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  • Description: Aluminum Oxide is a typical artifical abrasive having larger tenacity without impurities. It is characterized by its hardness, toughness and uniformity in size. Hardness Mohs Scale: 9.8 Specific Gravity: 3.9 Color: Light Brown / White Applications: Brass Parts, Valve Parts, Silicon Wafers

    • Type / Shape: Abrasive Grain / Grit
    • Material / Composition: Ceramic

  • Supplier: Insaco, Inc.

    Description: Custom aluminum nitride substrates or parts machined to your specifications

    • Material Form: Ceramic / Inorganic, Fabricated Part / Shaped Stock, Film / Sheet, Hollow / Tubular Stock, Plate / Board (e.g., Fiberboard), Wafer / Substrate
    • Features: Electronics / Semiconductors, Electrical Power / HV
    • Applications: Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials, Structural, Wear Parts / Tooling
    • Material Type: Aluminum Nitride, Specialty Ceramic

  • Supplier: Insaco, Inc.

    Description: Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors.

    • Applications: Electrical / HV Parts, Electronics / RF-Microwave, Structural, Wear Parts / Tooling
    • Material Type: Alumina / Aluminum Oxide, Sapphire
    • Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
    • Performance Features: Machinable, Single Crystal

  • Supplier: Insaco, Inc.

    Description: Alumina (Al2O3) is one of the most widely specified, general-purpose technical ceramics. All aluminas are very hard and wear resistant, with high compressive strength even against extreme temperatures and corrosive environments. Aluminas are also excellent electrical insulators and are gas tight.

    • Material Form: Ceramic / Inorganic, Fabricated Part / Shaped Stock, Film / Sheet, Hollow / Tubular Stock, Plate / Board (e.g., Fiberboard), Wafer / Substrate
    • Features: Electronics / Semiconductors, Electrical Power / HV
    • Applications: Electrical / HV Parts, Electronics / RF-Microwave, Structural, Wear Parts / Tooling
    • Material Type: Alumina / Aluminum Oxide

  • Supplier: CoorsTek

    Description: Transportation CoorsTek offers a line of special ceramics that take advantage of higher dielectric properties, such as GPS and microwave applications. These applications are becoming more extensively used in the transportation industry for location and guidance systems. Through CoorsTek, California

    • Material Form: Composite, Fabricated Part / Shaped Stock, Wafer / Substrate
    • Features: Electronics / Semiconductors
    • Material Type: Alumina / Aluminum Oxide
    • Applications: Dielectric / Electrical Insulation, Electronics / RF-Microwave, Wear Parts / Tooling, Other

  • Description: with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finish. High Temperature Applications Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the toughest high temperature applications such as plasma arc

    • Material Type: Boron Nitride
    • Shape / Form: Fabricated / Custom Shape
    • Performance Features: Machinable
    • Applications: Dielectric / Electrical Insulation, Refractory / High Temperature Materials, Thermal Insulation / Fire Proofing, Wear Parts / Tooling

  • Supplier: Vanpro Inc.

    Description: Vanpro offers specialized manufacturing services for companies in the Medical, Defense and Communications, and Wafer Processing industries. In our perpetually shrinking and increasingly faster-paced world, Vanpro has positioned itself on the cutting edge by transitioning to a complete Tier One

    • Materials: Aluminum, Brass, Cast Iron, Composites, Hardened Metals, Magnesium, Nickel / Nickel Alloys, Plastics, Stainless Steel, Steel / Steel Alloys, Titanium, Other
    • Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Swiss Machining, Water / Abrasive Jet Machining, Jig Boring, Broaching, Deep Hole Drilling, Centerless Grinding, Double-disc Grinding, ID / Internal Grinding, OD / External Grinding, Jig Grinding, Surface Grinding, Honing, Electrode EDM, Wire EDM,
    • Secondary Operations: Anodizing, Black Oxide, Electroplating, Heat Treating / Stress Relieving, Lapping / Polishing, Painting / Powder Coating, Welding, Other
    • Specialty Machining: Casting Machining, CNC Machining, Forging Machining, Gear Manufacturing, Jigs and Fixtures, Thread Rolling, Tool & Die Manufacturing

  • Description: Parallel-beam batch type and load-lock type sputter systems. Series models include batch types, simple load-lock types with a linear input mechanism, and tray-transfer load-lock types.

