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  • Machined part needing fully clean surfaces in complex recesses
    The end customer designed the 'Extruding. Head' as a casting. The casting became extremely difficult. to polish in the slotted areas. They tried mechanical. polishing, buffing, aluminum oxide blasting and honing. All these methods proved expensive and time consuming. Though the casting
  • Cross Section Polisher Brochure
    such as; _Difficult-to-polish soft materials such as copper, aluminum, gold, solder, and polymer, _Difficult-to-cut hard materials such as ceramic and glass, and _Composite of these materials. The cross section prepared by the CP is suitable for EDS, WDS, Auger, and EBSD (Electron Back Scatter
  • MICRO: Surface Conditioning - Hakanson (March 2000)
    manufacturing, CMP is employed to reduce topography and planarize patterned layers, alumina (Al ) films, and films with various concentrations of nickel and iron. In semiconductor manufacturing, CMP is used to reduce topography and to polish tungsten, aluminum, copper, and silicon oxide layers. Apart from

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