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  • MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31)
    While it is a radical departure from the typical clean technologies that make up most of the IC manufacturing process, chemical mechanical planarization (CMP) using multipart abrasive slurries has become a key technique in enabling the development and production of sub-quarter-micron devices. First

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