    • Materials Processed (Deposit or Substrate): Metal, Dielectric / Ceramic, Aluminum, Silicon, Germanium, Silicides, Compound Semiconductors / GaAs, Nitrides / TiN, Oxides, Tungsten / Refractory Metal, Other
    • Coating System Type: Batch System (Single Chamber / Multiple Wafers)
    • Technology / Process: Physical Vapor Deposition (PVD), Plasma Etching / Cleaning
    • Applications & Materials Processed: Semiconductor Manufacturing, Flat Panel Display, Optical Coatings, Photovoltaic / Solar, Magnetic Storage, Research / Surface Analysis, Other

  • Supplier: Tethis S.r.l.

    Description: The Pulsed Microplasma Cluster Source (PMCS) is a high-intensity nanoparticle source, for vacuum thin film deposition. Two vacuum chambers compose the deposition system: the expansion chamber for the supersonic beam generation and the deposition chamber for the collection of the nanoparticles over

    • Materials Processed (Deposit or Substrate): Metal, Aluminum, Diamond-like Carbon (DLC), Nitrides / TiN, Oxides, Tungsten / Refractory Metal
    • Coating System Type: Cluster Tool (Multi-Chamber / Single Wafer), Factory / Free Standing 
    • Technology / Process: Physical Vapor Deposition (PVD)
    • PVD Processes: Evaporation - Electron Beam

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Conduct Research Top

  • MICRO: Product Tech News
    The BedeScan digital x-ray inspection tool identifies and quantifies structural defects in semiconductor wafer substrates and epilayers. The high-speed mapping tool uses nondestructive x-ray diffraction to identify a wide range of anomalies in both incoming and processed wafers up to 300 mm
  • MICRO: Building Copperopolis II by Israel Ybarra Jr. (Jan 2000)
    , and all metrology tools that handle copper-processed wafers. Based on extensive data, this article investigates the spin-process contamination elimination (S CE) technology developed by SEZ (Villach, Austria and Phoenix), an effective means of eliminating copper from the wafer backside, bevel/edge
  • MICRO: Surface Conditioning - Hakanson (March 2000)
    manufacturing, CMP is employed to reduce topography and planarize patterned layers, alumina (Al ) films, and films with various concentrations of nickel and iron. In semiconductor manufacturing, CMP is used to reduce topography and to polish tungsten, aluminum, copper, and silicon oxide layers. Apart from
  • New Materials - New Reliability Issues
    engineers continue to need a better. understanding of the Time Dependent Dielectric Breakdown (TDDB) phenomena. As gate. oxide thickness approaches mono-layer dimensions, TDDB studies are focusing on subatomic. level defects. Defects in gate oxides are no longer considered “thin spots” in the gate
  • Medical Device Link .
    of 20,000 rpm and has a 30-hp spindle can perform rough cutting and finished cutting from the same spindle. Supplied by , the FV105A's rapid cutting and feeding rates, combined with its powerful spindle, allow cutting of a range of materials from aluminum to titanium. In addition, the center's speed
  • Medical Device Link .
    . Other mechanically ground aluminum oxide ceramic knives cost between $100 and $200. Wafer techniques, however, promise to produce knives with sharpness, durability, and reusability approaching those of diamond, and for a fraction of the price. According to Scott Rader, assistant professor
  • Stability of Silicon Photodiodes for Laser Emission Measurements (.pdf)
    structure, imperfect. simple instrumentation for user monitoring and regulatory purposes. lead bonding to the junction, and imperfect die bonding of the silicon. These instruments must be capable of being accurately calibrated and. wafer to the metal header. If the photodiode is operated
  • Texture and Microstructure Investigation of Cu Damascene Interconnects (.pdf)
    } texture increases the resistance of electromigration failure and this failure can be. correlated with the frequency of the occurrence of CSL (coincidence site lattice) boundaries or. low or high diffusivity boundaries and the strength of {111} texture in aluminum thin films. However