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    influences on the amount of voiding one can expect in an assembly. This paper will discuss how print volume (stencil design), peak reflow temperature, paste flux chemistry and alloy selection affect the level of voiding to be expected when BGA/CSP packages are assembled in a lead free process.
  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad cratering in Printed Circuit Boards (PCBs). In general, lead-free solder joints are stiffer than
  • Analysis via SEM / EDS (.pdf)
    The use of Scanning Electron Microscopy/Energy Dispersive X-Ray Spectroscopy (SEM/EDS) in the analysis of failure related issues of printed circuit boards (PCBs), assemblies (PCAs), and electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC
  • Analysis via FTIR (.pdf)
    Fourier Transform Infrared Spectroscopy (FTIR) is a standard technique used in the identification of contaminating materials on the surface of printed circuit boards (PCBs) and around the leads of electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    . For a complete listing, log onto SEMI's Web site, Flip Chip, BGA, and Packaging I Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo
  • Medical Device Link .
    , and mechanical characteristics. CSP uses the same type of interconnect attachment method to the PCBA as the popular yet physically larger ball grid array (BGA) packaging. Since 1993, the electronics packaging and assembly industry has seen BGA packaging evolve into a dependable option that offers increased
  • iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry
    cost of alloys containing significant amounts of silver. Concerns regarding the poor drop/shock. performance of near-eutectic SAC alloys led to the development of low Ag alloys to improve the mechanical strength of BGA and CSP solder joints. Most recently, investigations into new solder paste alloys
  • STACI Corporation has engaged with a world-class manufacturer and distributor of wheelchair accessible vans and wheelchair lift products that give you the freedom to experience.
    as well as emerging technology, from through-hole with wave solder to tight package BGA and Micro BGA SMT placements. Result: The company was able to buy a turnkey solution that included sheet metal, PCBA, labels, IC software loading, testing and certification. They were able to buy in small volume

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