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Supplier: Indium Corporation
Description: Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire. Although there are four major processes
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Supplier: Indium Corporation
Description: Excellent choice for die-attach and can be used in reducing atmospheres such as 12% hydrogen. Alloy: 92.5Pb 5In 2.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 310ºC Solidus Melting Temperature: 300ºC Pb-Free: No
- Soldering Filler Alloys: Indium (In)
- Form / Shape: Solid Wire
- Alloy: Indium (In)
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Supplier: Materion Corporation
Description: eutectic die attach. Plated flanges are used for wide variety of applications, including: Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams). Substrates for discrete ringframes that are epoxied onto the flange
- Metal / Alloy Types: Aluminum / Aluminum Alloy (UNS A), Nickel / Nickel Alloy (UNS N)
- Light Alloy: Yes
- Shape / Form: Semi-finished Shape / Mill Stock, Plate
- Applications: Electronics / RF-Microwave
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Supplier: Epoxy Technology
Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Thermally Conductive
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Supplier: DEK
Description: manufacturers keen to reduce manufacturing costs embrace the benefits of employing cost-effective, advanced screen printing technology for processes as diverse as solder bumping and die attach. DEK precision screens and stencil are meticulously designed to meet the unique challenges of semiconductor
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Supplier: Epoxy Technology
Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in ciruit assembly applications. It is certified and lot
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: DEK
Description: patterns. VectorGuard® PumpPrint® Stencils cover an extensive range of applications ranging from SMT adhesive processes to silver epoxy die attach, high volume deposition of solder paste and extrusive reflow. Enabling surface mass imaging of any multiple combination of deposit heights even
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Featured Products for Attach Die Solder Top
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Indium Corporation
Gold Based Solder Alloy Advantages
are used for medical products, as well as for aerospace, defense, package sealing, optics, and specialty MEMS packaging. Gold-based alloys can be processed in a variety of soldering applications, including vacuum solder, die-attach, reflow, laser soldering, vapor phase reflow, and manual soldering. Indium Corporation offers gold-based alloys in a variety of forms, including solder paste, solder preforms, solder wire, and solder spheres. Visit Indium Corporation at IMAPS in San Diego Sept... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation -
Indium Corporation
Materials for LED Manufacturing
when compared to standard solders. Die-attach thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280 ° C, eutectic AuSn satisfies these demands. Sub-mount to Assembly Indium Corporation offers a variety of solders that will fulfill sub-mount to assembly needs. Indium offers lead-free and lead-containing solder pastes, bar solder, wave solder, and flux-cored wire. Indium Corporation provides Solder Fortification ® preforms, which are designed... (read more)
Browse Electrical and Electronic Resins Datasheets for Indium Corporation -
Mini-Systems, Inc. (MSI)
High-Reliability Thick Film Chip Resistor
Automated Electronic Assembly. Diamond saw die separation tightly controls the resistor's dimensional tolerances, thus improving pick and place assembly by reducing components misplacement and resets. Surface Mount Adhesion. The unique, (5) sided construction of the wrap around termination maximizes component to board solder adhesion in a way that minimizes component tombstoning. Electrical Performance. The fine nozzle, sand blasting method of abrasively trimming resistors results... (read more)
Browse Chip Resistors Datasheets for Mini-Systems, Inc. (MSI)
Conduct Research Top
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Wafer Backside Coating of Die Attach Adhesives
Traditionally, the most common types of die attach materials used in the semiconductor industry have been solder or adhesive. Both have been applied to the substrate, immediately before die attach. Recently, the benefits of applying the adhesive to the back of the silicon wafer have been recognised
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Soft Solder Die-Attach (.pdf)
Power semiconductor devices are ubiquitous in electronic equipment running over 10Watts. These power devices convert AC to DC, and vice versa; regulate voltage; switch high currents on. and off; and prevent voltage spikes from damaging sensitive electronic equipment.
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Solder Powder: IPC
. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. Die-Attach. Indium8.9 Series. Low Temp/High Temp. Lead-Free. Package-on-Package Paste. Tin-Lead. Solder Fortification(R
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Adding Solder to a NanoBond(R) Assembly
. Sputter Target Bonding. Reclaim and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. Die-Attach. Indium8.9 Series. Low Temp/High Temp. Lead-Free. Package-on-Package Paste
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Humidity and Solder Paste - Avoid Issues
and Recycle. Solder and Solder Dross Recycle Program. Solar Assembly Materials. Metallization Paste. SUNTABTM PV Ribbon. Liquid Tabbing Flux. Solders. Solder Paste and Powders. Die-Attach. Indium8.9 Series. Low Temp/High Temp. Lead-Free. Package-on-Package Paste. Tin-Lead. Solder Fortification(R). Wafer
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Wafer & Substrate Bumping with Solder Paste
. Die-Attach. Indium8.9 Series. Low Temp/High Temp. Lead-Free. Package-on-Package Paste. Tin-Lead. Solder Fortification(R). Wafer Bumping Paste. Gold-Based Solders. Solders. Bar Solder. Bismuth Solders. Gold Solders. Preforms. Ribbon and Foil. Solder Fortification(R). Spheres. Tape and Reel
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High Melting Lead-Free Mixed BiAgX Solder Paste System
, which. satisfies the softening temperature requirement for the high-. Figure 1. Wetting of Bi/11Ag (left) and Bi/10Ag/4Sn (right) on AgPd thick. temperature die-attach solders [4]. However, there are two major. film pad Al2O3 substrate. concerns: (1) poor wetting on many surface finishes, including
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Plastic Packaging and the Effects of Surface Mount Soldering Techniques
compatibility is important to control corrosion. intentionally heated. This direct heating of the reduced. of aluminum (especially in the presence of moisture). sized device package is at the heart of the problems. Most molding compounds and die attach epoxies. experienced with Surface Mount Technology (SMT
Engineering Web Search: Attach Die Solder Top
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Solder - Wikipedia, the free encyclopedia
Solder From Wikipedia, the free encyclopedia
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Indium Corporation Global Solder Supplier Electronics Assembly...
Die-Attach Wafer Bumping Paste Solder Fortification® Ball-Attach Die-Attach Flip-Chip Pb-Free Including High Temperature Pb-Free
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Die-attach solder paste and powder made by Indium Corporation
Die-Attach Wafer Bumping Paste Solder Fortification® Die-Attach Home » Products » Solder Paste and Powders » Die-Attach
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SOLDER BUMP FLIP CHIP BONDING FOR PIXEL DETECTOR HYBRIDIZATION...
SOLDER BUMP FLIP CHIP BONDING FOR PIXEL DETECTOR HYBRIDIZATION Jorma Salmi and Jaakko Salonen VTT Information Technology Microelectronics P.O. Box
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Material Data Sheet SM8
The lead contained in the die attach solder is exempted from the RoHS Directive 2002/95/EC as in clause 7 of the Annex.
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PACKAGED ELECTRONIC DEVICES HAVING DIE ATTACH REGIONS WITH...
substrate surface including a die attach region including at least one land pad thereon and a non-die mounting region and (ii) an IC die having a top
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Solder void reduction on solder die attach for SIP-LGA
Solder void reduction on solder die attach for SIP-LGA
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Investigations on Zn-Al-Ge alloys as high temperature die...
In this study, Zn-Al-Ge alloy solder wire was used for Si die attachment on Cu substrate in an automatic die attach machine.
