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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
fido2100BGA128IR0 Innovasic Semiconductor Innovasic Communications Controller Managed, 3-port Industrial Ethernet Switch with support for Device Level Ring (DLR) protocol and IEEE-1588. Package style - 128 Ball Grid Array ( 10x10mm BGA), RoHS Compliant.
IDT72805LB25BG8 ASAP Semiconductor IDT Not Provided 121 BALL GRID ARRAY
K6T4008U2C-ZF10 UBGA National Microchip MICRO BALL GRID ARRAY Not Provided 48PIN

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  • Ball Grid Array (BGA)
    Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential
  • Variables of Pin Transfer (.pdf)
    Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array) pads to promote subsequent solder sphere attachment. Pins are dipped into a reservoir of material so
  • TPD12S015 PCB Layout Guidelines
    The TPD12S015 is a multifunction ESD protection device targeting portable HDMI (High Definition Multimedia Interface) applications. This application note focuses on layout guidelines for using the TPD12S015 DSBGA (Die Sized Ball Grid Array) 28 ball package mapped to HDMI C-type and D-type
  • Computer Power User Article - No Need To RAM Your Head Against A Wall
    an upgrade path for those who want to switch to DDR2 later. DDR2 also comes in an FBGA package with a ball-grid array, making it sturdier and less space-consuming
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    , as device complexities increase and I/O counts escalate, leaded SMT packages are becoming larger, with lead pitches shrinking as low as 0.3 mm. As a result, alternative packaging and assembly technologies are gaining in prominence, particularly ball-grid arrays, chip-scale packages, chip-on-board
  • Medical Device Link .
    , and mechanical characteristics. CSP uses the same type of interconnect attachment method to the PCBA as the popular yet physically larger ball grid array (BGA) packaging. Since 1993, the electronics packaging and assembly industry has seen BGA packaging evolve into a dependable option that offers increased
  • Medical Device Link .
    and, for some products, receive assurance of uninterrupted service. One package methodology that has been developed to miniaturize IC packages and improve their reliability in medical electronics is the micro ball-grid array (�BGA). This methodology provides a finished-component outline barely larger
  • Designed To Beat The Heat
    fiber combine to give R.H. Murphy Inc., Amherst, N.H., a tough, lightweight design for its Ball Grid Array integrated-circuit trays. PPA composite material is used by Lexmark Intl., Lexington, K.Y., in the fabrication of their new Optra-T printer fuser cover. Minnesota Rubber and QMR Plastics
  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad cratering in Printed Circuit Boards (PCBs). In general, lead-free solder joints are stiffer than
  • Socket-Adapter Systems: A Practical Test Alternative (.pdf)
    Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity

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