Products & Services

See also: Categories | Featured Products | Technical Articles | More Information
  • Description: IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC

  • Supplier: Alpha

    Description: This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux. The rheology of the flux allows it to remain on the dipped spheres during post flux placement of sub-assemblies, while allowing

    • Lead Free: Yes
    • Form / Shape: Paste
    • Approvals / Conformance: Other

  • Description: The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very

    • Fluxes & Cleaners: Soldering Flux / Rosin
    • Form / Shape: Paste

  • Description: DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

  • Description: friendly process, has rapidly become the preferred surface treatment process in plastic package assembly, e.g. ball grid arrays (BGA). Plasma treatment for BGA is proven to be very effective in improving the overall package reliability through improvement in wire bond strength and mold compound adhesion

  • Description: Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering

    • Fluxes & Cleaners: Soldering Flux / Rosin
    • Form / Shape: Paste

  • Description: spreader lid Filling various gaps between heat-generating devices to heat sinks and housings Devices requiring low assembly pressure BGA, PGA, PPGA Liqui-Form 2000 Downloads RoHS Certificate Halogen Testing Report SDS 简体中文 SDS English EU SDS Deutsch SDS Tagalog

    • Compound Type: Electrically Conductive, Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

  • Description: (Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows very fast, fully cures in the length of one reflow oven and provides a void-free underfill area.

    • Use: Gap Filling Compound
    • Industry: Electronics
    • Coeff. of Thermal Expansion (CTE): 34 µm/m-C
    • Viscosity: 6000 cps

  • Description: Indium8.9HF Pb-Free Solder Paste is Halogen-Free per EN14582 test method. Eliminates hot and cold slump, high oxidation resistance, wets well to oxidized BGA and pad surface. Indium8.9HF has a high transfer efficiency through small apertures, has an excellent soldering performance under high

    • Lead Free: Yes
    • Form / Shape: Paste

  • Description: Lead-free wave soldering Lead-free rework Lead-free alloys for BGA/CSP components Lead-free mechanical reliability Tin whiskers Lead-free reliability in aerospace and military environments Lead-free reliability in automotive environments Testability of lead-free printed circuit assemblies Emphasizing

  • Description: conductive acrylic adhesive More cost-effective than heat-cure adhesive, screw mounting or clip mounting Applications Mount LED assembly to troffer housing Mount LED assembly to heat sink Mount heat spreader onto power converter PCB or onto motor control PCB Mount heat sink to BGA graphic processor

    • Industry: Electronics

  • Supplier: Nordson EFD

    Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides

    • Fluxes & Cleaners: Soldering Flux / Rosin
    • Form / Shape: Paste

  • Description: manner Network Assembly support FloTHERM PACK now supports two-resistor and Delphi compact thermal models in the more advanced Network Assembly format in FLOTHERM Enhanced package families TO247 package is now supported, as are Delphi compact thermal models for SOT23 package. Flip-chip PBGA now

  • Description: A single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an underfill for flip chip mounted ICs, BGAs, and sensor device packaging. Also available in a frozen syringe.

    • Substrate / Material Compatibility: Metal, Plastic
    • Industry: Electronics, Semiconductors / IC Packaging
    • Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
    • Features: Electrical Insulating / Dielectric, Filled, Thermal / Heat Conductive

  • Description: Product Description: EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Filler Material: Unfilled
    • Resins & Compounds: Liquid

  • Description: DESCRIPTION "Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere" was presented at the 2012 APEX EXPO Technical Conference by Dr. Ning-Cheng Lee, V.P. of Technology at Indium Corporation. The author shows that adding small amounts of titanium to the solder balls of BGA components

  • Description: Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array

  • Description: and 0201 package types Chip Scale Package (CSP) BGA and uBGA double-sided/mirrored BGA assembly COB and MCM Direct and multiple chip attach High pin count press fit Gold and aluminum wedge-bonding Wire-bonding Flex Circuits Wave solder Selective soldering Aqueous cleaning

    • Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Ceramic Manufacturing, Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
    • Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
    • Location: North America, United States Only, Northeast US Only

