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  • Description: The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very

    • Fluxes & Cleaners: Soldering Flux / Rosin

  • Description: , this reference covers key topics including legislation, SMT, wave, rework, alloys, test, and reliability. It provides updates in areas where research is ongoing and addresses various topics that are relevant to lead-free soldering, including: Government and legislative activities Lead-free SMT assembly

  • Description: PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD

  • Description: Heat Sink; BGA; Package Size = 21 [.827] mm [in]; For Use With BGA Semiconductor Packages; Diameter = 50.80 mm;

    • Width: 2 inch
    • Height: 0.3799 inch
    • Material: Aluminum

  • Description: friendly process, has rapidly become the preferred surface treatment process in plastic package assembly, e.g. ball grid arrays (BGA). Plasma treatment for BGA is proven to be very effective in improving the overall package reliability through improvement in wire bond strength and mold compound adhesion

  • Description: Indium8.9HF Pb-Free Solder Paste is Halogen-Free per EN14582 test method. Eliminates hot and cold slump, high oxidation resistance, wets well to oxidized BGA and pad surface. Indium8.9HF has a high transfer efficiency through small apertures, has an excellent soldering performance under high

    • Lead Free: Yes
    • Form / Shape: Paste

  • Supplier: Nordson EFD

    Description: to work with any alloy and heating process, perfect for rework and BGA applications. No Clean (NC) Consists of rosin, solvent, and a small amount of activator. NC flux has low activity and is suited to easily solderable surfaces. NC residue is clear, hard, noncorrosive, non-conductive

    • Fluxes & Cleaners: Soldering Flux / Rosin

  • Description: manner Network Assembly support FloTHERM PACK now supports two-resistor and Delphi compact thermal models in the more advanced Network Assembly format in FLOTHERM Enhanced package families TO247 package is now supported, as are Delphi compact thermal models for SOT23 package. Flip-chip PBGA now

  • Description: High performance, stainless steel constructed in-line cleaning system for the electronics assembly industry. Aqueous cleaning sytem featuring sustained high solution and dryer heat capability, high volume "EDM" spray bar for great GPM concentration per square inch, and convection type dryer

  • Description: Profab Electronics offers turnkey or consigned contract manufacturing of printed circuit boards and electro-mechanical assemblies. Our services include surface mount placement (BGA's, ultra fine pitch, micro BGA's, and components as small as 0201), through hole, programming, testing, conformal

    • Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Southern US Only

  • Description: Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly Cal Quality maintains a highly skilled work force for the assembly of Through Hole or mixed technology boards, including both wave and hand soldering

    • Capabilities: Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Southwest US Only

  • Description: and 0201 package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning

    • Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Northeast US Only

  • Description: The Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for socketing 1mm BGA chips. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches

    • Center Spacing: Gold Plating
    • Centers Pitch: 800 µm
    • RoHS Compliant: Yes

  • Supplier: Valtronic

    Description: to 250 micron pitch Passive Discretes down to 01005 CMOS and wafer level camera assembly * Ball Grid Array (BGA), Chip Scale Packaging (CSP), Ceramic BGA, Ceramic Column BGA, Programmable Gate Array (PGA)

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling

  • Description: Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly Cal Quality maintains a highly skilled work force for the assembly of Through Hole or mixed technology boards, including both wave and hand soldering

    • Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
    • Material Acquisition: Customer Supplied, Vendor Supplied

  • Description: Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full

    • Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only

  • Description: The Caladena Group is a full EMS provider that includes electronic manufacturing & repair services including PCB/PWB assembly (both SMT & through hole), cable assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
    • Testing Services: Functional Testing, In-circuit Testing, X-Ray Testing, Other
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

  • Description: assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave

    • Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
    • Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
    • Location: North America, United States Only, Canada Only

  • Description: Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full

    • Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing /
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Mechanical Assembly, Molding, Plastic Fabrication, Sheet Metal Fabrication
    • Industry Served: Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Telecommunications
    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only

  • Description: requirements or high and low-mix products with efficiency. From design through assembly and test, quality is a top priority. Assembly and inspection follows the IPC-A-610 requirements for either leaded or RoHS compliant production. Capabilities Include: Complex double-sided, Ball Grid Array (BGA

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

  • Supplier: STACI

    Description: in offering its state-of-the-art EMS for a variety of industry-wide applications in the Automotive, Telecom, Computer and Consumer Electronics industries. STACI can provide customers with everything from basic Printed Circuit Board Assembly (PCBA) services up to complete turnkey box-build services

    • Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
    • Material Acquisition: Customer Supplied, Vendor Supplied

  • Description: Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal
    • Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes

  • Supplier: PACE

    Description: PACE's ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in semi-automated, cost effective solutions for area array package (BGA) rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success

    • Equipment Type: Soldering Equipment
    • Equipment Type: Other

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Parts by Number for BGA Assembly Top

Part # Distributor Manufacturer Product Category Description
BGA-3528 National Microchip Metcal Not Provided ASSEMBLY MICRO-OVEN 3500 SERIES

Conduct Research Top

  • Giga-snaP BGA SMT Adapters
    to fracture. socketing 1mm BGA chips. The product line. the substrate, which allows the solder ball to. consists of patent pending female sockets. flow up the pin and wick away - sometimes. with machined pins epoxy over-molded into. on the initial solder attachment. an assembly that matches a particular
  • GHz BGA Socket User Manual
    SOCKET USER MANUAL. Table of Contents. Selecting a BGA socket. 3. Socket Mechanics. 3. PCB Requirements. 4. Backing Plate. 5. BGA Socket Assembly. 5. MLF (QFN) Socket Assembly: 6. Torque Driver. 7. Vacuum Pen. 7. Elastomer Cleaning Procedure. 8. Surface Mount (SM) Adaptor. 10. Thru Hole (TH
  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad cratering in Printed Circuit Boards (PCBs). In general, lead-free solder joints are stiffer than
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    . 20 – Global SMT & Packaging - April 2008. www.globalsmt.net. Thermal profiling optimizes printed circuit board assembly. the volatiles evaporate, voids can form. inside the solder balls (in extreme cases a. ‘blowout’ on the ball could occur). BGA. rework, an elaborate and time-consuming. task
  • Adding Solder to a NanoBond (R) Assembly
    . Spanish. French. Korean. Chinese (Simplified). Chinese (Traditional). Categories. Alloys Solder. Antimony Solder. AuSn. B2B Marcom. Ball Attach. Bar Flux. Bar Solder. Bar Wave. BGA. BGA Process. Bismuth. Bismuth Alloys. Bismuth Tin Alloy. Bonding Ribbon. BtoB Marcom. Burn In. Bus Ribbon. Chip Attach
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    manufacturing yield. Second, they must develop a manufacturing procedure that can sustain the overall quality of BGA assemblies across an extended period of time. And lastly, they must characterize and qualify the BGA assembly process for long-term reliability. Developing the capacity to produce high-quality
  • Spring Pin Socket User Manual
    SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
  • Socket-Adapter Systems: A Practical Test Alternative (.pdf)
    . Reprinted from the August/September 2006 edition of ADVANCED PACKAGING. Copyright 2006 by PennWell Corporation. S O C K E T S. the device. Soldered to a lead-free BGA. adapter, the device is converted from. SMT to thru-hole; the device/adapter. assembly can then be plugged into the. board-mounted

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