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Parts by Number for Bakelite Top

Part # Distributor Manufacturer Product Category Description
RM10 SUPPORT RIMLOCK BAKELITE National Microchip Not Provided Not Provided Not Provided
FLECTOR BAKELITE 6 National Microchip 3MM Not Provided Not Provided
810039 National Microchip LEEFUNG BAKELITE ELEC WORKS Not Provided Electronic Component
H1396 ASAP Semiconductor LEEFUNG BAKELITE ELEC WO Not Provided 3 day lead time
810038 ASAP Semiconductor LEEFUNG BAKELITE ELEC WO Not Provided Not Provided
PER DWG;H1396 ASAP Semiconductor LEEFUNG BAKELITE ELEC WO Not Provided BOBBIN COIL FORM W/O PIN
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Conduct Research Top

  • Polycarbonate Enclosures 101: A Guide for Specifiers
    in electrical enclosure applications is a relatively recent occurrence. Like so many products in the electrical industry, steel was the original material of choice. In the very early 1900's with the invention of Bakelite, the basic material for the FRP enclosure industry was introduced to the marketplace
  • Reference Guide: Resin Plates Characteristics
    Characteristics of Bakelite Plates. MISUMI's Bakelite Plates are products which can be used as insulating plates for switch boards, controllers, breakers and other parts. Paper base type is available in natural color and black, and a strong cloth type is also available. Characteristics of Epoxy
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    standard. Cirrus Logic receives $25 million to settle chip dispute Analog and mixed-signal IC supplier Cirrus Logic Inc. has announced receipt of a $25 million payment related to a settlement and release of all claims between Cirrus Logic, Fujitsu Ltd., Amkor Technology Inc. and Sumitomo Bakelite Co. Ltd
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    claims between Cirrus Logic, Fujitsu Ltd., Amkor Technology Inc. and Sumitomo Bakelite Co. Ltd. over the alleged failure of certain semiconductor chips sold by Cirrus Logic to Fujitsu. Japan's fab-tool book-to-bill jumps to 0.91 Japanese-based manufacturers of semiconductor equipment posted a book
  • Extrusion Processes
    ) and bakelite. plastics. Thermosets are typically poor extrusion candidates and will not. Features and Properties of Plastics. be discussed any further here. To understand how to optimally process plastics, it is essential to. understand some physical and chemical properties. 3. Plastics conduct heat
  • Plastics Consultancy Network - Gob,spew and snot
    languages spoken in parallel: chemists and designers use chemical or generic names while in the commercial departments and on the shop floor the trade name holds sway. Leo Baekeland was the first chemist to react phenol formaldehyde resins with any success. He registered the new material as "Bakelite
  • Phase Differentiation in Stainless Steel Oxide Scales Using ChI-Scan (.pdf)
    to study the. microstructure of the scales as well as possible phase distributions. Sample Preparation. Samples of 316L stainless steel were oxidized in a box furnace in laboratory air at 1200˚C for 4. hours. After oxidation they were mounted in edge retaining conductive bakelite,. metallographically
  • Metal Injection Molding of Co-28Cr-6Mo
    of. metallography, the samples were mounted in Bakelite and. samples sintered in a 50/50 hydrogen/nitrogen atmosphere. polished to a 0.3 µm surface finish. The Co-28Cr-6Mo samples. were etched with acetic glyceregia. Microstructures of the nitrogen-sintered, water-atomized sample. Carbon, oxygen, and nitrogen