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Description: be used for any RF function regardless of the pad/signal name. Both of the antenna switches are fabricated on the same substrate. The active path is selected using five positive voltage control lines: two control lines set the 5 GHz switch states and three control lines set the 2.5 GHz switch states
- Frequency Range: 1.00E8 to 6.00E9 Hz
- Isolation (Port to Port): 24 to 30 dB
- Actuator Type: Other
- Package Type: Surface Mount
Supplier: Hitachi Metals America, Ltd.
Description: From raw substrate opportunities to discrete components, all the way through to our Antenna Switch Modules and Front End Modules, Hitachi Metals is committed to this technology and use it in a wide variety of products. With LTCC components, you will realize the following benefits: Experience
- Metal / Alloy Types: Cast Steel (UNS J)
- Standards / Specifications: Specialty / Other
- Shape / Form: Profile / Structural Shape, Fabricated Parts / Shapes
- Applications: Wear Parts / Tooling
Supplier: Sheldahl - A Multek Brand
Description: Germanium Coated Polyimide Sheldahl’s family of germanium coated polyimide films are well suited for antenna cover applications due to the coating’s unique combination of radio frequency transparency and ability to bleed off static charges. This product may be ordered on a variety
- Type / Form: Specialty / Other
- Electrically Conductive: Yes
- Anti-static / ESD Control: Yes
- Material Type: Plastic
Network and Communication Chips - Tx Quad-Band / Rx Dual-Band Front-End Module for GSM / GPRS (824–915 MHz) (1710–1910 MHz) -- SKY77582
Description: of each PA block and the outputs to the two receive pads are connected to the antenna pad through an RF switch. The GaAs die, Switch die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of transmit
- Technology: GPRS, GSM
- Device Type: Other
- Supply Voltage: 3 V, 3.3 V, 3.6V
- IC Package Type: Other
Description: to the two receive pads are connected to the antenna pad through PHEMT RF switches and a diplexer. The CMOS die, PHEMT die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of transmit and receive modes
- Operating Frequency: 8.80E8 to 1.78E9 Hz
Description: at a high antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, V, and VIII. RF input and output ports are internally matched to 50 Ω to reduce the number of external components. Extremely low leakage current maximizes handset
- Amplifier Type: Power Amplifier
- Applications: Mobile / Wireless Systems
- Frequency Range: 8.24E8 to 1.98E9 Hz
- Minimum Gain: 27 dB
Supplier: Master Bond, Inc.
Description: because of its unique silver ceramic composition a very desirable high degree of dimensional stability is attained. Master Bond Polymer System EP77MHT-1 is widely used in the electronics industry with applications including bonding components to PC boards, antenna bonding, lead attachments, RF shielding
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer
- Industry: Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA)
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Supplier: Solid Signal
Description: The PC2415N provides users with a rugged, easy to install, high gain directional antenna for deploying 2.4 GHz point to point bridges, and can also be used as an access point antenna in long narrow coverage environments like a tunnel. More > ● UV stable housing ● One piece brass
Supplier: Protavic America, Inc.
Description: , and bonding microwave antenna assemblies for use in urban and military cellular communication stations.
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Supplier: Merrimac Industries, Inc.
