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Amplifier Substrate

 

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RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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  • DC to 85GHz TWA and Ka-band 4.9W Power Amplifier Using an Optical Lithography Based Low Cost PHEMT Process (.pdf)
    results for DC to 85GHz traveling wave amplifier (TWA) and 29-30.5GHz 4.9W power amplifier (PA) are also described as process capability verification. TWA shows 8dB of small-signal gain and 12dBm of output power up to 85GHz frequency. PA shows 20dB of small-signal gain and 36.9dBm of output power at 3dB
  • TA022: Benefits and Challenges in Decreasing GaAs through Substrate via Size and Die Thickness
    via sizes for 30-75 µm thick wafers were developed over the past several years using reactive ion etch (RIE) tools.1-10 This enabled through substrate ground vias to be located closer to the heat generating, active regions of power amplifier (PA) devices. Pamela Sullivan. Benefits and Challenges
  • Cooling Power Op Amps
    to a similar amplifier cooled with a passive heat sink. Utilizing a small DC fan to force air into the heat sink the PAD117 provides a. 0.5OC/Watt thermal resistance for the amplifier's substrate with a volume of. only 4.6 in3 and a weight of 4 oz. Aavid/Thermolloy has a passive heat sink. extrusion
  • MICRO: Product Technology News (October 2000)
    in an automated system. They can accommodate 8-in. wafers and 6-in.-diam masks. A single objective can be used with bright-field, dark-field, and differential interference contrast observation techniques. A digital fiber-optic amplifier comes in a remote control version that includes special
  • Cascading Application Information
    the substrate to header thermal resistance for all amplifiers using physical. math models. Thermal resistance (jc) is expressed as Trise divided by Total Power. Trise equals the DC power on the die multiplied by the amplifier's total thermal
  • Oscillator Circuits For RTD Temperature Sensors
    This application note shows how to design a temperature sensor oscillator circuit using Microchip's low-cost MCP6001 operational amplifier (op amp) and the MCP6541 comparator. Oscillator circuits can be used to provide an accurate temperature measurement with a Resistive Temperature Detector (RTD
  • Ultra Low-Noise High-Speed CMOS Linescan Sensor for Scientific and Industrial Applications
    This paper describes a 2048x1 linear image sensor implemented in a 0.35mm 4M1P CMOS process that uses a low fixed pattern noise capacitive transimpedance amplifier (LFPN CTIA) pixel architecture. The pixel also includes circuitry for reducing 1/f noise, correlated double sampling, electronic
  • Power Design Considerations For LED Applications
    DACOUT, load the serial input register of the DAC with the code in Figure 1. In order to have 4mA through the current loop for 0V DACOUT, we use an offset voltage reference of 2.5V. In Figure 2, A1 is connected as a voltage follower amplifier which drives a very high impedance MOSFET Q2 and its

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