Products/Services for BGA Interposer
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Interposers - (11 companies)...by the interposer supplier. Typically, the contact elements for interposers are rated for a compression force of approximately 40 grams (g) per contact. As a rule, the compression force required is a function of the planar variation in the mating surface... Learn More -
Electronic and IC Packaging Services - (121 companies)Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices. Search by Specification | Learn More -
Electronic Manufacturing Services (EMS) - (1608 companies)Electronic manufacturing services (EMS) are companies that design, assemble, produce, and test electronic components and PCB assemblies for original equipment manufacturers (OEMs). Search by Specification | Learn More -
IC Sockets and Headers - (197 companies)...grid array (BGA), chip scale package (CSP), single in-line package (SIP), dual in-line package (DIP), plastic leaded chip carrier (PLCC), small outline integrated circuit (SOIC), and transistor outline (TO). BGA places output pins in a solder ball... Search by Specification | Learn More -
No Image AvailableIC Probing Adapters and Analysis Adapters - (11 companies)IC probing adapaters and analysis adapters are interconnect devices used for in-circuit testing of integrated circuit (IC) packages. The adapter provides connections for test equipment and logic analyzers. Learn More
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IC Package Converters and Adapters - (44 companies)...to consider when selecting IC package converters and adapters. Choices include: Ball-grid array (BGA), land-grid array (LGA), pin grid array (PGA), and interstitial package grid array (IPGA). Single in-line package (SIP), dual in-line package (DIP... Search by Specification | Learn More
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IC Interconnect Components - (382 companies)IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn More
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Printed Circuit Board (PCB) Fabrication Services - (1027 companies)Printed circuit board (PCB) fabrication services design and fabricate circuit boards. They differ from electronic manufacturing services, which populate and assemble boards. Search by Specification | Learn More
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Brazing and Soldering Services - (209 companies)Brazing and soldering services use welding techniques and related processes to fabricate parts and join components. Search by Specification | Learn More
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Engineering Design Services - (5778 companies)Engineering design firms provide total design for new components, products, and equipment. Services include load analysis, part and material specification, manufacturing drawings, product manuals, and often manufacturing support and/or certification documentation. Search by Specification | Learn More
Product News for BGA Interposer
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Advanced Interconnections Corp.
Interposers: Package Conversion & Lead-free Issues New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. More information... Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom... (read more)Browse Interposers Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
BGA Socket Adapter System An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced ® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. More Information... Available from 0.50mm to 1.27mm pitch. Protects valuable PC boards and subjects device to lower thermal stress. Same footprint as BGA device. Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, and tape and reel... (read more)Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Flip-Top™ BGA Socket Advanced Interconnections' Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. More information... Features: The compact Flip-Top ™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection... (read more)Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Mouser Electronics, Inc.
ATS Freescale BGA Heatsinks from MOUSER Advanced Thermal Solutions (ATS) Freescale BGA heatsinks are designed for Freescale flip-chip ICs.ATS Freescale BGA heatsinks offer MaxiGRIP ™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heatsink comes preassembled with high performance phase changing thermal interface material for ease of installation. SUBSCRIPTION CENTER - Mouser's Newest Products and Application News. STAY CONNECTED. Subscribe NOW. See the Newest Products... (read more) -
Advanced Interconnections Corp.
Flip-Top BGA Sockets Ease Device Test The compact Flip-Top ™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to... (read more)Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp. -
Coto Technology
Coto Introduces Ground-Breaking BGA Relay Coto Technology has introduced the first four independent channel, form-A, planar BGA Reed Relay. The B41 series is the latest offering in Coto's growing line of RF capable, reed relay products. Unlike Coto's B10, B40 and other high-performance RF reed relay products, no slot or hole in the PC board is required to mount the device - a feature which simplifies the design of multi-layer boards. Coto's new, patented technology also allows for shorter RF paths in a controlled 50 ohm environment... (read more)Browse Electromechanical Relays Datasheets for Coto Technology -
Advanced Interconnections Corp.
Device to Adapter Mounting and BGA Rework Service Data Sheet. About Advanced Interconnections: Advanced Interconnections Corp. is an ISO 9001 Certified designer and manufacturer of innovative interconnect solutions with technologically advanced features. Patented designs offer high reliability in development, test, validation, and production level device-to-board and board-to-board applications. Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package... (read more)Browse IC Package Converters and Adapters Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Flip-Top BGA Test Socket for 0.50mm Pitch Devices The Mod5 Series Flip-Top ™ BGA Socket provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. More Information... Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) with larger sizes available upon request. Precision machined spring probes offer high bandwidth with very low... (read more)Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Data Device Corporation (DDC)
Mil-Temp MIL-STD-1553 BGA’s Minimize SWaP! Mil-Temp Micro-ACE ® TE and Total-ACE ® MIL-STD-1553 BGA ’s Minimize Size, Weight, and Power (SWaP)!. Bohemia, New York (November 2012) Data Device Corporation (DDC) introduces Mil-Temp versions of its field-proven and highly efficient Micro-ACE ® TE and Total-ACE ® MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations... (read more)Browse Data Acquisition Datasheets for Data Device Corporation (DDC) -
Advanced Interconnections Corp.
Surface Mount Sockets An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced ® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. More Information... Available from 0.50mm to 1.27mm pitch. Protects valuable PC boards and subjects device to lower thermal stress. Same footprint as BGA device. Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, and tape and reel... (read more)Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp.
Engineering Web Search: BGA Interposer
Agilent | Agilent Technologies Introduces Industry-First, Most...
16962A logic analysis module, a complete probing portfolio for DDR3 BGA and DIMM, and the first DDR3 compliance and performance software environment.
See Agilent Technologies, Inc. / Electronic Measurement Group Information
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer
Soldering Lead-Free Globtop BGA to Pin-Socket Interposer Soldering Lead-Free Globtop BGA to Pin-Socket Interposer
See SMTnet, Inc. Information
Development of a BGA package based on Si interposer with...
Development of a BGA package based on Si interposer with through silicon via
A Silicon interposer BGA package with Cu-filled TSV and...
A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect
Haswell (microarchitecture) - Wikipedia, the free encyclopedia
Xilinx UG112 Device Package User Guide
See Xilinx, Inc. Information
Processors — Package Types for Mobile Intel®...
Micro-PGA2 Package The micro-PGA2 consists of a BGA package mounted to an interposer with small pins.
See Intel Corporation Information
Processors — Intel? Processor Identification utilities
See Intel Corporation Information
Hirose IT3 Connectors : Mouser.com
Hirose High Speed (10Gbps) Board to Board Connectors BGA Mezzanine Connectors, IT3 Series
See Mouser Electronics, Inc. Profile & Catalog
173451053 Board to Board / Mezzanine Connectors | Mouser
See Mouser Electronics, Inc. Profile & Catalog
