Products & Services

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  • Description: offers the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly

    • Location: North America, United States Only, Southwest US Only
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

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  • Description: Export Zone at NSEZ, Noida India 2 BGA Capable, Automated SMT Lines AOI (Testronics) BGA Rework Stations (APE) X-Ray Inspection (Shimatsu) Pb-Free, RoHS Capable> Full Backup Power Coverage Located 20 Miles from Int'l Airport SAP

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Location: North America, United States Only, Northeast US Only, South Asia Only
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied

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  • Description: committed to creating successful partnerships that support the unique needs of each and every customer. From individual thru-hole and surface mount (SMT) assemblies, to box build and chassis integration, to fully tested systems delivered to the end user, our range of services allows us to

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
    • Location: North America, United States Only, Northeast US Only
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied

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  • Supplier: Syscom Tech

    Description: Syscom Tech is a full turn-key electronic custom contract manufacturer that specializes in producing leaded and RoHS printed circuit boards through several independent SMT and Thru hole production lines utilizing the latest technology and quality methods.

    • Location: North America, United States Only, Northeast US Only
    • Manufacturing: Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

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  • Supplier: Vexos

    Description: in low cost countries to search out cost-effective alternate products STACI’s production facilities and those of its partners are well equipped, featuring advanced production equipment including: SMT equipment from Siemens, Sanyo, Juki, I.Pulse and Fuji

    • Location: North America, United States Only, Midwest US Only, Europe Only, East Asia / Pacific Only
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn

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  • Supplier: Tecnova

    Description: see how we can fulfill all of your production outsource needs. PCBs Through-hole (TH) and Surface-Mount (SMT) Mechanical & Electro-Mechanical Assembly Control Panels To ensure LPI meets the production needs of its customers, LPI has

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services, Other
    • Location: North America, United States Only, Midwest US Only
    • Manufacturing: Printed Circuit Board Assembly, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
    • Material Acquisition: Customer Supplied, Vendor Supplied

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  • Description: End-to-end Electronic Manufacturing Solutions WORLD electronics offers a complete line of assembly services. Our commitment to quality and service is second to no supplier. RoHS (Restriction of Hazardous Substances) SMT, Thru Hole, Mixed Technology

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Location: North America, United States Only, Northeast US Only
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied

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  • Description: J-STD-001 IPC-A-610 Class II, III IPC 620A FDA Registered ITAR Registered UL / CSA / TUV / CE / NEBS SMT and PTH (RoHS compliant)

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
    • Location: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Other
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Material Acquisition: Customer Supplied, Vendor Supplied

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  • Description: Precision Reflow Pin-In-Paste/Wave/Selective Solder Back-Add/Modification of PCBAs Conformal Coating Automated Optical Inspection In-Circuit/Functional Testing Parametric Testing Final Product Assembly and Test: High Velocity

    • Capabilities: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
    • Location: North America, United States Only, Southwest US Only

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  • Description: offers the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly

    • Capabilities: Total Manufacturing, Testing and Evaluation, Prototyping, Just-In-Time Capability
    • Industry Served: Aerospace / Military, Automotive, Commercial, Computer / Networking, Consumer Electronics / Appliances, Industrial Automation, Medical, Telecommunications
    • Location: North America, United States Only, Southwest US Only

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