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Description: DESCRIPTION "Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere" was presented at the 2012 APEX EXPO Technical Conference by Dr. Ning-Cheng Lee, V.P. of Technology at Indium Corporation. The author shows that adding small amounts of titanium to the solder balls of BGA components
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Supplier: Ironwood Electronics, Inc.
Description: The Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for socketing 1mm BGA chips. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches
- Package Type: BGA, Other
- Product Type: Pin Probes
- RoHS Compliant: Yes
- Mounting: SMT
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Description: This specification defines a qualification test sequence for production ball grid array (BGA) socket assemblies.
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Supplier: WORLD electronics
Description: Include: 0402 and 0201 package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
- Location: North America, United States Only, Northeast US Only
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Supplier: IMET Corporation
Description: density & fine pitch - Components as small as 0201 - BGA (down to 0.3mm pitch) - AOI (Automatic Optical Inspection) - X-ray - Test Cable Assembly - Crimp, Insulation displacement - BNC, Coax, Twinax, Triax - D-sub, HD D-sub Box Builds Foreign Sourcing Available
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation
- Location: North America, United States Only, Northeast US Only
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Supplier: Profab Electronics, Inc.
Description: Profab Electronics offers turnkey or consigned contract manufacturing of printed circuit boards and electro-mechanical assemblies. Our services include surface mount placement (BGA's, ultra fine pitch, micro BGA's, and components as small as 0201), through hole, programming, testing, conformal
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
- Location: North America, United States Only, Southern US Only
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Supplier: Entech Electronics Inc.
Description: Hole Assembly Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065
- Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
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Description: Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array
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Supplier: Indium Corporation
Description: The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very
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Featured Products for BGA Assembly Top
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Advanced Manufacturing Service, Inc. (AMS)
Printed Circuit Board Assemblies
Advanced Manufacturing Service specializes in high mix low to medium volume manufacturing of Printed Circuit Board Assemblies. Printed Circuit Board Assemblies Features: Quick-Turn Prototype to Full Production PCB Assembly. SMT Assembly from 0402 through BGA and Fine Pitch. PCB Thru-Hole Component Assembly. RoHS and Non-RoHS Assembly. No Clean Assembly Process. Functional Testing and Burn-In. Workmanship to IPC-A-610D Class 2 (read more)
Browse Electronic Manufacturing Services (EMS) Datasheets for Advanced Manufacturing Service, Inc. (AMS) -
ABX Engineering, Inc.
Full Service Electronic Contract Manufacturing
. Depot Repair. Order Fulfillment. BGA Assembly and X-Ray Rework. RoHS (Lead-free) Manufacturing since 2000. ISO-9001-2008. ITAR. At ABX our size, experience, expert staff and state of the art equipment, enable us to respond to unique customer demands with flexibility, speed and accuracy at competitive pricing. The quality of our services and products we produce has earned us a valued name and we pride ourselves as a leader in Full Turn Key Electronics Manufacturing Services. We are commited... (read more)
Browse Contract Manufacturing Services Datasheets for ABX Engineering, Inc. -
KimchuK, Inc.
Panel Wiring & Military Cable Production
to the diversity of production, KIMCHUK maintains a large cable inventory that supports most projects giving our customers a cost effective advantage. Manufacturing & Procurement Services. Consignment & Turnkey. Complete Systems Assembly. Mechanical Assembly. Printed Circuit Board Assembly. Fully Automatic. Hand Insertion. Surface Mounted Device Manufacturing. Ball Grid Array (BGA), CSBGA, MicroBGA, NanoBGA with underfill, QFN, LCC X-Ray, BGA X-Ray, BGA Rework. Wiring and Cabling. 100% Automatic... (read more)
Browse Cable Assembly Services Datasheets for KimchuK, Inc. -
KimchuK, Inc.
Is Your Product Dependable?
point-to-point to complete system or functional testing. Due to the diversity of production, KIMCHUK maintains a large cable inventory that supports most projects giving our customers a cost effective advantage. Manufacturing & Procurement Services. Consignment & Turnkey. Complete Systems Assembly. Mechanical Assembly. Printed Circuit Board Assembly. Fully Automatic. Hand Insertion. Surface Mounted Device Manufacturing. Ball Grid Array (BGA), CSBGA, MicroBGA, NanoBGA with underfill, QFN... (read more)
Browse Electrical and Electromechanical Assembly Services Datasheets for KimchuK, Inc. -
ABX Engineering, Inc.
