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  • Cross Section Polisher Brochure
    such as; _Difficult-to-polish soft materials such as copper, aluminum, gold, solder, and polymer, _Difficult-to-cut hard materials such as ceramic and glass, and _Composite of these materials. The cross section prepared by the CP is suitable for EDS, WDS, Auger, and EBSD (Electron Back Scatter
  • MICRO: Surface Conditioning - Hakanson (March 2000)
    manufacturing, CMP is employed to reduce topography and planarize patterned layers, alumina (Al ) films, and films with various concentrations of nickel and iron. In semiconductor manufacturing, CMP is used to reduce topography and to polish tungsten, aluminum, copper, and silicon oxide layers. Apart from

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