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  • MICRO: Product Tech News
    The BedeScan digital x-ray inspection tool identifies and quantifies structural defects in semiconductor wafer substrates and epilayers. The high-speed mapping tool uses nondestructive x-ray diffraction to identify a wide range of anomalies in both incoming and processed wafers up to 300 mm
  • MICRO: Building Copperopolis II by Israel Ybarra Jr. (Jan 2000)
    , and all metrology tools that handle copper-processed wafers. Based on extensive data, this article investigates the spin-process contamination elimination (S CE) technology developed by SEZ (Villach, Austria and Phoenix), an effective means of eliminating copper from the wafer backside, bevel/edge
  • MICRO: Surface Conditioning - Hakanson (March 2000)
    manufacturing, CMP is employed to reduce topography and planarize patterned layers, alumina (Al ) films, and films with various concentrations of nickel and iron. In semiconductor manufacturing, CMP is used to reduce topography and to polish tungsten, aluminum, copper, and silicon oxide layers. Apart from
  • New Materials - New Reliability Issues
    engineers continue to need a better. understanding of the Time Dependent Dielectric Breakdown (TDDB) phenomena. As gate. oxide thickness approaches mono-layer dimensions, TDDB studies are focusing on subatomic. level defects. Defects in gate oxides are no longer considered “thin spots” in the gate
  • Medical Device Link .
    of 20,000 rpm and has a 30-hp spindle can perform rough cutting and finished cutting from the same spindle. Supplied by , the FV105A's rapid cutting and feeding rates, combined with its powerful spindle, allow cutting of a range of materials from aluminum to titanium. In addition, the center's speed
  • Medical Device Link .
    . Other mechanically ground aluminum oxide ceramic knives cost between $100 and $200. Wafer techniques, however, promise to produce knives with sharpness, durability, and reusability approaching those of diamond, and for a fraction of the price. According to Scott Rader, assistant professor
  • Stability of Silicon Photodiodes for Laser Emission Measurements (.pdf)
    structure, imperfect. simple instrumentation for user monitoring and regulatory purposes. lead bonding to the junction, and imperfect die bonding of the silicon. These instruments must be capable of being accurately calibrated and. wafer to the metal header. If the photodiode is operated
  • Texture and Microstructure Investigation of Cu Damascene Interconnects (.pdf)
    } texture increases the resistance of electromigration failure and this failure can be. correlated with the frequency of the occurrence of CSL (coincidence site lattice) boundaries or. low or high diffusivity boundaries and the strength of {111} texture in aluminum thin films. However

More Information on: Aluminum Oxide Wafer Top

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