Description: distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna. Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna feed network assemblies
- Coupler Type: Uni-Directional
- Package Type: Surface Mount Technology (SMT)
- Frequency Range: 1.70E9 to 2.00E9 Hz
- Insertion Loss: 0.3000 dB
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Featured Products for Antenna Substrate Top
API Technologies Corp - Spectrum Control
Motorized Potentiometer with Special Return
thermistors and resistive temperature detectors (RTDs). The Spectrum Control EMI Filters and Components Group produces discrete surface mount EMI filters, resin sealed and hermetically sealed EMI filters, EMI filtered arrays, EMI filtered connectors, ESD/EFT protected connectors, filtered data-com connectors, gaskets and shielding, patch antenna elements, single line filters, filtered terminal blocks, power entry modules, power line filters, military/aerospace multi-section filters... (read more)
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Conformal Antenna Array Design Using XFdtd
CPU. • License to employ a single GPU bundled for free. with XF7. – Licenses for additional GPUs available. • 1 AMD 2216: 7.2 Mcells/s. • 1 Intel Xeon 5660: 16.7 Mcells/s. • 8 Intel Xeon 5660: 92.0 Mcells/s. • 8 Tesla C2070: 3832.2 Mcells/s. Define Antenna: Patch Antenna Designer. Substrate. Height
Microstrip Gap Waveguide on Electronic Band Gap Substrate Example
InSite. XGtd. VariPose. Rotman Lens Designer. Consulting. Government Contracting. Pricing. Applications. EM Applications Overview. Antenna Placement Analysis. Antenna Design and Analysis. Biomedical Applications. EMI/EMC Testing. Integrated Antennas. Metamaterials/Special Materials. Microwave
RFID Battles the Elements
any new-ish technology, RFID has bugs to be worked out. Most have to do with immature hardware either the tags (comprised of a microchip, antenna and substrate on which they reside) or readers with which they communicate. Dead tags are just one reason RFID communication can break down
Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
ultrahigh-. the substrates were fabricated, a prototype antenna was made. frequency (UHF) band (∼300–500 MHz) on both a ﬂexible. on the magnetic composite by standard double-sided printed. magnetic composite substrate and a pure silicone substrate. circuit board processing techniques, which included
RFID Tag and COB Development Guide with Microchip's RFID Devices
and cost con-. be achieved with a few turns of wire or etched (or. straints. Tags must be tuned precisely to the reader’s. printed/stamped) spiral inductor on dielectric substrate. carrier frequency for long range applications. Since the. tag’s antenna circuit consists of a combination of L and. After
Modeling of SOI FET for RF Switch Applications
by. change of the box capacitance is bandwidth limited, the. the maximum voltage for reliable operation of a transistor. effective impedance looking into the substrate still appears. as well as the maximum voltage switch at the antenna. quite significant at high frequencies. The non-linearity of. port
Bonding Tape Systems for TPO Materials (.pdf)
, a double-coated tape with a tissue carrier or an unsupported. transfer tape might be required. Double-coated foam tapes are employed for special. applications such as mounting an automotive antenna base to the glass backlight or rear. window. Even the paper or film release liner requires careful
A 5 GHz 0.95 dB NF Highly Linear Cascode Floating-Body LNA in 180 nm Floating-Body LNA in 180 nm
switch and the. the antenna. The inductive matching elements are a combination. low-noise ampliﬁer (LNA) on the receive side, and the power. of bondwires and on-chip inductors, and the capacitive elements. ampliﬁer (PA) on the transmit side . In a typical radio re-. are implemented as on-chip MIM
More Information on: Antenna Substrate Top
Advanced Millimeter-wave Technologies: Antennas Packaging and Circuits Complete Document
The most critical point in terms of CTE mismatch is the gap between the chip and the Kovar frame that is bridged by the fused silica antenna substrate .
2012 Index IEEE Transactions on Antennas and Propagation Vol. 60
...5285 Niu, Z., see Chen, X., TAP Dec. 2012 6063-6064 Niu, Z., see Chen, X., TAP Feb. 2012 1186-1191 Njoku, C. C., Whittow, W. G., and Vardaxoglou, J. C., Simulation Methodology for Synthesis of Antenna Substrates With Microscale Inclusions; TAP...
Millimetre Wave Antennas for Gigabit Wireless Communications: A Practical Guide to Design and Analysis in a System Context
Two primary applications in this respect are large-scale antenna arrays with packaged ICs and/or switches within a multilayer antenna substrate , or perhaps vertically integrated LCP-based RF modules where switches and/or active devices may be bonded inside a multilayer LCP construction.
The relationship between the minimal ferromagnetic resonance frequency and the shape and quantity of the ferrite inserts in nonreciprocal passive devices
This article aims to analytically determine radio electric parameters of magneto-conductive thin films for a patch antenna substrate application.
Millimeter-wave and terahertz integrated circuit antennas
The infinite dielectric can be synthesized using a lens of the same dielectric constant attached to the antenna substrate , hence the name “substrate lens.�? .
Antenna Engineering Handbook, Fourth Edition > Low Profile Antenna Performance Enhancement Utilizing Engineered Electromagnetic Materials
To circumvent this difficulty, a reactive impedance surface (RIS), as proposed in Mosallaei and Sarabandi,29 can be used for the antenna substrate .
Antenna Engineering Handbook, Fourth Edition > Wideband Microstrip Antennas
Initially, it involved primarily the antenna substrate .
Convergence of Terahertz Sciences in Biomedical Systems
As decay time is influenced by the carrier recombination, short decay time enables to cover broadband THz region, for which a low-temperature grown GaAs or a radiation- damaged silicon-on-sapphire are used for the antenna substrate .