Current Rating: 1 A Number of Contacts: 10 Gender: Receptacle Length: 16.6 mm Housing Material: Polyamide Number of Circuits: 10 Orientation: Vertical Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mO
- Current Rating: 1 amps
- Voltage Rating: 125 volts
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Supplier: Win Source Electronics
Description: : Bronze Voltage Rating: 125 V Current Rating: 1 A Number of Contacts: 6 Gender: Receptacle Length: 12.3 mm Housing Material: Nylon Number of Circuits: 6 Orientation: Right Angle Contact Plating: Silver, Tin Housing Color: White Contact Resistance: 20 mO
- Current Rating: 1 amps
- Voltage Rating: 125 volts
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Supplier: Win Source Electronics
Description: Connector Type: Receptacle, Female Sockets Termination: Solder Fastening Type: Threaded Contact Material: Copper Tin Voltage Rating: 50VAC, 60VDC Ingress Protection: IP67 - Dust Tight, Waterproof Material Flammability Rating: UL94 HB Orientation: A Standard Package: 1
- Current Rating: 4 amps
- Voltage Rating: 50 to 60 volts
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Alloy: Tin-Silver (Sn-Ag)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 8.12E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: Indium Corporation
Description: Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
- Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag), Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Indium Corporation
Description: InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation. Applications InTEGRATED® Solder Preforms save assembly time and labor costs
- Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Preform
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Supplier: MacDermid Alpha Electronics Solutions
Description: ALPHA Lead Free Solder Spheres are designed for BGA, CSP, and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters. Product Overview ALPHA Tin Silver Copper Lead-Free Solder Spheres are made to the highest quality control
- Alloy: Tin-Silver (Sn-Ag)
- Lead Free: Yes
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Automatic soldering machine is an automatic soldering equipment, which mainly completes the soldering operation by using the motion function of the manipulator. The core part of the automatic PCB soldering machine is the soldering system. The soldering system is mainly composed of automatic tin (read more)
Browse Robots Datasheets for Foshan RTSTEC Automation Co., Ltd -
, Green, Blue, Gray and Violet. 3 styles manufactured by Keystone. Miniature type test points are made from .010"(.25) dia. Phosphor Bronze with Silver or Matte Tin (read more)
Browse Test Points Datasheets for Keystone Electronics Corp. -
is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
for easy wire entry. The lever on these two new devices is made of white UL94V-0 thermoplastic (RAL9003). The insulating body is made of Polyamide and is available in 8 different colors. Four solder pins per position are used for increased (read more)
Browse Terminal Blocks Datasheets for Omni Pro Electronics, Inc. -
electrical life of 10,000 cycles and a mechanical Life of 100,000 cycles. The 12.80mm x 5.80mm x 6.55mm DM3 Actuator and Housing/Cover are made of Polybutylene Terephthalate (PBT), UL94-V0. It has copper alloy contacts and copper alloy/silver plated terminals. As an authorized distributor (read more)
Browse DIP Switches Datasheets for New Yorker Electronics Co., Inc.
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HVAC: Equations, Data, and Rules of Thumb, Second Edition > Hydronic (Water) Piping Systems
Pipe: type “L” copper tubing, ASTM B88, Hard DrawnFittings: wrought copper solder joint fittings, ANSI/ASME B16.22Joints: solder joint with 95-5 tin antimony solder, 96-4 tin silver solder, or 94 - 6 tin silver solder , ASTM B32.
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Understanding Solids: The Science of Materials
etals Silver 428 Copper 403 Gold 319 Iron 83.5 Nickel 94 Titanium 22 Alloys Brass 106 Bronze 53 … … 29 wt% Cu, 4 wt% Fe) Lead– tin solder 50 Refractories Alumina 38 … … Porcelain 2 Polymers Nylon 6 ,6 0.25 0 …
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Lead-free Solders: Materials Reliability for Electronics
reflow soldering electromigration 356–8, 365–8 miniaturization 471–2 parameters 223–4 Restriction … … RoHS) 122, 233, 340–1 room-temperature whiskers 325– 6 , 332–3 root grooves 327–8 SAC see tin – silver –copper satellite control processors … … deformation 276, 278–84, 286– 94 thermomigration 427–34, 436 Scheil …
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IC Component Sockets
Non-noble contact plating, 69 silver , 68 solder , 6 9 tin , 69 Overstress failure, 16, 138 Pad, xi, 1, 11, 13, 14, 89, 97 … … mechanical strength, 57 solderability, 58 stress relaxation and creep, 57 Quad flat pack, 94 , 204 Qualification, xii, 17 …
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Effects of Ni addition to high-lead solders on the growth of Cu3Sn and micro voids
[5] I. E. Anderson, and J. L. Harringa, “Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints,” J Electron Mater, 35, pp. 94 -106, 2006. [ 6 ] F. Gao, T. Takemoto, H. Nishikawa, and A. Komatsu, “Microstructure .
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Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth
[ 6 ] I. E. Anderson, and J. L. Harringa, "Suppression of void coalescence in thermal aging of Tin - Silver -Copper-X solder joints," J Electron Mater, 35 , pp. 94 -106, 2006.
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Reliability of Microtechnology
… 100, 103, 109, 111, 112, 176, 189, 192–194 Shear strength, 75, 118, 119, 172 Shear test, 119, 172–174 Short circuit, 79, 91, 116 Silver flake, 76 Simulation, 4– 6 , 66, 78, 112, 127 … … SAC), 53–55, 117, 197 Solder , 4, 9, 11–13, 33 … … 40, 41, 46, 47, 58, 59, 61–65, 67, 71, 76, 78, 85, 87, 94 –96, 100–107, 109 … … 157, 175–176, 179, 198, 199 Thermo-mechanical stress, 37, 58, 71, 100, 120 Tin whisker, 119–121 Transition …
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Modern Electroplating 5th Edition
… acid copper electrodeposition, 40 Erythorbic acid bath, 492–493 Etching procedure: disadvantage of, 229 6 -Ethoxy-2-mercaptobenzothiazole … … noncyanide zinc baths, 288–289 Ethylene oxide (EO) groups: Raman shift, 177 European Union’s End-of-Life Directive, 240 Eutectic alloys: tin -lead alloys composition, 279–280 application, 279–280 Eutectic solder : material properties of, 142 … … of, 161 Eutectic tin– silver , 162 Evans diagram, 434 … … 152 ions, 152 iron electrodeposition, ferrous chloride bath, 312 nickel electroplating, functional applications, 94 solutions, copper electrodeposition …
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States > Minnesota > State > Regulations > Plumbing Board‚ Minnesota > [MNR 4715] 4715 - Plumbing Code
… 50 percent tin and 50 percent lead, 95 percent tin and five percent antimony, or 96 percent tin and four percent silver , conforming to ASTM Standard Specification for soft solder metal B32- 94 , except that 50 percent tin and 50 percent lead … … 76; 28 SR 146; L 2007 c 140 art 4 s 61; art 6 s 15; art …
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Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids!
1958 ( 6 ), pp. 1- 7 19. Meyer, R., "Pressure and Vacancy-Flow Effects on the Kirkendall Shift in Silver -Gold Alloys", Phys. Rev. 181 (1969), pp. 1086- 94 21. … and Low S., "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints", Online Research … Haimovich, J., "Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100°C", AMP …