ABX Expands Production to 75,000 square feet
earned us a valued name. We pride ourselves as a leader in ISO 9001-2000 full turn key electronics manufacturing. Services include, but are not limited to. PTH and SMT High Mix PCB Assemblies. Box Build Assemblies. Cable/Harness Assemblies. Depot Repair. Order Fulfillment. BGA Assembly and X-Ray Rework. RoHS (Lead-free) Manufacturing since 2000. ISO-9001-2008. ITAR. At ABX our size, experience, expert staff and state of the art equipment, enable us to respond to unique customer demands... (read more)
Browse Electronic Manufacturing Services (EMS) Datasheets for ABX Engineering, Inc. -
All Shore Industries
Secure Low Cost Offshore Manufacturing
. Mechanical design. Test program and tester development. POS packaging development (clamshell, color cards, instruction manual, installation hardware, etc). Our manufacturing capabilities include: PCB assembly - thru-hole, SMT, BGA, mBGA and COB. Testing and burn-in. Plastic and metal part fabrication and production. Total turnkey assembly. Full product build. Total Quality Management. Our customers can rely on a premium level of service for every project, whether we are conceptualizing... (read more)
Browse Electrical and Electromechanical Assembly Services Datasheets for All Shore Industries
Conduct Research Top
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Giga-snaP BGA SMT Adapters
to fracture. socketing 1mm BGA chips. The product line. the substrate, which allows the solder ball to. consists of patent pending female sockets. flow up the pin and wick away - sometimes. with machined pins epoxy over-molded into. on the initial solder attachment. an assembly that matches a particular
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GHz BGA Socket User Manual
SOCKET USER MANUAL. Table of Contents. Selecting a BGA socket. 3. Socket Mechanics. 3. PCB Requirements. 4. Backing Plate. 5. BGA Socket Assembly. 5. MLF (QFN) Socket Assembly: 6. Torque Driver. 7. Vacuum Pen. 7. Elastomer Cleaning Procedure. 8. Surface Mount (SM) Adaptor. 10. Thru Hole (TH
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Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad cratering in Printed Circuit Boards (PCBs). In general, lead-free solder joints are stiffer than
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Thermal Profiling Optimizes Printed Circuit Board Assembly
. 20 Global SMT & Packaging - April 2008. www.globalsmt.net. Thermal profiling optimizes printed circuit board assembly. the volatiles evaporate, voids can form. inside the solder balls (in extreme cases a. `blowout' on the ball could occur). BGA. rework, an elaborate and time-consuming. task
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Adding Solder to a NanoBond(R) Assembly
. Spanish. French. Korean. Chinese (Simplified). Chinese (Traditional). Categories. Alloys Solder. Antimony Solder. AuSn. B2B Marcom. Ball Attach. Bar Flux. Bar Solder. Bar Wave. BGA. BGA Process. Bismuth. Bismuth Alloys. Bismuth Tin Alloy. Bonding Ribbon. BtoB Marcom. Burn In. Bus Ribbon. Chip Attach
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
expensive. Reprinted from the August/September 2006 edition of ADVANCED PACKAGING. Copyright 2006 by PennWell Corporation. S O C K E T S. the device. Soldered to a lead-free BGA. adapter, the device is converted from. SMT to thru-hole; the device/adapter. assembly can then be plugged
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PCB Design for Manufacturability
. 3.11 Reflow Pads for BGA 18. SECTION 4: CREATING CAD PARTS. 4.1. Component Outlines and Reference Designators. 19. SECTION 5: COMPONENT PLACEMENT AND ORIENTATION. 5.1. General Engineering Requirements. 20. 5.2. General Placement Guidelines. 21. 5.3. Fiducials. 22. 5.4. Component Spacing. 23. 5.5
Engineering Web Search: BGA Assembly Top
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RE: BGA Assembly
[Date Prev[Date Next[Thread Prev[Thread Next[Date Index[Thread Index RE: BGA Assembly To: pci-sig@znyx.com
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RE: BGA Assembly
RE: BGA Assembly To: <pci-sig@znyx.com> Subject: RE: BGA Assembly From: "John Haddy" <john.haddy@radiata.com>
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Product Change Notification PCN97002
PCN97002 Additional Product Assembly Qualification of A.S.E. Taiwan _______________ Subject: Additional Product Assembly Qualification of A.S.E.
- BGA Assembly | High Accuracy BGA Placement | Saline Lectronics
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PCB Assembly and Design - PCB Fabrication - NexLogic
Via in Pads and BGA PCB Assembly Rework PCB Design for Assembly PCB Design for Assembly Checklist
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IC Packaging | Custom IC Assembly Services | Air Cavity QFN |...
BGA Substrates Custom Configurations IC Assembly BGA Sphere Attach Advanced Assembly Chip on Board / Chip on Flex
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TS-DEM Assembly service
Assembly and cabling OVERVIEW The assembly of components (SMD and BGA, fineline BGA downto 0.8 mm pitch resistors and capacitors downto 0201 size
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SMT & Surface Mount Technology Electronics Manufacturing
Hello Again...SMTNET....are there rules to determine which small BGA devices are Dip Fluxed or Solder pasted?
