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  • Ball Grid Array (BGA)
    Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential
  • Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
    challenges associated with QFP packages such as non-coplanar leads "lifting" after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly.
  • Variables of Pin Transfer (.pdf)
    Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array) pads to promote subsequent solder sphere attachment. Pins are dipped into a reservoir of material so
  • TPD12S015 PCB Layout Guidelines
    The TPD12S015 is a multifunction ESD protection device targeting portable HDMI (High Definition Multimedia Interface) applications. This application note focuses on layout guidelines for using the TPD12S015 DSBGA (Die Sized Ball Grid Array) 28 ball package mapped to HDMI C-type and D-type
  • Computer Power User Article - No Need To RAM Your Head Against A Wall
    an upgrade path for those who want to switch to DDR2 later. DDR2 also comes in an FBGA package with a ball-grid array, making it sturdier and less space-consuming
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board
  • Medical Device Link .
    , and mechanical characteristics. CSP uses the same type of interconnect attachment method to the PCBA as the popular yet physically larger ball grid array (BGA) packaging. Since 1993, the electronics packaging and assembly industry has seen BGA packaging evolve into a dependable option that offers increased
  • Medical Device Link .
    and, for some products, receive assurance of uninterrupted service. One package methodology that has been developed to miniaturize IC packages and improve their reliability in medical electronics is the micro ball-grid array (�BGA). This methodology provides a finished-component outline barely larger
  • Designed To Beat The Heat
    fiber combine to give R.H. Murphy Inc., Amherst, N.H., a tough, lightweight design for its Ball Grid Array integrated-circuit trays. PPA composite material is used by Lexmark Intl., Lexington, K.Y., in the fabrication of their new Optra-T printer fuser cover. Minnesota Rubber and QMR Plastics

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