The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x - y CTE values make
RF-35A2 an attractive material for the surface mounting of chip carriers. Other benefits of
RF-35A2 include temperature stable Dk and Df, excellent peel strength, low moisture absortpion, low loss properties and ease of drilling. This material is used in
power amplifiers, filters/couplers, passive components, wireless antennas...
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