  • Supplier: Valtronic

    Description: to 250 micron pitch Passive Discretes down to 01005 CMOS and wafer level camera assembly * Ball Grid Array (BGA), Chip Scale Packaging (CSP), Ceramic BGA, Ceramic Column BGA, Programmable Gate Array (PGA)

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling

  • Description: Profab Electronics offers turnkey or consigned contract manufacturing of printed circuit boards and electro-mechanical assemblies. Our services include surface mount placement (BGA's, ultra fine pitch, micro BGA's, and components as small as 0201), through hole, programming, testing, conformal

    • Services: Certification / Qualification, Design / Development, Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
    • Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech,
    • Location: North America, United States Only, Southern US Only

  • Description: assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave

    • Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
    • Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
    • Location: North America, United States Only, Canada Only

  • Description: The Caladena Group is a full EMS provider that includes electronic manufacturing & repair services including PCB/PWB assembly (both SMT & through hole), cable assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
    • Testing Services: Functional Testing, In-circuit Testing, X-Ray Testing, Other
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

  • Description: density & fine pitch - Components as small as 0201 - BGA (down to 0.3mm pitch) - AOI (Automatic Optical Inspection) - X-ray - Test Cable Assembly - Crimp, Insulation displacement - BNC, Coax, Twinax, Triax - D-sub, HD D-sub Box Builds Foreign Sourcing Available

    • Capabilities: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible  Boards, SMT Components, THT Components
    • Location: North America, United States Only, Northeast US Only

  • Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and Production. Quick

    • Cable Types / Application: Audio / Visual, Coaxial / RF, Computer / Networking, Consumer Electronics / Appliances, Fiber Optic, Grounding Cable, Medical, Power Cable, Robotics, Ribbon Cable
    • Supplier Capability: Design Assistance, CAD Documentation / Drawings, Prototype Quantities, Production Quantities, Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Northeast US Only

  • Description: Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly Cal Quality maintains a highly skilled work force for the assembly of Through Hole or mixed technology boards, including both wave and hand soldering

    • Capabilities: Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Southwest US Only

  • Description: Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly Cal Quality maintains a highly skilled work force for the assembly of Through Hole or mixed technology boards, including both wave and hand soldering

    • Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
    • Material Acquisition: Customer Supplied, Vendor Supplied

  • Description: Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full

    • Capabilities: Design Assistance, Part Procurement, Prototype / Low Production Quantities, Large Production Quantities, Subsystem Assembly, Full System Assembly (Box Build), Testing and Evaluation, Just-In-Time Capability
    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only

  • Description: Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full

    • Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing /
    • Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Mechanical Assembly, Molding, Plastic Fabrication, Sheet Metal Fabrication
    • Industry Served: Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Telecommunications
    • Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only

  • Supplier: Vexos

    Description: in offering its state-of-the-art EMS for a variety of industry-wide applications in the Automotive, Telecom, Computer and Consumer Electronics industries. STACI can provide customers with everything from basic Printed Circuit Board Assembly (PCBA) services up to complete turnkey box-build services

    • Testing Services: Automated Optical Inspection, Environmental Testing, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn
    • Material Acquisition: Customer Supplied, Vendor Supplied

  • Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and Production. Quick

    • Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
    • PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible  Boards, SMT Components, THT Components
    • Location: North America, United States Only, Northeast US Only

  • Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and Production. Quick

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
    • Testing Services: Functional Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling

  • Description: requirements or high and low-mix products with efficiency. From design through assembly and test, quality is a top priority. Assembly and inspection follows the IPC-A-610 requirements for either leaded or RoHS compliant production. Capabilities Include: Complex double-sided, Ball Grid Array (BGA

    • Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
    • Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
    • Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
    • Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling

  • Description: and integration of the technologies of individual products 1) HDI : High Density Interconnect 2) BGA : Ball Grid Array 3) FCBGA : Flip Chip BGA Quality Has durability against repetitive flexing Folder Type: 100,000 times Slider Type: 200,000 times Ideal assembly process with high reliability Able

Page: 1 2 Next

Conduct Research Top

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire