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Conduct Research Top

  • Heat Sinking Relative to Alumina Chips and Aluminum Nitride Chips
    . of thermal management planned for the device. Aluminum Nitride (ALN) chip. resistors of SG style. Thus, IMS alumina chips are rated. Data points were. (power) under free air conditions,. taken on ANX series. which means that alumina chips will. chips* at substrate. handle much more power than what
  • Nitride (AIN, BN)
    Nitride ceramics are compounds of a metal or metalloid (Si, B) and nitrogen such as titanium nitride (TiN), silicon nitride (Si3N4), boron nitride (BN) or aluminum nitride (AlN). Nitrides are relatively inert and have good thermal conductivity combined with high electrical insulation capability
  • Ceramic Substrates
    materials in varying purity levels for a number of different uses in electronics. Contact our experts. Substrates made from Alunit® Aluminum Nitride Ceramics. Alunit® – the Coolest Solution for maximum Electronics Performance. Achieving maximum performance in the smallest possible space inevitably
  • Design Guidelines - Thick Film Resistors and Patterned Substrates
    Guidelines apply to both Al2O3 and ALN (Aluminum Nitride) substrates unless otherwise noted. Dimensions are in inches unless otherwise stated. The above are guidelines only and not to be construed as ultimate limitations. Any listed parameter may be improved if other related parameters can
  • Comparison of RF Terminations with BeO and ALN Substrates
    the use of BeO, though, has necessitated the search for alternative materials that do not have the toxicity associated with beryllia. Aluminum Nitride (AlN) has emerged as the best current candidate to replace BeO in these applications. This paper delineates the issues involved and provides two examples
  • Effect of Pulsing Parameters on the P-CFUBMS of Chromium Aluminum Nitride Coatings (.pdf)
    )Japan poster.ppt Effect of Pulsing Parameters on the P-CFUBMS of. Chromium Aluminum Nitride Coatings. J.Lin1, J.J.Moore1, B.Mishra1, M. Pinkas1, W.D.Sproul1, J.A.Rees2. 1Advanced Coatings and Surface Engineering Laboratory, Colorado School of Mines, Golden, CO. 2. ISSP2007. Hiden Analytical Ltd
  • Power Handling of AIN vs. Al203
    Thermal conductivity of a ceramic substrate is an important element when considering the differences between AlN (aluminum nitride) and Al2O3 (alumina). A brief explanation and basic equations follow. The thermal conductivities of each of the ceramics are: [1] Kn = 170-190 (W/m °C) AlN [2] Ka = ~25
  • Electronics and Electrical Applications
    experts. Substrates made from Alunit® Aluminum Nitride Ceramics. Alunit® – the Coolest Solution for maximum Electronics Performance. Achieving maximum performance in the smallest possible space inevitably causes electronic components to develop increasingly high temperatures. This heat must

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