Products/Services for Backgrinding Equipment
Honing, Lapping, and Super-finishing Machines - (127 companies)
Sanders and Sanding Machines - (291 companies)
Polishing and Buffing Machines - (310 companies)Polishers and buffing machines are used to impart a fine (low Ra) surface finish on the exterior of a part. To improve surface finish, they use use abrasive grain slurries or compounds on buffs, bobs, cloth naps, laps, very fine grit nonwovens, and coated abrasives. Search by Specification | Learn More
...blade, and the Roller Mill Central RCC was rubbing, fans will be blown into the grinding room, blowing powder machine to the analysis, conducted Wind election of less than fineness and charged back-grinding, qualified powder into the air, finished with the whirlwind of powder sets, and air separation...
Engineering Web Search: Backgrinding Equipment
Preparation of custom gate array silicon wafers to handle...
Keywords: wafer size reduction semiconductors existing equipment compatibility equipment change avoidance Tandem process steps custom gate array
Ultron Systems, Inc. -- Wafer Backgrinding Protective-Film...
Wafer Backgrinding Protective-Film Remover
Ultron Systems, Inc. -- Home Page Semiconductor, Welcome
Semiconductor Assembly Equipment & Processing Materials ASSEMBLY EQUIPMENT ASSEMBLY EQUIPMENT Wafer/Frame Film Mounters
Pac Tech - Packaging Technologies - Home
EQUIPMENT General Overview Solder Jetting & Rework Equipment Services Contact Form Press Releases/ News
Fully depleted CCD's Fabricated on High-Resistivity Silicon...
except ion implantation (3 commercial vendors in the Bay Area) q Equipment includes: q 1X lithography for large area CCD development (Intel donation)
PROCESS AND MEASUREMENT EQUIPMENT
PROCESS AND MEASUREMENT EQUIPMENT Lithography ? E-beam writing ? Zeiss LEO 1560 ? Step and Stamp Imprint Lithography ? Suss MicroTec NPS 300 ? i-line
Dicing hybrid, semiconductor and dicing MEMS wafers
Valley Design Equipment Valley Design: Germany
Optical polishing, lapping, dicing and optical components...
edge and optical angle polishing,wafer dicing and substrate dicing, backgrinding, flat lapping and machining of all hard materials including Ceramic