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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
EPOXY6351 National Microchip Not Provided Not Provided Not Provided
EPOXY 907 ASAP Semiconductor RAYTHEON AIRCRAFT Not Provided Not Provided
EPOXY BLACK DP-270 Quist Electronics MISC Not Provided Electronic Applications
DP460 EPOXY Quist Electronics 3M Not Provided 1.7 OZ/48 GRM TUBE
7351UT/EPOXY National Microchip 0 Not Provided Not Provided
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Conduct Research Top

  • Epoxy
    and fatigue resistance. Epoxies have excellent electrical, thermal, and chemical resistance. Their strength can be further increased with fibrous reinforcement or mineral fillers. The variety of combinations of epoxy resins and reinforcements provides a wide latitude in properties obtainable in molded
  • Tg - Glass Transition Temperature for Epoxies
    The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material. to a soft, rubbery material. As epoxies are thermosetting materials and chemically cross-link. during the curing
  • Science + Sucrose=New Liquid Epoxies
    By changing the molecular structure of sugar, scientist can make it into a powerful liquid epoxy that binds concrete, wood, metals, plastics, and other materials. Chemist Navzer Sachinvala demonstrates some of the raw materials and the sucrose-based epoxies used. Sugar is still a favorite sweetener
  • Epoxy and Silicone Interactions
    chemistries that may be used within the same design. ./59c070bd-373a-441d-88cb-68bf3f8aa78a Tech21. Tip. Epoxy and Silicone. Interactions. What > Epoxy and. Silicone Interactions. Epoxy adhesives are a great choice for many applications for their excellent adhesion,. Why > Epoxies
  • B-stage Epoxy
    in ferrules. • Semiconductor Packaging. • PCB level. ◦ Flip chip processes - flip chip on board,. ◦ Pre-appling epoxy on heat sinks. on glass, in package. ◦ Wafer passivation enabling 3D. stacking, wafer back side adhesive. Available Formats of B-stage Epoxy Adhesives. B-stage epoxies are available
  • Epoxies Used in Tensile Testing: Film vs. Liquid-Why is There a Difference? (.pdf)
    and. for tensile testing. The identified problem was penetration of. optical microscopy work performed to determine how the. the epoxy into the “very porous” abradable coating resulting in. epoxies affected the coatings and if the epoxy infiltration. “strength improvement” by supporting the structure before
  • Using Mold Release Agents with Epoxy Adhesives
    Epoxy adhesives are universally known for their high strength and toughness in bonding. a wide variety of substrates found in semiconductor and electronics assembly. Although an epoxies inherent nature is to provide a strong bond, there may be some areas where adhesion is unwanted or unintended
  • Proper Mixing & Handling Of Epoxies
    Mixing and. handling epoxies properly. eases the application process. and increases the chances of. achieving a good bond.
  • Dielectric Properties of Epoxies
    barrier between two conductors (as in cross over and multi-layered. circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
  • Epoxy (EP) Resins
    Epoxy (EP) resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally cured or thermoset one-part epoxies are also available

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